Top Down Approaches to Fracture J.W. Hutchinson (Harvard Univ., USA) 1
Crack Analogue Models: Applications to Thin Films, Contact Problems, Interfacial Adhesion and Graded Materials S. Suresh (Massachusetts Inst. of Tech., USA) 8
Brittle Fracture and the Breaking of Atomic Bonds P. Gumbsch (Max-Planck-Institut fur Metallforschung, Germany) 14
Simulations of Crack Propagation in Inhomogeneous Materials T. Nakamura and Z. Wang (State Univ. of New York, Stony Brook, USA) 23
Physics and Chemistry of Fracture and Role of Fracture Mechanics in Failure Prevention T. Shoji, Q.J. Peng, Y. Takeda, J. Kwon and M. Takegoshi (Tohoku Univ., Japan) 33
Fretting Fatigue of Ti-6A1-4V Subjected to Blade/Disk Contact Loading H. Murthy, T.N. Farris (Purdue Univ., USA) and D.C. Slavik (GE Aircraft Engines) 41
Coalescence of Multiple Cracks under Biaxial Loading A. Saimoto, Y. Imai and F. Motomura (Nagasaki Univ., Japan) 49
Stress Intensity Factors for Small Subsurface Circular Cracks under Moving Contact Load and Evaluation of Allowable Defect Size C. Sakae, Y. Murakami (Kyushu Univ., Japan) and Y. Ohkomori (Japan Casting ＆ Forging Corp., Japan) 55
Distribution of Stress Intensity Factors along the Crack Front of Three-Dimensional Cracks N. Noda and T. Kihara (Kyushu Inst. Of Tech., Japan) 61
Fracture of Railroad Products and Design Codes H. Sakamoto (Kochi Univ. of Tech., Japan) 67
Analysis of Magneto-Elastic Problem for Infinite Plate Containing Cracked Hole N. Hasebe, X-F. Wang and H. Nakanishi (Nagoya Inst. of Tech., Japan) 73
Fracture Path Prediction Simulations of Dynamic Fracture Phenomena T. Nishioka, S. Tchouikov, J. Furutsuka and T. Fujimoto (Kobe Univ. of Mercantile Marine, Japan) 79
An Experimental Study on Dynamic Crack Propagation by the Method of Caustics K. Arakawa, T. Mada and K. Takahashi (Kyushu Univ., Japan) 87
Non-Linear Crack Mechanics and Its Application to the Evaluation of Effective Range of Linear Fracture Mechanics H. Nisitani and T. Kawamura (Kyushu Sangyo Univ., Japan) 93
Critical Frontal Process Zone Size Estimation on Alumina Using SEVNB Technique S-M. Choi, M. Ebisudani and H. Awaji (Nagoya Inst. Of Tech., Japan) 99
Welding Eigenstrain Analysis for Improvement of the Bead Flush Method (Characteristics of Eigenstrain Distribution) H. Lee, H. Nakamura and H. Kobayashi (Tokyo Inst. of Tech., Japan) 104
Fretting Fatigue Life Simulation using Stress Singularity Parameters and Fracture Mechanics T. Hattori, M. Nakamura and T. Watanabe (Hitachi, Japan) 110
Cavitating Jet Peening for the Improvement of Fatigue Strength H. Soyama, K. Sakaki, H. Kumano and M. Saka (Tohoku Univ., Japan) 118
Molecular Dynamic Study on the Effect of Crystallographic Orientation on Near-Threshold Fatigue Crack Propagation in Iron S .Kubo, M. Misaki and A. Furukawa (Osaka Univ., Japan) 122
Theoretical and Numerical Investigations on the Elastoplastic Stress Singularity at an Interface Edge J-Q. Xu and Y. Mutoh (Nagaoka Univ. of Tech., Japan) 129
Dependence of Elastic-Plastic Stress Singularity Field on Material Combination of Butt-Jointed Plates Subjected Uniform Tension Y. Arai and E. Tsuchida (Saitama Univ., Japan) 135
Finite Element Analysis on Fracture Behavior of the Interface Crack with Plastic Deformation M. Omiya, K. Kishimoto and T. Shibuya (Tokyo Inst. of Tech., Japan) 140
Shape Design of Bonded Dissimilar Materials Using the Condition of No-Singularity Under Mechanical Loading S. Ioka and S. Kubo (Osaka Univ., Japan) 146
Delamination of Plasma Sprayed Hydroxyapatite Coating Used for Orthopedic Implants Yuki Sugimura (Harvard Univ., USA) 152
Fracture Mechanics Analysis of Edge-Indent Method for Evaluation of Delamination Strength of Coating D. Zhang, M. Kato and K. Nakasa (Hiroshima Univ., Japan) 157
Propagation of Naturally-Initiated Small Interface Debonding Crack in Ni-Based Superalloy Coatings M. Okazaki, K. Tsuchiya and Y. Harada (Univ. of Tokyo, Japan) 163
Relationship between Defect Distribution and Fatigue Crack Propagation Behavior of Rotor Material T. Kurimura, H. Yoshida and M. Sugawara (Mitsubishi Heavy Industries, Japan) 170
Top Down Approaches to Fracture J.W. Hutchinson (Harvard Univ., USA) 1
Crack Analogue Models: Applications to Thin Films, Contact Problems, Interfacial Adhesion and Graded Materials S. Suresh (Massachusetts Inst. of Tech., USA) 8
Brittle Fracture and the Breaking of Atomic Bonds P. Gumbsch (Max-Planck-Institut fur Metallforschung, Germany) 14
1. Nanostructure fabrication using electron and ion beams Shinji Matsui (Himeji Institute of Technology) 3
2. Information storage using a scanning probe Kiyoshi Takimoto (Cannon Co. Ltd.) 21
3. Single electron tunneling organic devices Tohru Kubota, Shiyoshi Yokoyama, Tatsuo Nakahama, Shinro Mashiko (Communications Research Laboratory), Yutaka Noguchi, and Mitsumasa Iwamoto (Tokyo Institute of Technology) 31
4. Spatial light confinement and laser emission from a gain medium containing dendrimer Shiyoshi Yokoyama and Shinro Mashiko (Communications Research Laboratory) 41
5. Control of molecular selective-assembling on metal surface Takashi Yokoyama (National Institute for Materials Science), Toshiya Kamikado, Shiyoshi Yokoyama, Yoshishige Okuno, and Shinro Mashiko (Communications Research Laboratory) 49
B. NICE Devices
6. Polymer optoelectronics - towards nanometer dimensions Olle Inganaes and Fengling Zhang (Linkoeping University) 65
