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1.

図書

図書
Associate Professor Helen McGregor, Mr. Paul Maloney
出版情報: Sydney : Faculty of Engineering, University of Technology, Sydney[UTS], 2005  153 p. ; 30 cm
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図書

東工大
目次DB

図書
東工大
目次DB
International Symposium on Electronics Materials and Packaging ; 岸本, 喜久雄
出版情報: Piscataway, NJ : IEEE, c2005  vi, 301 p. ; 30 cm
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KEYNOTE LECTURES
   The Story Behind the Red Phosphorus Mold Compound Device Failures / prof.Michael Pecht,University of Maryland,USA 1
   Semiconductor Integrated Circuit Packaging Technology Challenges-Next Five Years / Dr. Mario A. Bolanos, Texas Instruments Inc., USA 6
   Gbps Signal Transmission on Si CMOS ULSI / Prof.Kazuya Masu, Tokyo Institute of Technology,Japan 10
   A Study of Hygro-Thermal Deformations and Stresses in FCPBGA / Prof.Sung Yi, Portland State University,USA 15
GENERAL SESSIONS
Quality & Reliability(1)
   Development of an Automated X-Ray Inspection Method for Microsolder Bumps / Atsushi Teramoto (Nagoya Electric Works Co., Ltd.),Takayuki Murakoshi, Masatoshi Tsuzaka (Nagoya University) and Hiroshi Fujita (Gifu University) 21
   Reliability Assessment of BGA Solder Joints under Cyclic Bending Loads / Ilho Kim(KAIST, Korea) and Soon-Bok Lee 27
   Case Studies of Reliability Analysis by Stochastic Methodology in BGA Creep Analysis / Shoji Sasaki(MSV,Software Ltd.) Motoharu Tateishi, Isamu Ishikawa and Paul Vanderwalt(MSC.Software Corporation,USA) 33
   Fatigue Crack Propagation Analysis for Micro Solder Joints with Void / Takeshi Terasaki(Hitachi,Ltd) and Hisashi Tanie 37
Quality &Reliability(2)
   Reliability Analysis of Embedded Chip Technique with Design of Experiment Methods / Xiuzhen Lu(Shanghai University,China), Liu Chen(Chalmers University of Technology,Sweden) Zhaonian Cheng and Johan Liu(Shanghai University,China/Chaimers University of Technology,Sweden) 43
   A Role of Ti-Sn Diffusion Layer Formed at the Interface between Pb Free Solder and TiNiAu Multi-Layer / Kimiharu Kayukawa(Denso Corporation) and Akira Tanahashi 50
   In Situ Observation of Interfacial Fracture in Low-Dimensional Nano Structures / Yoshimasa Takahashi(Kyoto University),Hiroyuki Hirakata and Takayuki Kitamura 55
   Effect of Frequency of Fatigue Crace Growth along Interface between Copper Film and Silicon Substrate / Do Van Truong(Kyoto University),Hiroyuki Hirakata and Takayuki Kitamura 61
Quality & Reliability(3)
   Effect of Lead and Cadmium Free Glasses on Reliability of the Siver End Termination for MLCC Application / Masyood Akhtar(LORD Corporation,USA) 67
   The Study of Silicon Die Stress In Stacked Die Packages / Eiichi Yamada(Texas Instruments Japan Limited),Kenji Abe,Yutaka Suzuki and Masazumi Amagai 74
   A Multifunctional Test Chip for Microelectronic Packaging and Its Application on RF Property Measurements / Kun-Fu Tseng(Chin-Min Institute of Technology,Taiwan),Yi-Hsun Hsion,Ben-Je Lwo and Chin-Hsing Kao(National Defense University,Taiwan) 78
   Strain Measurement in the Microstructure of Advanced Electronic Packages Using Digital Image Correlation / Nobuyuki Shishido(Kyoto University),Toru Ikeda and Noriyuki Miyazaki 83
   Effect of Au and Ni Layer Thicknesses on the Reliability of BGA Solder Joints / M.O.Alam(City University of Hong Kong,Hong Kong), Y.C.Chan and L.Rufer(TIMA Lab,France) 88
   Interconnection Technologies Studies on Double-Layered Metal Bumps for Fine Pitch Flip Chip Applications / Ho-Young Son(KAIST,Korea),Yong-Woon Yeo(Nepes Corperation,Korea), Gi-Jo Jung,Jun-Kyu Lee,Joon-Young Choi,Chang-Joon Park(Hynix Semiconductor,Korea), Min-Suk Suh, Soon-Jin Cho(Samsung Electro-Mechanics,Korea),and Kyung-Wook Paik(KAIST,Korea) 95
