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1.

図書
図書
1. VLSI : systems on a chip : IFIP TC10 WG10.5 Tenth International Conference on Very Large Scale Integration (VLSI'99), December 1-4, 1999, Lisboa, Portugal
edited by Luis Miguel Silveira, Srinivas Devadas, Ricardo Reis
出版情報: Boston : Kluwer Academic Publishers, c2000  xviii, 675 p. ; 25 cm
シリーズ名: The International Federation for Information Processing ; 34
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2.

図書
図書
2. In-line characterization, yield, reliability, and failure analysis in microelectronic manufacturing II : 31 May-1 June 2001, Edinburgh, UK
Gudrun Kissinger, Larg H. Weiland, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering ; cosponsored by Scottish Enterprise (UK) ; cooperating organizations EOS--European Optical Society, IEE--the Institution of Electrical Engineers (UK)
出版情報: Bellingham, Wash. : SPIE, c2001  ix, 242 p. ; 28 cm
シリーズ名: Proceedings / SPIE -- the International Society for Optical Engineering ; v. 4406
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3.

図書
図書
3. Proceedings, fourth International Symposium on Quality Electronic Design, 24-26 March 2003, San Jose, California
sponsored by IEEE Electron Device Society, IEEE Components, Packaging & Manufacturing Technology Society, Association for Computing Machinery, ACM Special Interest Group on Design Automation
出版情報: Los Alamitos, Calif. : IEEE Computer Society, c2003  xxi, 457 p. ; 28 cm
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4.

図書
図書
4. Proceedings, IEEE International SOC Conference : September 25-28, 2005, Hilton Washington Dulles Airport, Herndon, VA
editors, Dong Ha ... [et al.]
出版情報: Piscataway, N. J. : IEEE, c2004  324 p. ; 28 cm
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5.

図書
図書
5. DFT 2005 : 20th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems : 3-5 October, 2005, Monterey, California, USA
edited by Robert Aitken ... [et al.] ; sponsored by the IEEE Computer Society Test Technology Technical Council (TTTC), the IEEE Computer Society Technical Committee on Fault-Tolerant Computing(TCFTC)
出版情報: Los Alamitos, Calif. : IEEE Computer Society, c2005  xii, 602 p. ; 23 cm
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6.

図書
図書
6. Introduction to microelectronic fabrication. 2nd ed
by Richard C. Jaeger
出版情報: Upper Saddle River, NJ : Prentice Hall, c2002  xiv, 316 p. ; 24 cm
シリーズ名: Modular series on solid state devices ; v. 5
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目次情報: 続きを見る
Preface
An Overview of Microelectronic Fabrication / 1：
A Historical Perspective
An Overview of Monolithic Fabrication Processes and Structures
Metal-Oxide-Semiconductor (MOS) Processes
Basic Bipolar Processing
Safety
Lithography / 2：
The Photolithographic Process
Etching Techniques
Photomask Fabrication
Exposure Systems
Exposure Sources
Optical and Electron Microscopy
Further Reading
Thermal Oxidation of Silicon / 3：
The Oxidation Process
Modeling Oxidation
Factors Influencing Oxidation Rate
Dopant Redistribution During Oxidation
Masking Properties of Silicon Dioxide
Technology of Oxidation
Oxide Quality
Selective Oxidation and Shallow Trench Formation
Oxide Thickness Characterization
Process Simulation
Diffusion / 4：
The Diffusion Process
Mathematical Model for Diffusion
The Diffusion Coefficient
Successive Diffusions
Solid-Solubility Limits
Junction Formation and Characterization
Sheet Resistance
Generation-Depth and Impurity Profile Measurement
Diffusion Simulation
Diffusion Systems
Gettering
Ion Implantation / 5：
Implantation Technology
Mathematical Model for Ion Implantation
Selective Implantation
Junction Depth and Sheet Resistance
Channeling, Lattice Damage, and Annealing
Shallow Implantation
Source Listing
Film Deposition / 6：
Evaporation
Sputtering
Chemical Vapor Deposition
Epitaxy
Interconnections and Contacts / 7：
Interconnections in Integrated Circuits
Metal Interconnections and Contact Technology
Diffused Interconnections
Polysilicon Interconnections and Buried Contacts
Silicides and Multilayer-Contact Technology
The Liftoff Process
Multilevel Metallization
Copper Interconnects and Damascene Processes
Packaging and Yield / 8：
Testing
Wafer Thinning and Die Separation
Die Attachment
Wire Bonding
Packages
Flip-Chip and Tape-Automated-Bonding Processes
Yield
MOS Process Integration / 9：
Basic MOS Device Considerations
MOS Transistor Layout and Design Rules
Complementary MOS (CMOS) Technology
Silicon on Insulator
Bipolar Process Integration / 10：
The Junction-Isolated Structure
Current Gain
Transit Time
Basewidth
Breakdown Voltages
Other Elements in SBC Technology
Layout Considerations
Advanced Bipolar Structures
Other Bipolar Isolation Techniques
BICMOS
Processes for Microelectromechanical Systems--MEMS / 11：
Mechanical Properties of Silicon
Bulk Micromachining
Silicon Etchants
Surface Micromachining
High-Aspect-Ratio Micromachining: The LIGA Molding Process
Silicon Wafer Bonding
IC Process Compatibility
Answers to Selected Problems
Index
Preface
An Overview of Microelectronic Fabrication / 1：
A Historical Perspective
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