7. Control of charge transfer and interface structures in nano-structured dye-sensitized solar cells Shozo Yanagida, Takayuki Kitamura, and Yuji Wada (Osaka University) 83
8. Materials and devices for ultrafast molecular photonics Toshihiko Nagamura (Shizuoka University) 105
9. Carrier transport behavior in OLED Tatsuo Mori and Teruyoshi Mizutani (Nagoya University) 133
10. Electrical characterization of organic semiconductor films by in situ field-effect measurements Kazuhiro Kudo (Chiba University) 157
C. Smart Soft Materials
11. Introducing ruber into the Langmuir-Blodgett technique H. Xu, R. Heger, F. Mallwitz, M. Blankenhagel, C. Peyratout, and Werner A. Goedel (University of Ulm and Max-Planck-Institut fuer Kolloid- ＆ Grenzflaechenforschung) 183
12. Design of functional interface between living systems and semiconductor nano-structures Motomu Tanaka (Technische Universitaet Muenchen) 191
13. Structural color forming system composed of polypeptide-based LB films Takatoshi Kinoshita (Nagoya Institute of Technology), Shujiro Hayashi, Yoshiyuki Yokogawa (National Institute of Advanced Industrial Science and Technology), and Shintaro Washizu (Fuji Photo Film Co. Ltd.) 233
14. Generation of a strong dipole layer and its function by using helical peptide molecular assemblies Shunsaku Kimura, Tomoyuki Morita, and Kazuya Kitagawa (Kyoto University) 253
D. Interfacial Dynamic Technology
15. Guided mode studies of liquid crystal layers Fuzi Yang (Tsinghua University) and J.R. Sambles (University of Exeter) 271
16. Explanation of the static and dynamic director orientation in thin nematic liquid crystal films using deuterium NMR spectroscopy Akihiko Sugimura (Osaka Sangyo University) and Geoffrey R. Luckhurst (University of Southampton) 313
17. MDC-SHG spectroscopy of organic monolayer film Atsushi Tojima, Ryouhei Hiyoshi, Takaaki Manaka, Mitsumasa Iwamoto (Tokyo Institute of Technology), and Ou-Yang Zhongcan (Academia Sinica) 351
18. Light-driven dynamic controls in nano-hybrid materials Takahiro Seki (Tokyo Institute of Technology) 377
E. Fabrication and Characterization Technology
19. Solvent-induced morphology in nano-structures Bin Cheng, Hongtao Cui, Brian R. Stoner, and Edward T. Samulski (University of North Carolina at Chapel Hill) 399
20. Polarons in conjugated polymer and its composite with fullerene Kazuhiro Marumoto and Shin-ichi Kuroda (Nagoya University) 411
21. Characterization of semiconductor surfaces with noncontact atomic force microscopy Seizo Morita and Yasuhiro Sugawara (Osaka University) 429
22. Transport and photocarrier generation in poly(3-alkylthiophene) and metal junctions Keiichi Kaneto, Koichi Rikitake, and Wataru Takashima (Kyushu Institute of Technology) 455
23. Thermochromic behavior in novel conducting polymers at the solid-liquid phase transition Mitsuyoshi Onoda and Kazuya Tada (Himeji Institute of Technology) 479
1. Extremely high density recording and its applications
R. Wood, Y. Sonobe, Z. Jin and B. Wilson Perpendicular recording: the promise and the problems (invited paper) 1
H. Muraoka and Y. Nakamura Overview of read/write scheme for perpendicular magnetic recording utilizing single-pole head and double layer media (invited paper) 10
H. Okuda and T. Kurioka Storage technology for television home server (invited paper) 20
2. Perpendicular media I
A. Kuroda, Y. Nishida, A. Nakamura, K. Tanahashi, H. Takano, S. Narishige, H. Aoi and Y. Nakamura Thermal decay estimation of perpendicular magnetic recording 25
K. Motohashi, T. Samoto, S. Yoshida, H. Wako and S. Onodera Magnetic activation volumes of obliquely evaporated Co-CoO tape 30
T. Keitoku, J. Ariake, N. Honda and K. Ouchi Preparation of Co-Cr-Pt alloy film with high perpendicular coercivity and large negative nucleation field 34
T. Onoue, T. Asahi, K. Kuramochi, J. Kawaji, T. Homma and T. Osaka Improvement of signal to noise ratio for Co/Pd multilayer perpendicular magnetic recording media by the addition of an underlayer 40
H. Ohmori and A. Maesaka Magnetic properties and noise characteristics of Co/Pd multilayer perpendicular magnetic recording media 45
J.-Y. Kim, B.-K. Lee, G.-S. Park, M. Uchida, T. Kurosawa, S. Watanabe, J. Ariake, N. Honda and K. Ouchi The effect of Pd buffer layers on magnetic exchange energy of Co/Pd multilayered films for perpendicular magnetic recording 53
K. Tanahashi, N. Shimizu, A. Kikukawa, Y. Takahashi, Y. Honda, A. Ishikawa and M. Futamoto Low-noise CoCrPt/FeTaC double-layered perpendicular media with NiTaZr intermediate layer 59
F. Nakamura, T. Hikosaka and Y. Tanaka Low noise multi-layered FeAlSi soft magnetic films for perpendicular magnetic recording media 64
A. Kikukawa, K. Tanahashi, Y. Honda, Y. Hirayama and M. Futamoto Distributions and characteristics of spike noise 68
H. Nakagawa, Y. Honda, A. Kikukawa, K. Tanahashi, A. Ishikawa and M. Futamoto Effects of thin carbon intermediate layer on magnetic and structural properties of perpendicular recording media 73
I. Tamai, T. Yamamoto, A. Kikukawa, K. Tanahashi、A. Ishikawa and M. Futamoto Improvement of the crystallographic orientation of double-layered perpendicular recording media by using CoCr(Mo)/Cu intermediate layers 78
T. Onoue, J. Kawaji, K. Kuramochi, T. Asahi and T. Osaka Effect of underlayers on magnetic properties of Co/Pd multilayer perpendicular magnetic recording media 82