   Dynamic Characterization Study of Flip Chip Ball Grid Array(FCBGA) on Periphearl Component Interconnect(PCI) Board Application / Wong Shaw Fong(Intel Technology,Malaysia), Loh Wei Keat, Lee Yung Hsiang, Yap Eng Hooi(Intel Product,Malaysia),Wong Siang Woen,Hin Tze Yang(Intel Technology,Malaysia) and Martin Tay Tiong We 101
   Stability of Ni3p and Its Effect on the Interfacial Reaction between Electroless Ni-P and Molten Tin / K.Chen(Loughborough University,UK),C.Liu, D.C. Whalley and D.A. Hutt 107
   Investigation of void-free Electroplating Method on Copper Column based Solder Bump for Flip-Chip Interconnections / Hiroshi Yamada(Toshiba Corporation) 112
Optoelectronics/Photonics
   Characterization of Au-Sn Eutectic Die Attach Process for Optoelectronics Device / Thang Tak-Seng(Lumileds Lighting(M)Sdn Bhd,Malaysia),Decai Sun,Huck-Khim Koay, Mohd-Fezley Sabudin,Jim Thompson,Paul Martin, Pradeep Rajkomar and Shatil Haque 118
   Propagation Loss Evaluation of Optical Transmission/Interconnect System with Grating Structure / Akiya Kimura(Osaka University),Kiyokazu Yasuda,Michiya Matsushima and Kozo Fujimoto 125
   A New Method of Birefringence Measurement to Obtain Stress Field Using Photoclasticity / Kenji Gomi(Tokyo Denki University),Kengo Shimizu,Hayato Suzuki, Shinichi Gohira,Yasushi Niitsu and Kensuke Ichinose 129
   Optimization of Epoxy Flow for Passive Alignment of Optical Fiber Arrays / Jeffery C.C.Lo(Hong Kong University of Science & Technology,Hong kong), Chung Yeung Li, Chung Leung Tai and S.W.Ricky Lee 132
Polymer Materials
   Study on Long Life Large-Deflective Hinges in Molded Pantograph Mechanisms based on Cyclic Load-Bending Fatigue Test / Mikio Horie(Tokyo Institute of Technology), Yudai Okabe, Masahiro Yamamoto and Daiki Kamiya 137
   Warpages of ACF-bonded COG Packages Induced from Manufacturing and Thermal Cycling / M.Y.Tsai(Chang Gung University,Taiwan), C.Y.Huang,C.Y.Chiang, W.C.Chen(ERSO/ITRI,Taiwan) and S.S. Yang 143
   Simulation of Tensile Deformation Behavior of Polymer by Chain Network Model / Akira Shinozaki(Tokyo Institute of Technology),Kikuo Kishimoto and Hirotsugu Inoue 150
   Effects of the Functional Groups of Non-Conductive Films(NCFs) on Materials Properties and Reliability of NCF Flip-Chip-On-Organic Boards / Chany-kyu Chung(KAIST,Korer),Woon-Seong Kwon,Jin-Hyoung Park, Soon-Bok Lee and Kyung-Wook Paik 156
   Effects of Low-modulus Die Attach Adhesive on Warpage and Damage of BGA / Sung Yi(Portland State University,USA), Paresh D.Daharwal(Intel Corporation,USA), Yeong.J.Lee(Motorola,USA)and Brian R.Harkness(Dow Corning,USA) 162
Thick & Thin Film Materials
   Hardness and Elastic Modulus of ZnO Deposited materials by PLD Method / Han-Ki Yoon(Dong-Eui University,Korea) and Yun-Sik Yu 169
   Mechanical properties of ITO/PET Thin Film Deposited by DC MG Method / Do-Hyoung Kim(Dong-Eui University,Korea),Han-ki Yoon, Do-Hoon Shin(University of Tokushima) and Riichi Murakami 174
   Formation and Characterization of Sputtered Thin Film for Optimizing Multilayered Interconnection Structure / Wataru Sashida(Kogakuin University) and Yuji Kimura 179
Packaging(1)
   Development of The Embedded LST Technology in PALAP / H.Kamiya(DENSO Corportion),T.Miyake, H.Kobasyashi, and K,Kondo 183
   Wafer-Scale BCB Resist-Processing Technologies for High density Intergration and Electronic Packaging / Rainer Pelzer(EV Group,Austria),Viorel Dragoi,Bart Swinnen(IMEC,Belgium),Philippe Soussan and Thorsten Matthias(EV Group,Austria) 187
   Microscale Magnetic Components for the Application of DC-DC Converters Operating in the 1-10 MHz Range / David Flynn(Heriot-Watt University,UK),Anthony Toon and Marc Desmulliez 192
   Low-Cost Active-Allignment of Single-Mode Fiber-Arrays / D. Weiland(Heriot Watt Universtity,UK), M.Luetzelschwab, M.P.Y.Desmulliez, A.Missoffe and C.Beck(TWI Ltd,UK) 199