T. Asahi, K. Kuramochi, J. Kawaji, T. Onoue, T. Osaka, and M. Saigo Analysis of microstructures for Co/Pd multilayer perpendicular magnetic recording media with carbon underlayer 87
E.W. Soo, J.P. Wang, C.J. Sun, Y.F. Xu, T.C. Chong and G.M. Chow The effects of NiP seed layer in Co-alloy perpendicular thin film media 93
H. Okuo, T. Onoue, T. Asahi and T. Osaka Relationship between surface energy and preferred orientation of CoCr alloy magnetic thin films deposited on C and TiCr underlayers 98
Y. Ikeda, Y. Sonobe, G. Zeltzer, B.K. Yen, K. Takano, H. Do and P. Rice Microstructure study of CoCrPt/Ti/NiAl perpendicular media 104
G. Yan, J. Ariake, T. Kiya, N. Honda and K. Ouchi (CoxFe100-x)-Hf-O granular films as back layers for perpendicular recording media 110
G. Safran, J. Ariake, N. Honda, K. Ouchi, Z. Czigany, P.B. Barna, M. Menyhard and G. Radnoczi XTEM and AES study of the microstructure for high density Co-Cr-Nb-Pt double layered perpendicular magnetic recording media 115
S. Saito, Y. Hatta and M. Takahashi Variation of Magnetic properties along the film thickness in perpendicular thin film media investigated by optical method 120
Y. Honda, K. Tanahashi, Y. Hirayama, A. Kikukawa and M. Futamoto MFM study of magnetic interaction between recording and soft magnetic layers 126
S. Yamamoto, H. Wada, H. Kurisu and M. Matsuura High-rate deposition of Co-Cr films with perpendicular magnetic anisotropy by ECR sputtering 133
R.J.M. van de Veerdonk, G. Ju, E.B. Svedberg, D. Weller, S. Tamaru, J.T. Wolfson and J.A. Bain Real-time observation of sub-nanosecond magnetic switching in perpendicular multilayers 138
3. Perpendicular media II and HDI
M. Uchida, T. Suzuki and K. Ouchi Preparation of Fe-Pt perpendicular double-layered media with high electric resistivity backlayer 143
S. Ishio, N. Mori, T. Yoshino, H. Saito, T. Suzuki and K. Ohuchi Magnetic anisotropy field Hk and domain structure in Llo FexPt1-x films 148
Y. Tateno and K. Iwasaki Interparticle interaction and magnetic anisotropy in vacuum evaporated Co-O perpendicular magnetic thin film 153
T. Suzuki, T. Tanaka and K. Ikemizu High density recording capability for advanced particulate media 159
T. Ito, O. Kitakami, Y. Shimada, Y. Kamo and S. Kikuchi Enhanced grain growth of magnetic granules in Co/oxide granular films 165
K. Kakizaki, H. Watanabe and N. Hiratsuka The effect of AlN underlayer on c-axis orientation of barium ferrite thin films for perpendicular magnetic recording media 169
T. Aoyama, S. Okawa, K. Hattori, H. Hatate, Y. Wada, K. Uchiyama, T. Kagotani, H. Nishio and I. Sato Fabrication and magnetic properties of CoPt perpendicular patterned media 174
O. Kitakami, M. Ichijo and H. Daimon Lubrication of surface oxidized Co-Cr thin films by phosphoric and phosphorous acid esters 179
Y. Ohchi and F. Tojyou The characterization of lubricant on ME tape by TOF-SIMS analysis 183
4. Heads and soft magnetic materials
K. Ise, K. Yamakawa and K. Ouchi Writing performances of cusp-field single-pole head 187
M. Mochizuki, Y. Nishida, Y. Kawato, T. Okada, T. Kawabe and H. Takano Study on the write-field profile and intensity of narrow-track-width SPT head 191
W. Seiko, Y. Hoshi and H. Shimizu Fe and Fe-N films sputter deposited at liquid nitrogen temperature 196
K. Machida, N. Hayashi, Y. Miyamoto, T. Tamaki and H. Okuda Yoke-type TMR head with front-stacked gap for perpendicular magnetic recording 201
H. Fukuzawa, K. Koi, H. Tomita, H.N. Fuke, Y. Kamiguchi, H. Iwasaki and M. Sahashi NOL specular spin-valve heads using an ultrathin CoFe free layer 208
S.-i. Wakana, T. Nagai, and Y. Sakata Wide bandwidth scanning Kerr microscope based on optical sampling technique using externally triggerable pulse laser diode 213
S. Yamamoto, S. Horie, N. Tanamachi, H. Kurisu and M. Matsuura Fabrication of high-permeability ferrite by spark-plasma-sintering method 218
M. Naoe, K. Hamaya, N. Fujiwara, T. Taniyama, Y. Kitamoto and Y. Yamazaki Selective dry etching of manganite thin films for high sensitive magnetoresistive sensors 223
5. Review and concept of perpendicular magnetic recording
S.-i. Iwasaki Discoveries that guided the beginning of perpendicular magnetic recording (invited paper) 227
J.H. Judy Past, present, and future of perpendicular magnetic recording (invited paper) 235
6. Read/write performance and drive technologies
H. Takano, Y. Nishida, A. Kuroda, H. Sawaguchi, Y. Hosoe, T. Kawabe, H. Aoi, H. Muraoka, Y. Nakamura and K. Ouchi Realization of 52.5Gb/in2 perpendicular recording (invited paper) 241
S.E. Lambert, B.M. Lairson, H. Nguy, L. Nguyen, T. Huang, J. Adler and S. Gopalaswamy Drive integration challenges for perpendicular recording (invited paper) 245
Y. Tanaka and T. Hikosaka Perpendicular recording with high squareness CoPt-CrO media (invited paper) 253
Y. Okamoto, H. Osawa, H. Saito, H. Muraoka and Y. Nakamura Performance of PRML systems in perpendicular magnetic recording channel with jitter-like noise (invited paper) 259
H. Sawaguchi, Y. Nishida, H. Takano and H. Aoi Performance analysis of modified PRML channels for perpendicular recording systems (invited paper) 265
7. Perpendicular CoCr system media
T. Shimatsu, H. Uwazumi, H. Muraoka and Y. Nakamura Thermal stability in perpendicular recording media (invited paper) 273
M. Futamoto, Y. Hirayama, Y. Honda, A. Kikukawa, K. Tanahashi and A. Ishikawa CoCr-alloy perpendicular magnetic recording media for high-density recording (invited paper) 281
N. Honda and K. Ouchi Low noise design of perpendicular magnetic recording media (invited paper) 289
T.D. Lee, M.S. Hwang and K.J. Lee Effects of magnetic layer thickness on negative nucleation field and Cr segregation behavior in CoCrPt/Ti perpendicular media (invited paper) 297
8. High perpendicular anisotropy media
R.H. Victora, W. Peng, J. Xue and J.H. Judy Superlattice magnetic recording media: experiment and simulation (invited paper) 305
T. Suzuki, T. Kiya, N. Honda and K. Ouchi Fe-Pt perpendicular double-layered media with high recording resolution (invited paper) 312
9. Oxide perpendicular media and exchange coupling
H. Fujiwara, K. Zhang, T. Kai and T. Zhao Effect of direct exchange coupling between antiferro-magnetic grains on magnetic behavior of ferro/antiferromagnetic exchange coupled polycrystalline layer systems (invited paper) 319
T. Hughes, K. O'Grady, H. Laidler and R.W. Chantrell Thermal activation in exchange biased bilayers (invited paper) 329
S. Nakagawa, N. Matsushita and M. Naoe Perpendicular magnetic recording media using hexagonal ferrite thin films deposited on Pt underlayers and interlayers (invited paper) 337
S. Yamamoto, K. Hirata, H. Kurisu, M. Matsuura, T. Doi and K. Tamari High coercivity ferrite thin-film tape media for perpendicular recording (invited paper) 342
Y. Hoshi New sputter-deposition processes for the formation of thin films with desired structure for magnetic recording (invited paper) 347
10. Single-pole heads
K. Yamakawa, K. Taguchi, K. Ise, N. Honda and K. Ouchi Single-pole recording head design for 100 Gbpsi perpendicular magnetic recording (invited paper) 354
J.P. Lazzari Single pole, single turn, probe GMR head and micro-actuator for high-density perpendicular recording (invited paper) 362
Y. Kanai, R. Matsubara, H. Muraoka and Y. Nakamura Write field analysis of narrow-track SPT head fo GHz response (invited paper) 368
S. Tsuboi, H. Matsutera, T. Ishi, N. Ishiwata and K. Ohashi Read/write characteristics of focused-ion-beam-etched heads for perpendicular magnetic recording media (invited paper) 375
11. Read/write characteristics and signal processing
A. Kurose, S. Muramatsu, H. Fusayasu, A. Murata and M. Kobayashi Predicted outputs of a high-frequency carrier-type magnetic head for 100 Gbit/in2 generation 382
S. Tanabe Transition analysis of magnetic recording heads using FDTD 388
D.T. Wilton, H.A. Shute, S.J.C. Brown and D.J. Mapps Approximation of shielded MR head output for perpendicular media 393
K.J. Lee, Y.H. Im, Y.S. Kim, K.M. Lee, J.W. Kim, N.Y. Park, G.S. Park and T.D. Lee Novel simulation model for perpendicular magnetic recording 398
A. Shukh 3D FEM modeling of keeper effect on perpendicular recording 403
J. van Ek, A. Shukh, E. Murdock, G. Parker and S. Batra Micromagnetic perpendicular recording model: soft magnetic underlayer and skew effect 408
E. Miyashita, K. Kuga, R. Taguchi, T. Tamaki and H. Okuda Simulation of magnetization patterns of perpendicular media for ultra-high recording density 413
S.J. Greaves, H. Muraoka, Y. Sonobe, M. Schabes and Y. Nakamura Pinning of written bits in perpendicular recording media 418
Y. Sonobe, D. Weller, Y. Ikeda, K. Takano, M.E. Schabes, G. Zeltzer, H. Do, B.K. Yen and M.E. Best Coupled granular./continuous medium for thermally stable perpendicular magnetic recording 424
T. Kiya, N. Honda, J. Ariake, K. Ouchi and S. Iwasaki Detection of extremely high bit density signals with a narrow track width GMR head in double layered perpendicular recording media 429
H. Shigematsu, H. Muraoka and Y. Nakamura Influence of hard-transition shift on overwrite characteristics in perpendicular magnetic recording 435
C.H. Hee, J.P. Wang, T.C. Chong and T.S. Low Design of highly oriented (HOR) media for extremely high density recording 440
Y. Uesaka, Y. Nakatani, N. Hayashi and H. Fukushima Read/write properties of oriented longitudinal recording media 445
T. Komakine, N. Honda, T. Kiya and K. Ouchi Noise spectrum analysis in perpendicular magnetic recording of double-layered media 450
Y. Nishida, H. Sawaguchi, A. Kuroda, H. Takano, H. Aoi and Y. Nakamura Noise characteristics of double-layered perpendicular media 454
M. Kitano, E. Miyashita, K. Kuga, R. Taguchi, T. Tamaki, H. Okuda, H. Uwazumi, Y. Sakai, A. Kumagai and A, Otsuki MFM analysis of recorded bit patterns of perpendicular media 459
Y. Okamoto, M. Sato, H. Osawa, H. Saito, H. Muraoka and Y. Nakamura MTR coded PRML systems for perpendicular magnetic recording 465
Y. Okamoto, S. Miki, N. Masunari, H. Osawa,H. Saito and Y. Nakamura A study of timing recovery for perpendicular magnetic recording 470
M. Akamatsu, Y. Okamoto, H. Saito, H. Osawa, H. Muraoka and Y. Nakamura Error event analysis in perpendicular magnetic recording using double-layered medium 475
Z. Yuan and B. Liu Double layer magnetic data storage-an approach towards 3D magnetic recording 481
sponsored by IEEE Computer Society, Information Processing Society of Japan, Society of Instrument and Control Engineers of Japan, Institute of Electronics, Information, and Communication Engineers, Japan ; in cooperation with International Federation for Information Processing, International Federation of Automatic Control ... [et al.]