   SAW Chemical Sensors based on AlGan/GaN Piezoelectric Material System: Acoustic Design and Packaging Considerations / L.Rufer(TIMA Lab,France), A.Torres, S.Mir, M.O.Alam(City University of Hong Kong, Hong Kong),T.Lalinsky(Slovak Academy of Sciences, Slovak Republic) and Y.C.Chan(City University of Hong Kong,Hong Kong) 204
Packaging(2)
   Evaluation of Thermal Deformation Behavior in Electronic Package using UV Moire Interferometry / Jin-Hyoung Park(KAIST,Korea)and Soon-Bok Lee 209
   Evaluation of Fatigue Strength for Solder Joints after Thermal Aging / Takeshi Miyazaki(Tokyo Institute of Technology), Masaki Omiya,Hirotsugu Inoue, Kikuo Kishimoto and Masazumi Amagai(Texas Instruments) 215
   Local Thermal Deformation and Residual Stress of a Thin Si Chip Mounted on a Substrate Using An Area-Arrayed Flip Chip Structure / Hideo Miura(Tohoku University),Nobuki Ueta and Yuhki Sato 220
   The Novel Flip Chip Ball Grid Array Design and Challenges to Enable Higher Routing Density and Power Requirement / Chee Wai Wong(Intel Technology,Malaysia),Chee Kheong Yoon and Seng Hooi Ong 226
   Fatigue Crack Growth in Lead-free Solder Joints / Masaki Omiya(Tokyo Institute of Technology), Kikuo Kishimoto and Masazumi Amagai(Texas Instrument) 232
Modeling & Simulation(1)
   A Study of Hot Spot in Silicon Device for Stacked Die Packages / Jotaro Akiyama(Texas Instruments Japan Limited),Masanobu Naeshiro and Masazumi Amagagai 238
   Modeling the Lamination Process for Ruggedised Displays / Yek Bing Lee(University of Greenwich, UK), Chris Bailey, Hua lu, Steve Riches,Martin Bartholomew and Nigel Tebbit 243
   Modeling and Simulation of a Fluid-driven Microturbine / Chanwut Sriphung(Heriot-Watt University,UK) and Resh Dhariwal 247
Modeling & Simulation(2)
   Stress Intensity Factors of Interface Corners / Chyanbin Hwu(National Cheng Kung University,Taiwan) and T.L.Kuo 252
   The Impact of Capacitors Selection and Placement to the ESL and ESR / Huang Jimmy Huat Since(Intel Microelectronic,Malaysia), Sijher Taninder S and Beh Jiun Kai 258
   Evaluation of Drop Impact Load for Portable Electronic Components / Takahiro Omori(Toshiba Corporation), Hirotsugu Inoue(Tokyo Institute of Technology), Noriyasu Kawamura(Toshiba Corporation), Minoru Mukai,Kikuo Kishimoto(Tokyo Institute of Technology) and Takashi Kawakami(Toshiba Corporation) 262
   Nonlinear Dynamic Behavior of Thin PCB Board for Solder Joint Reliability Study under Shock Loading / Loh Wei Keat(Intel Technology,Malaysia), Lee Yung Hsiang. Ajay A/I Murugayah and Tay,Tiong We 268
Thermal Management
   Turbulence Modelling for Electronic Cooling: A Review / K.Dhinsa(University of Greenwich,UK), C.Bailey and K.Pericleous 275
   Heat Conduction in Composites of Thermally Dissimilar Materials-A Methodology to Economize Numerical Heat Transfer Analysis of Electronic Components / Wataru Nakayama(ThermTech International) 282
   Critical Appraisal of Thermo-Mechanical Reliability of Medium-Power Heterojunction Bipolar Transistors for Base Station and Military Applications Mounted in SOIC-8 Leadframe Based Plastic Overmold Packages with Conductive Silver Epoxy / Satbir Madra(WJ Communications,Inc,USA) 288
   A Study in Establishing Flip-Chip Ball Grid Array(FCBGA) Second Level Interconnect(SLI)Reliability Requirement by CFD Simulation / Lee Eng Kwong(Intel Technology, Malaysia) and Tan wool Aun 292
   Electro-Themal Analysis of Device Interactions in Si CMOS Structure / Tomoyuki Hatakeyama(Tokyo institute of Technology), Kazuyoshi Fushinobu and Ken 296
KEYNOTE LECTURES
   The Story Behind the Red Phosphorus Mold Compound Device Failures / prof.Michael Pecht,University of Maryland,USA 1
   Semiconductor Integrated Circuit Packaging Technology Challenges-Next Five Years / Dr. Mario A. Bolanos, Texas Instruments Inc., USA 6
3.

図書

図書
edited by A. Steinbüchel and Y. Doi
出版情報: Weinheim : Wiley-VCH, c2005  ix, 764 p. ; 25 cm
シリーズ名: Biotechnology of biopolymers : from synthesis to patents / edited by A. Steinbüchel and Y. Doi ; v. 1
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Lignin, Coal, Polyisoprenoids, Polyesters and Polysaccharides. / Volume 1:
Preface.
Lignin and Coal. / I:
Synthesis of Lignin in Transgenic and Mutant Plants / Jeffrey F.D. Dean1:
Biotechnological Applications of Lignin-Degrading Fungi (White-Rot Fungi) / Gary M. Scott ; Masood Akhtar2:
Biotechnological Conversion of Coals into Upgraded Products / Horst Meyrahn ; Alexander. Steinb8chel3:
Polyisoprenoids. / II:
Biochemistry of Natural Rubber and Structure of Latex / Dhirayos Wititsuwannakul; Rapepun Wititsuwannakul.4:
Biotechnological Processes for Recycling of Rubber Products / Katarina Bredberg ; Magdalena Christiansson ; Bengt Stenberg ; Olle Holst5:
Biotechnological Processes for Desulfurization of Rubber Products / 6:
Polyesters. / III:
Metabolic Pathways and Engineering of PHA Biosynthesis / Kazunori Taguchi ; Seiichi Taguchi ; Kumar Sudesh ; Akira Maehara ; Takeharu Tsuge ; Yoshiharu Doi7:
Metabolic Flux Analysis on the Production of Poly(3-hydroxybutyrate) / Sang Yup Lee ; Soon Ho Hong ; Si Jae Park ; Richard van Wegen ; Anton P.J. Middelberg8:
Fermentative Production of Short-chain-length-PHAs / 9:
Fermentative Production of Medium-chain-length Poly(3-hydroxyalkanoate) / Ruud A. Weusthuis ; Birgit Kessler ; Marcia P.M. Dielissen ; Berbard Witholt ; Gerrit Eggink10:
Biosynthesis and Fermentative Production of Short-chain-length Medium-chain-length-PHAs / 11:
Production of Polyhydroxyalkanoates in Transgenic Plants / Yves Poirier ; Kenneth J. Gruys12:
Fermentative Production of Building Blocks for Chemical Synthesis of Polyesters / Sang Hyun Park ; Young Lee ; Seung Hwan Lee13:
Polysaccharides.14. Bacterial Cellulose / Stanislaw Bielecki ; Alina Krystynowicz ; Marianna Turkiewicz ; Halina KalinowskaIV:
Bioemulsans: Surface-active Polysaccharide-containing Complexes / Eugene Rosenberg ; Eliora Z. Ron15:
Curdlan / In-Young Lee16:
Succinoglycan / Miroslav Stredansky17:
Alginates from Bacteria / Bernd H.A. Rehm18:
Xanthan / Karin Born ; Virginie Langendorff ; Patrick Boulenguer19:
Dextran / Timothy D. Leathers20:
Levan / Sang-Ki Rhee ; Ki-Bang Song ; Chul-Ho Kim ; Buem-Seek Park ; Eun-Kyung Jang ; Ki-Hyo Jang21:
Hyaluronan / Peter Prehm22:
Exopolysaccharides of Lactic Acid Bacteria / Isabel Hallemeersch ; Sophie De Baets ; Erick J. Vandamme23:
Scleroglucan / Ioannis Giavasis ; Linda M. Harvey ; Brian McNeil24:
Schizophyllan / Udo Rau25:
Alginates from Algae / Kurt Ingar Draget ; Olav Smidsroslash;d ; Gudmund Skjaring;k-Braelig;k26:
Polyamides, Complex Proteinaceous Materials, Miscellaneous Polymers and General Aspects.V. Polyamides and Complex Proteinaceous Materials / Volume 2:
Cyanophycin / Fred Bernd Oppermann-Sanio ; Alexander Steinb8chel27:
Poly-gamma-glutamic Acid / Makoto Ashiuchi ; Haruo Misono28:
Modifications of Proteins and Poly (amino acids) by Enzymatic and Chemical Methods / Kousaku Ohkawa ; Hiroyuki Yamamoto29:
Biology and Technology of Silk Production / Fritz Vollrath ; David Knight30:
Fibrous proteins from Recombinant Microorganisms / Stephen R. Fahnestock31:
Spider Silk Proteins from Transgenic Plants / Juuml;rgen. Sch32:
Lignin, Coal, Polyisoprenoids, Polyesters and Polysaccharides. / Volume 1:
Preface.
Lignin and Coal. / I:
4.