出版情報:
Los Alamitos, Calif. ; Tokyo : IEEE Computer Society, c2001 xvi, 484 p. ; 28 cm
New Business Trends in IT Services Yuji Inoue, NTT Data Corporation
SESSION 1: ELECTRONIC COMMERCE: MODELS AND PROTOCOLS
A Dependable Distributed Auction System: Architecture and an Implementation Framework P. Ezhilchelvan and G. Morgan 3
An Agent-Based Petri Net Model with Application to Seller/Buyer Design in Electronic Commerce H. Xu and S. Shatz 11
Formal Analysis of E-Commerce Protocols M. Papa, O. Bremer, J. Hale, and S. Shenoi 19
An Automated Negotiation Model for Electronic Commerce J. Ueyama and E. Madeira 29
SESSION 2: HIGH ASSURANCE SYSTEMS
Adaptive Resource Management in Asynchronous Real-Time Distributed Systems Using Feedback Control Functions B. Ravindran, P. Kachroo, and T. Hegazy 39
A High Assurance On-Line Recovery Technology for a Space On-Board Computer H. Yashiro, T. Fujiwara, and K. Mori 47
An Integrated Post-Locking, Multi-Versioning, and Transformation Scheme for Consistency Maintenance in Real-Time Group Editors L. Xue, K. Zhang, and C. Sun 57
Autonomous Information Provision to Achieve Reliability for Users and Providers H. Ahmad, G. Sun, and K. Mori 65
SESSION 3: PANEL: XML AND E-BUSINESS FRAMEWORKS
Chair: M. Heller
Panelists: E. Ferari, J. Putman, T. Gannon
SESSION 4: FAULT TOLERANCE AND SAFETY CRITICAL SYSTEMS
On Godefroid's Stateless Search Technique for Testing Concurrent Programs K-C. Tai and B. Karacali 77
Assurance Technologies for Growing Systems and Their Application to Large-Scale Transport Operation Control Systems K. Kera, K. Bekki, N. Miwa, F. Kitahara, K. Kamijyo, and K. Seki 85
Primary Component Asynchronous Group Membership as an Instance of a Generic Agreement Framework F. Greve, M. Hurfin, M. Raynal, and F. Tronel 93
Safety Assurance via On-Line Monitoring S. Dolev and F. Stomp 101
SESSION 5: ARCHITECTURES AND MODEL FOR DISTRIBUTED SYSTEMS
Modularized System Architecture for Flexible Clinical Laboratory Systems H. Mitsumaki, T. Ikeda, R. Kodama, and T. Aizono 111
A 3D Interface for the Administration of Component-Based, Distributed Systems O. Stiemerling, M. Hallenberger, and A. Cremers 119
UML-Spaces: A UML Profile for Distributed Systems Coordinated via Tuple Spaces E. Astesiano and G. Reggio 127
Scenario-Based Service Composition Method in the Open Service Environment K. Kiwata, A. Nakano, S. Yura, T. Uchihashi, and A. Kanai 135
SESSION 6: PANEL: AGENT-BASED ELECTRONIC COMMERCE
Chairs: J-Y. Chung and J. Lee
Panelists: L. Lee, C. Priest, J. Youll, J. Hanson, M. Hsu
Agent-Based Electronic Commerce: Opportunities and Challenges J-Y. Chung and J. Lee 143
Agent-Based Auctions L. Lee 144
Agent-Based Electronic Commerce: Opportunities and Challenges J. Youll 146
Cultivating the Agent Economy J. Hanson 149
SESSION 7: ELECTRONIC COMMERCE: TECHNOLOGIES AND ARCHITECTURES
A Decentralized XML Database Approach to Electronic Commerce H. Ishikawa and M. Ohta 153
Commitment-Based Interoperation for E-Commerce J. Xing, F. Wan, S. Rustogi, and M. Singh 161
Service Matching and Collaboration for Electronic Commerce S. Yura, K. Kiwata, A. Nakano, T. Uchihashi, and A. Kanai 169
Dependability Modeling of Homogeneous and Heterogeneous Distributed Systems Y. Chen and Z. He 176
SESSION 8: DISTRIBUTED OBJECT MANAGEMENT SYSTEMS
A Distributed Asynchronous Execution Semantics for Programming the Middleware Machine A. Berry and S. Kaplan 187
Quorum-Based Locking Protocol for Replicas in Object-Based Systems K. Tanaka and M. Takizawa 196
Integrating Autonomous Enterprise Systems through Dependable CORBA Objects C. Marchetti, A. Virgillito, M. Mecella, and R. Baldoni 204
Reflective Decision Controls for Autonomous Distributed Objects E-H. Huang and T. Elrad 212
SESSION 9: SHORT PAPERS
Location Transparent Distributed Scripts and Their Execution Systems on D'Agent O. Honda, H. Tada, and M. Higuchi 223
Efficiently Announcing Multimedia Information from Mobile Computers with the WOR Toolkit S. Tagashira, K. Saisho, and A. Fukuda 227
Simulating Agent Based Processing in an ADS Using C++ SIM C. Lee, J. Kim, J. Stach, and E. Park 231
The New ATC Systems with an Autonomous Speed Control with On-Board Equipment M. Matsumoto, A. Hosokawa, S. Kitamura, D. Watanabe, and A. Kawabata 235
Behavior Patterns for Mobile Agent Systems from the Development Process Viewpoint Y. Tahara, A. Ohsuga, and S. Honiden 239
Mobile Agents in Network-Centric Warfare M. Ceruti 243
Building Holonic Control Systems with Function Blocks M. Fletcher 247
Reactive Web Agents with Open Constraint Programming K. Zhu, W-Y. Tan, A. Santosa, and R. Yap 251
An Architecture for Adaptively Replicating Cooperative Shared Objects Z. Jun and Y. Yong 255
The Wireless World in 2010: New Orientations Fiona Williams
SESSION 10: MULTI-AGENT SYSTEMS
A Framework for Developing Reactive Information Agents with Heterogeneous Communication Capabilities D. Vyzovitis and K. Clark 263
Rule-Driven Coordination Agents: A Self-Configurable Agent Architecture for Distributed Control M. Blake 271
Mobile Agent Messaging Models D. Deugo 278