図書

図書
edited by A. Steinbüchel and Y. Doi
出版情報: Weinheim : Wiley-VCH, c2005  ix p., p. 767-1185 ; 25 cm
シリーズ名: Biotechnology of biopolymers : from synthesis to patents / edited by A. Steinbüchel and Y. Doi ; v. 2
所蔵情報: loading…
目次情報: 続きを見る
Lignin, Coal, Polyisoprenoids, Polyesters and Polysaccharides. / Volume 1:
Preface.
Lignin and Coal. / I:
Synthesis of Lignin in Transgenic and Mutant Plants / Jeffrey F.D. Dean1:
Biotechnological Applications of Lignin-Degrading Fungi (White-Rot Fungi) / Gary M. Scott ; Masood Akhtar2:
Biotechnological Conversion of Coals into Upgraded Products / Horst Meyrahn ; Alexander. Steinb8chel3:
Polyisoprenoids. / II:
Biochemistry of Natural Rubber and Structure of Latex / Dhirayos Wititsuwannakul; Rapepun Wititsuwannakul.4:
Biotechnological Processes for Recycling of Rubber Products / Katarina Bredberg ; Magdalena Christiansson ; Bengt Stenberg ; Olle Holst5:
Biotechnological Processes for Desulfurization of Rubber Products / 6:
Polyesters. / III:
Metabolic Pathways and Engineering of PHA Biosynthesis / Kazunori Taguchi ; Seiichi Taguchi ; Kumar Sudesh ; Akira Maehara ; Takeharu Tsuge ; Yoshiharu Doi7:
Metabolic Flux Analysis on the Production of Poly(3-hydroxybutyrate) / Sang Yup Lee ; Soon Ho Hong ; Si Jae Park ; Richard van Wegen ; Anton P.J. Middelberg8:
Fermentative Production of Short-chain-length-PHAs / 9:
Fermentative Production of Medium-chain-length Poly(3-hydroxyalkanoate) / Ruud A. Weusthuis ; Birgit Kessler ; Marcia P.M. Dielissen ; Berbard Witholt ; Gerrit Eggink10:
Biosynthesis and Fermentative Production of Short-chain-length Medium-chain-length-PHAs / 11:
Production of Polyhydroxyalkanoates in Transgenic Plants / Yves Poirier ; Kenneth J. Gruys12:
Fermentative Production of Building Blocks for Chemical Synthesis of Polyesters / Sang Hyun Park ; Young Lee ; Seung Hwan Lee13:
Polysaccharides.14. Bacterial Cellulose / Stanislaw Bielecki ; Alina Krystynowicz ; Marianna Turkiewicz ; Halina KalinowskaIV:
Bioemulsans: Surface-active Polysaccharide-containing Complexes / Eugene Rosenberg ; Eliora Z. Ron15:
Curdlan / In-Young Lee16:
Succinoglycan / Miroslav Stredansky17:
Alginates from Bacteria / Bernd H.A. Rehm18:
Xanthan / Karin Born ; Virginie Langendorff ; Patrick Boulenguer19:
Dextran / Timothy D. Leathers20:
Levan / Sang-Ki Rhee ; Ki-Bang Song ; Chul-Ho Kim ; Buem-Seek Park ; Eun-Kyung Jang ; Ki-Hyo Jang21:
Hyaluronan / Peter Prehm22:
Exopolysaccharides of Lactic Acid Bacteria / Isabel Hallemeersch ; Sophie De Baets ; Erick J. Vandamme23:
Scleroglucan / Ioannis Giavasis ; Linda M. Harvey ; Brian McNeil24:
Schizophyllan / Udo Rau25:
Alginates from Algae / Kurt Ingar Draget ; Olav Smidsroslash;d ; Gudmund Skjaring;k-Braelig;k26:
Polyamides, Complex Proteinaceous Materials, Miscellaneous Polymers and General Aspects.V. Polyamides and Complex Proteinaceous Materials / Volume 2:
Cyanophycin / Fred Bernd Oppermann-Sanio ; Alexander Steinb8chel27:
Poly-gamma-glutamic Acid / Makoto Ashiuchi ; Haruo Misono28:
Modifications of Proteins and Poly (amino acids) by Enzymatic and Chemical Methods / Kousaku Ohkawa ; Hiroyuki Yamamoto29:
Biology and Technology of Silk Production / Fritz Vollrath ; David Knight30:
Fibrous proteins from Recombinant Microorganisms / Stephen R. Fahnestock31:
Spider Silk Proteins from Transgenic Plants / Juuml;rgen. Sch32:
Lignin, Coal, Polyisoprenoids, Polyesters and Polysaccharides. / Volume 1:
Preface.
Lignin and Coal. / I:
5.

図書

図書
Masanori Okuyama, Yoshihiro Ishibashi (eds.)
出版情報: Berlin ; Tokyo : Springer, c2005  xiii, 244 p. ; 24 cm
シリーズ名: Topics in applied physics ; v. 98
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Theoretical Aspects of Phase Transitions in Ferroelectric Thin Films
Chemical Solution Deposition of Layered-Structured Ferroelectric Thin Films
PB-Based Ferroelectric Thin Films Prepared by MOCVD
Spontaneous Polarization and Crystal Orientation Control of MOCVD PZT and Bi4Ti3O12-Based Films
Rhombohedral PZT Thin Films Prepared by Sputtering
Scanning Nonlinear Dielectric Microscope
Analysis of Ferroelectricity and Enhanced Piezoelectricity near Morphotropic Phase Boundary
Correlation between Domain Structures in Dielectric Properties in Single Crystals of Ferroelectric Solid Solutions
Relaxor Behaviors in Perovskite-Type Dielectric Compounds
Artificial Control of Ordered/Disordered State of B-Site Ions in Ba(Zr,Ti)O3 by a Superlattice Technique
Physics of Ferroelectric Interface: An Attempt to Nano-Ferrolectric Physics
Preparation and Property of Ferroelectic-Insulator-Semiconductor Junction Using YMNO3 Thin Film
Improvement of Memory Retention in Metal-Ferroelectric-Insulator-Semiconductor (MFIS) Structure
Theoretical Aspects of Phase Transitions in Ferroelectric Thin Films
Chemical Solution Deposition of Layered-Structured Ferroelectric Thin Films
PB-Based Ferroelectric Thin Films Prepared by MOCVD
6.