Decentralized Control of Hybrid Systems R. Palm and T. Runkler 287
SESSION 11: PANEL: EMBEDDED SYSTEMS
Chair: F. Bastani
Panelists: B. Cukic, T. Labbe, A. Lee, J. Linn, R. Paul, V. Winter
The Need for Verification and Validation Techniques for Adaptive Control System B. Cukic 297
Embedded Software Development Challenges in the Digital Signal Processing Era J. Linn 299
SESSION 12: MIDDLEWARE TECHNOLOGIES
Type-Safe Trading Proxies Using TORBA R. Marvie, P. Merle, J-M. Geib, and S. Leblanc 303
An Automated Client-Driven Approach to Data Extraction Using an Autonomous Decentralized Architecture M. Blake and P. Liguori 311
Reconfigurable Context-Sensitive Middleware for ADS Applications in Mobile Ad Hoc Network Environments S. Yau and F. Karim 319
TMOES: A CORBA Service Middleware Enabling High-Level Real-Time Object Programming K. Kim, J. Liu, H. Miyazaki, and E. Shokri 327
SESSION 13: PANEL: MOBILE COMPUTING AND COMMUNICATION
Chair: Janice Putman
Panelists: W. Ruh, L. Strick, T. Wheeler
SESSION 14: AGENT TECHNOLOGIES FOR ELECTRONIC COMMERCE
How Agents from Different E-Commerce Enterprises Cooperate Q. Chen, M. Hsu, and I. Kleyner 341
Brokering Based Self Organizing E-Service Communities S. Helal, M. Wang, A. Jagatheesan, and R. Krithivasan 349
A Real-Time Multi-Agent System Architecture for E-Commerce Applications L. DiPippo, V. Fay-Wolfe, L. Nair, E. Hodys, and O. Uvarov 357
Flexible Manufacturing Control with PLC, CNC and Software Agents R. Schoop, R. Neubert, and B. Suessmann 365
SESSION 15: SELF-STABILIZING SYSTEMS
The Multi-Agent System for Dynamic Network Routing R. Onishi, S. Yamaguchi, H. Morino, H. Aida, and T. Saito 375
Ant Colony Control for Autonomous Decentralized Shop Floor Routing V. Cicirello and S. Smith 383
A Study of Synthetic Creativity through Behavior Modeling and Simulation of an Ant Colony P. Heck and S. Ghosh 391
A Stabilizing Search Tree with Availability Properties T. Herman and T. Masuzawa 398
Decentralized E-Business Applications for Government Systems Henry Bayard
SESSION 16: SECURE SYSTEMS AND APPLICATIONS
Data Protection in Mobile Agents: One-time Key-based Approach J-Y. Park, D-I. Lee, and H-H. Lee 411
Access Revocation and Prevention of False Repudiation in Secure Email Exchanges L. Bai, R. Achuthanandam, and M. Kam 419
Formal Analysis of Software Security System Architectures Y. Deng, J. Wang, and J. Tsai 426
Concepts and Architecture of a Security-Centric Mobile Agent Server V. Roth and M. Jalali-Sohi 435
SESSION 17: PANEL: ROBOTICS FOR EDUCATION AND ENTERTAINMENT
Chairs: M. Fujita, R. Arkin
Panelists: M. Veloso, T. Shibata, J. Yamato
SESSION 18: MODELING AND PERFORMANCE ANALYSIS
Autonomous Data Consistency Technique through Fair Evaluation among Heterogeneous Systems I. Kaji, S. Kato, and K. Mori 447
Analysis of Algorithms for Supporting Disconnected Write Operations in Mobile Client-Server Environments I-R. Chen, N. Phan, and I-L. Yen 456
GDEVS: A Generalized Discrete Event Specification for Accurate Modeling of Dynamic Systems N. Giambiasi, B. Escude, and S. Ghosh 464
Autonomous Navigation in Information Service Systems for Load Balancing User Demands H. Arfaoui and K. Mori 470
SESSION 19: PANEL: SECURITY FOR THE WEB AND E-COMMERCE SYSTEMS
Chair: Bhavani Thuraisingham
Panelists: E. Bertino, T.Y. Lin, S. Shenoi, A. Ghosh
PANEL: FUTURE OF AUTONOMOUS DECENTRALIZED SYSTEMS
Chair: Steven Yau
Panelists: K. Mori, R. Popescu-Zeletin, B. Thuraisingham, J. Tsai, L. Strick, M. Imase
4. Removal of Organic and Inorganic Substances in Wastewater 56
5. Conclusion 57
References 57
CHAPTER 4 Catalysis by enzyme-metal combinations Mahn-Joo Kim, Jaiwook Park, Yangsoo Ahn, Palakodety R. Krishna 59
1. Introduction 59
2. Dynamic Kinetic Resolutions by Enzyme-Metal Combinations 60
2.1. DKR of secondary alcohols 60
3. Asymmetric Transformations by Enzyme-Metal Combinations 73
3.1. Asymmetric transformation of ketone 73
3.2. Asymmetric transformation of enol ester 75
3.3. Asymmetric transformation of ketoxime 76
4. Conclusion 78
Acknowledgements 78
References 79
Part 2 Uncommon kind of biocatalytic reaction 81
CHAPTER 5 Biological Kolbe-Schmitt carboxylation Possible use of enzymes for the direct carboxylation of organic substrates Toyokazu Yoshida, Toru Nagasawa 83
1. Introduction 83
2. Enzymes Catalyzing the Carboxylation of Phenolic Compounds 84
The Story Behind the Red Phosphorus Mold Compound Device Failures / prof.Michael Pecht,University of Maryland,USA 1
Semiconductor Integrated Circuit Packaging Technology Challenges-Next Five Years / Dr. Mario A. Bolanos, Texas Instruments Inc., USA 6
Gbps Signal Transmission on Si CMOS ULSI / Prof.Kazuya Masu, Tokyo Institute of Technology,Japan 10
A Study of Hygro-Thermal Deformations and Stresses in FCPBGA / Prof.Sung Yi, Portland State University,USA 15
GENERAL SESSIONS
Quality ＆ Reliability(1)
Development of an Automated X-Ray Inspection Method for Microsolder Bumps / Atsushi Teramoto (Nagoya Electric Works Co., Ltd.),Takayuki Murakoshi, Masatoshi Tsuzaka (Nagoya University) and Hiroshi Fujita (Gifu University) 21
Reliability Assessment of BGA Solder Joints under Cyclic Bending Loads / Ilho Kim(KAIST, Korea) and Soon-Bok Lee 27
Case Studies of Reliability Analysis by Stochastic Methodology in BGA Creep Analysis / Shoji Sasaki(MSV,Software Ltd.) Motoharu Tateishi, Isamu Ishikawa and Paul Vanderwalt(MSC.Software Corporation,USA) 33
Fatigue Crack Propagation Analysis for Micro Solder Joints with Void / Takeshi Terasaki(Hitachi,Ltd) and Hisashi Tanie 37
Quality ＆Reliability(2)
Reliability Analysis of Embedded Chip Technique with Design of Experiment Methods / Xiuzhen Lu(Shanghai University,China), Liu Chen(Chalmers University of Technology,Sweden) Zhaonian Cheng and Johan Liu(Shanghai University,China/Chaimers University of Technology,Sweden) 43
A Role of Ti-Sn Diffusion Layer Formed at the Interface between Pb Free Solder and TiNiAu Multi-Layer / Kimiharu Kayukawa(Denso Corporation) and Akira Tanahashi 50
In Situ Observation of Interfacial Fracture in Low-Dimensional Nano Structures / Yoshimasa Takahashi(Kyoto University),Hiroyuki Hirakata and Takayuki Kitamura 55
Effect of Frequency of Fatigue Crace Growth along Interface between Copper Film and Silicon Substrate / Do Van Truong(Kyoto University),Hiroyuki Hirakata and Takayuki Kitamura 61
Quality ＆ Reliability(3)
Effect of Lead and Cadmium Free Glasses on Reliability of the Siver End Termination for MLCC Application / Masyood Akhtar(LORD Corporation,USA) 67
The Study of Silicon Die Stress In Stacked Die Packages / Eiichi Yamada(Texas Instruments Japan Limited),Kenji Abe,Yutaka Suzuki and Masazumi Amagai 74
A Multifunctional Test Chip for Microelectronic Packaging and Its Application on RF Property Measurements / Kun-Fu Tseng(Chin-Min Institute of Technology,Taiwan),Yi-Hsun Hsion,Ben-Je Lwo and Chin-Hsing Kao(National Defense University,Taiwan) 78
Strain Measurement in the Microstructure of Advanced Electronic Packages Using Digital Image Correlation / Nobuyuki Shishido(Kyoto University),Toru Ikeda and Noriyuki Miyazaki 83
Effect of Au and Ni Layer Thicknesses on the Reliability of BGA Solder Joints / M.O.Alam(City University of Hong Kong,Hong Kong), Y.C.Chan and L.Rufer(TIMA Lab,France) 88
Interconnection Technologies Studies on Double-Layered Metal Bumps for Fine Pitch Flip Chip Applications / Ho-Young Son(KAIST,Korea),Yong-Woon Yeo(Nepes Corperation,Korea), Gi-Jo Jung,Jun-Kyu Lee,Joon-Young Choi,Chang-Joon Park(Hynix Semiconductor,Korea), Min-Suk Suh, Soon-Jin Cho(Samsung Electro-Mechanics,Korea),and Kyung-Wook Paik(KAIST,Korea) 95
Dynamic Characterization Study of Flip Chip Ball Grid Array(FCBGA) on Periphearl Component Interconnect(PCI) Board Application / Wong Shaw Fong(Intel Technology,Malaysia), Loh Wei Keat, Lee Yung Hsiang, Yap Eng Hooi(Intel Product,Malaysia),Wong Siang Woen,Hin Tze Yang(Intel Technology,Malaysia) and Martin Tay Tiong We 101
Stability of Ni3p and Its Effect on the Interfacial Reaction between Electroless Ni-P and Molten Tin / K.Chen(Loughborough University,UK),C.Liu, D.C. Whalley and D.A. Hutt 107
Investigation of void-free Electroplating Method on Copper Column based Solder Bump for Flip-Chip Interconnections / Hiroshi Yamada(Toshiba Corporation) 112
Optoelectronics/Photonics
Characterization of Au-Sn Eutectic Die Attach Process for Optoelectronics Device / Thang Tak-Seng(Lumileds Lighting(M)Sdn Bhd,Malaysia),Decai Sun,Huck-Khim Koay, Mohd-Fezley Sabudin,Jim Thompson,Paul Martin, Pradeep Rajkomar and Shatil Haque 118
Propagation Loss Evaluation of Optical Transmission/Interconnect System with Grating Structure / Akiya Kimura(Osaka University),Kiyokazu Yasuda,Michiya Matsushima and Kozo Fujimoto 125
A New Method of Birefringence Measurement to Obtain Stress Field Using Photoclasticity / Kenji Gomi(Tokyo Denki University),Kengo Shimizu,Hayato Suzuki, Shinichi Gohira,Yasushi Niitsu and Kensuke Ichinose 129
Optimization of Epoxy Flow for Passive Alignment of Optical Fiber Arrays / Jeffery C.C.Lo(Hong Kong University of Science ＆ Technology,Hong kong), Chung Yeung Li, Chung Leung Tai and S.W.Ricky Lee 132
Polymer Materials
Study on Long Life Large-Deflective Hinges in Molded Pantograph Mechanisms based on Cyclic Load-Bending Fatigue Test / Mikio Horie(Tokyo Institute of Technology), Yudai Okabe, Masahiro Yamamoto and Daiki Kamiya 137
Warpages of ACF-bonded COG Packages Induced from Manufacturing and Thermal Cycling / M.Y.Tsai(Chang Gung University,Taiwan), C.Y.Huang,C.Y.Chiang, W.C.Chen(ERSO/ITRI,Taiwan) and S.S. Yang 143
Simulation of Tensile Deformation Behavior of Polymer by Chain Network Model / Akira Shinozaki(Tokyo Institute of Technology),Kikuo Kishimoto and Hirotsugu Inoue 150
Effects of the Functional Groups of Non-Conductive Films(NCFs) on Materials Properties and Reliability of NCF Flip-Chip-On-Organic Boards / Chany-kyu Chung(KAIST,Korer),Woon-Seong Kwon,Jin-Hyoung Park, Soon-Bok Lee and Kyung-Wook Paik 156
Effects of Low-modulus Die Attach Adhesive on Warpage and Damage of BGA / Sung Yi(Portland State University,USA), Paresh D.Daharwal(Intel Corporation,USA), Yeong.J.Lee(Motorola,USA)and Brian R.Harkness(Dow Corning,USA) 162
Thick ＆ Thin Film Materials
Hardness and Elastic Modulus of ZnO Deposited materials by PLD Method / Han-Ki Yoon(Dong-Eui University,Korea) and Yun-Sik Yu 169
Mechanical properties of ITO/PET Thin Film Deposited by DC MG Method / Do-Hyoung Kim(Dong-Eui University,Korea),Han-ki Yoon, Do-Hoon Shin(University of Tokushima) and Riichi Murakami 174
Formation and Characterization of Sputtered Thin Film for Optimizing Multilayered Interconnection Structure / Wataru Sashida(Kogakuin University) and Yuji Kimura 179
Packaging(1)
Development of The Embedded LST Technology in PALAP / H.Kamiya(DENSO Corportion),T.Miyake, H.Kobasyashi, and K,Kondo 183
Wafer-Scale BCB Resist-Processing Technologies for High density Intergration and Electronic Packaging / Rainer Pelzer(EV Group,Austria),Viorel Dragoi,Bart Swinnen(IMEC,Belgium),Philippe Soussan and Thorsten Matthias(EV Group,Austria) 187
Microscale Magnetic Components for the Application of DC-DC Converters Operating in the 1-10 MHz Range / David Flynn(Heriot-Watt University,UK),Anthony Toon and Marc Desmulliez 192
Low-Cost Active-Allignment of Single-Mode Fiber-Arrays / D. Weiland(Heriot Watt Universtity,UK), M.Luetzelschwab, M.P.Y.Desmulliez, A.Missoffe and C.Beck(TWI Ltd,UK) 199
SAW Chemical Sensors based on AlGan/GaN Piezoelectric Material System: Acoustic Design and Packaging Considerations / L.Rufer(TIMA Lab,France), A.Torres, S.Mir, M.O.Alam(City University of Hong Kong, Hong Kong),T.Lalinsky(Slovak Academy of Sciences, Slovak Republic) and Y.C.Chan(City University of Hong Kong,Hong Kong) 204
Packaging(2)
Evaluation of Thermal Deformation Behavior in Electronic Package using UV Moire Interferometry / Jin-Hyoung Park(KAIST,Korea)and Soon-Bok Lee 209
Evaluation of Fatigue Strength for Solder Joints after Thermal Aging / Takeshi Miyazaki(Tokyo Institute of Technology), Masaki Omiya,Hirotsugu Inoue, Kikuo Kishimoto and Masazumi Amagai(Texas Instruments) 215
Local Thermal Deformation and Residual Stress of a Thin Si Chip Mounted on a Substrate Using An Area-Arrayed Flip Chip Structure / Hideo Miura(Tohoku University),Nobuki Ueta and Yuhki Sato 220
The Novel Flip Chip Ball Grid Array Design and Challenges to Enable Higher Routing Density and Power Requirement / Chee Wai Wong(Intel Technology,Malaysia),Chee Kheong Yoon and Seng Hooi Ong 226
Fatigue Crack Growth in Lead-free Solder Joints / Masaki Omiya(Tokyo Institute of Technology), Kikuo Kishimoto and Masazumi Amagai(Texas Instrument) 232
Modeling ＆ Simulation(1)
A Study of Hot Spot in Silicon Device for Stacked Die Packages / Jotaro Akiyama(Texas Instruments Japan Limited),Masanobu Naeshiro and Masazumi Amagagai 238
Modeling the Lamination Process for Ruggedised Displays / Yek Bing Lee(University of Greenwich, UK), Chris Bailey, Hua lu, Steve Riches,Martin Bartholomew and Nigel Tebbit 243
Modeling and Simulation of a Fluid-driven Microturbine / Chanwut Sriphung(Heriot-Watt University,UK) and Resh Dhariwal 247
Modeling ＆ Simulation(2)
Stress Intensity Factors of Interface Corners / Chyanbin Hwu(National Cheng Kung University,Taiwan) and T.L.Kuo 252
The Impact of Capacitors Selection and Placement to the ESL and ESR / Huang Jimmy Huat Since(Intel Microelectronic,Malaysia), Sijher Taninder S and Beh Jiun Kai 258
Evaluation of Drop Impact Load for Portable Electronic Components / Takahiro Omori(Toshiba Corporation), Hirotsugu Inoue(Tokyo Institute of Technology), Noriyasu Kawamura(Toshiba Corporation), Minoru Mukai,Kikuo Kishimoto(Tokyo Institute of Technology) and Takashi Kawakami(Toshiba Corporation) 262
Nonlinear Dynamic Behavior of Thin PCB Board for Solder Joint Reliability Study under Shock Loading / Loh Wei Keat(Intel Technology,Malaysia), Lee Yung Hsiang. Ajay A/I Murugayah and Tay,Tiong We 268
Thermal Management
Turbulence Modelling for Electronic Cooling: A Review / K.Dhinsa(University of Greenwich,UK), C.Bailey and K.Pericleous 275
Heat Conduction in Composites of Thermally Dissimilar Materials-A Methodology to Economize Numerical Heat Transfer Analysis of Electronic Components / Wataru Nakayama(ThermTech International) 282
Critical Appraisal of Thermo-Mechanical Reliability of Medium-Power Heterojunction Bipolar Transistors for Base Station and Military Applications Mounted in SOIC-8 Leadframe Based Plastic Overmold Packages with Conductive Silver Epoxy / Satbir Madra(WJ Communications,Inc,USA) 288
A Study in Establishing Flip-Chip Ball Grid Array(FCBGA) Second Level Interconnect(SLI)Reliability Requirement by CFD Simulation / Lee Eng Kwong(Intel Technology, Malaysia) and Tan wool Aun 292
Electro-Themal Analysis of Device Interactions in Si CMOS Structure / Tomoyuki Hatakeyama(Tokyo institute of Technology), Kazuyoshi Fushinobu and Ken 296
KEYNOTE LECTURES
The Story Behind the Red Phosphorus Mold Compound Device Failures / prof.Michael Pecht,University of Maryland,USA 1
Semiconductor Integrated Circuit Packaging Technology Challenges-Next Five Years / Dr. Mario A. Bolanos, Texas Instruments Inc., USA 6
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