図書

図書
Наоми Суэнага ; перевод с японского Татьяны Редько-Добровольской
出版情報: Санкт-Петербург : Гиперион, 2005  349 p. ; 18 cm
シリーズ名: Terra nipponica ; 8
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7.

図書

図書
Нобуо Кодзима ; перевод с японского Марии Торопыгиной
出版情報: Санкт-Петербург : Гиперион, 2005  221 p. ; 18 cm
シリーズ名: Terra nipponica ; 11
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8.

図書

図書
Ёсиюки Дзюнноскэ ; перевод с японского Юры Окамото
出版情報: Санкт-Петербург : Гиперион, 2005  157 p. ; 18 cm
シリーズ名: Terra nipponica ; 12
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図書

図書
Исихара Синтаро ; перевод с японского Александра Мещерякова
出版情報: Санкт-Петербург : Гиперион, 2005  380 p. ; 18 cm
シリーズ名: Terra nipponica ; 13
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10.

図書

図書
Peter Y. Yu, Manuel Cardona
出版情報: Berlin : Springer Verlag, 2005, c2001  xviii, 639 p. ; 25 cm
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Introduction / 1:
A Survey of Semiconductors / 1.1:
Elemental Semiconductors / 1.1.1:
Binary Compounds / 1.1.2:
Oxides / 1.1.3:
Layered Semiconductors / 1.1.4:
Organic Semiconductors / 1.1.5:
Magnetic Semiconductors / 1.1.6:
Other Miscellaneous Semiconductors / 1.1.7:
Growth Techniques / 1.2:
Czochralski Method / 1.2.1:
Bridgman Method / 1.2.2:
Chemical Vapor Deposition / 1.2.3:
Molecular Beam Epitaxy / 1.2.4:
Liquid Phase Epitaxy / 1.2.5:
Summary
Electronic Band Structures / 2:
Quantum Mechanics / 2.1:
Translational Symmetry and Brillouin Zones / 2.2:
A Pedestrian's Guide to Group Theory / 2.3:
Definitions and Notations / 2.3.1:
Symmetry Operations of the Diamond and Zinc-Blende Structures / 2.3.2:
Representations and Character Tables / 2.3.3:
Some Applications of Character Tables / 2.3.4:
Empty Lattice or Nearly Free Electron Energy Bands / 2.4:
Nearly Free Electron Band Structure in a Zinc-Blende Crystal / 2.4.1:
Nearly Free Electron Energy Bands in Diamond Crystals / 2.4.2:
Band Structure Calculation by Pseudopotential Methods / 2.5:
Pseudopotential Form Factors in Zinc-Blende- and Diamond-Type Semiconductors / 2.5.1:
Empirical and Self-Consistent Pseudopotential Methods / 2.5.2:
The kċp Method of Band-Structure Calculations / 2.6:
Effective Mass of a Nondegenerate Band Using the kċp Method / 2.6.1:
Band Dispersion near a Degenerate Extremum: Top Valence Bands in Diamondand Zinc-Blende-Type Semiconductors / 2.6.2:
Tight-Binding or LCAO Approach to the Band Structure of Semiconductors / 2.7:
Molecular Orbitals and Overlap Parameters / 2.7.1:
Band Structure of Group-IV Elements by the Tight-Binding Method / 2.7.2:
Overlap Parameters and Nearest-Neighbor Distances / 2.7.3:
Problems
Vibrational Properties of Semiconductors, and Electron-Phonon Interactions / 3:
Phonon Dispersion Curves of Semiconductors / 3.1:
Models for Calculating Phonon Dispersion Curves of Semiconductors / 3.2:
Force Constant Models / 3.2.1:
Shell Model / 3.2.2:
Bond Models / 3.2.3:
Bond Charge Models / 3.2.4:
Electron-Phonon Interactions / 3.3:
Strain Tensor and Deformation Potentials / 3.3.1:
Electron-Acoustic-Phonon Interaction at Degenerate Bands / 3.3.2:
Piezoelectric Electron-Acoustic-Phonon Interaction / 3.3.3:
Electron-Optical-Phonon Deformation Potential Interactions / 3.3.4:
Frohlich Interaction / 3.3.5:
Interaction Between Electrons and Large-Wavevector Phonons: Intervalley Electron-Phonon Interaction / 3.3.6:
Electronic Properties of Defects / 4:
Classification of Defects / 4.1:
Shallow or Hydrogenic Impurities / 4.2:
Effective Mass Approximation / 4.2.1:
Hydrogenic or Shallow Donors / 4.2.2:
Donors Associated with Anisotropic Conduction Bands / 4.2.3:
Acceptor Levels in Diamond-and Zinc-Blende-Type Semiconductors / 4.2.4:
Deep Centers / 4.3:
Green's Function Method for Calculating Defect Energy Levels / 4.3.1:
An Application of the Green's Function Method: Linear Combination of Atomic Orbitals / 4.3.2:
Another Application of the Green's Function Method: Nitrogen in GaP and Ga AsP Alloys / 4.3.3:
Final Note on Deep Centers / 4.3.4:
Electrical Transport / 5:
Quasi-Classical Approach / 5.1:
Carrier Mobility for a Nondegenerate Electron Gas / 5.2:
Relaxation Time Approximation / 5.2.1:
Nondegenerate Electron Gas in a Parabolic Band / 5.2.2:
Dependence of Scattering and Relaxation Times on Electron Energy / 5.2.3:
Momentum Relaxation Times / 5.2.4:
Temperature Dependence of Mobilities / 5.2.5:
Modulation Doping / 5.3:
High-Field Transport and Hot Carrier Effects / 5.4:
Velocity Saturation / 5.4.1:
Negative Differential Resistance / 5.4.2:
Gunn Effect / 5.4.3:
Magneto-Transport and the Hall Effect / 5.5:
Magneto-Conductivity Tensor / 5.5.1:
Hall Effect / 5.5.2:
Hall Coefficient for Thin Film Samples (van der Pauw Method) / 5.5.3:
Hall Effect for a Distribution of Electron Energies / 5.5.4:
Optical Properties I / 6:
Macroscopic Electrodynamics / 6.1:
Digression: Units for the Frequency of Electromagnetic Waves / 6.1.1:
Experimental Determination of Optical Constants / 6.1.2:
Kramers-Kronig Relations / 6.1.3:
The Dielectric Function / 6.2:
Experimental Results / 6.2.1:
Microscopic Theory of the Dielectric Function / 6.2.2:
Joint Density of States and Van Hove Singularities / 6.2.3:
Van Hove Singularities in ϵi / 6.2.4:
Direct Absorption Edges / 6.2.5:
Indirect Absorption Edges / 6.2.6:
""""Forbidden"""" Direct Absorption Edges / 6.2.7:
Excitons / 6.3:
Exciton Effect at M0 Critical Points / 6.3.1:
Absorption Spectra of Excitons / 6.3.2:
Exciton Effect at M1 Critical Points or Hyperbolic Excitons / 6.3.3:
Exciton Effect at M3 Critical Points / 6.3.4:
Phonon-Polaritons and Lattice Absorption / 6.4:
Phonon-Polaritons / 6.4.1:
Lattice Absorption and Reflection / 6.4.2:
Multiphonon Lattice Absorption / 6.4.3:
Dynamic Effective Ionic Charges in Heteropolar Semiconductors / 6.4.4:
Absorption Associated with Extrinsic Electrons / 6.5:
Free-Carrier Absorption in Doped Semiconductors / 6.5.1:
Absorption by Carriers Bound to Shallow Donors and Acceptors / 6.5.2:
Modulation Spectroscopy / 6.6:
Frequency Modulated Reflectance and Thermoreflectance / 6.6.3:
Piezoreflectance / 6.6.4:
Electroreflectance (Franz-Keldysh Effect) / 6.6.5:
Photoreflectance / 6.6.6:
Reflectance Difference Spectroscopy / 6.6.7:
Optical Properties II / 7:
Emission Spectroscopies / 7.1:
Band-to-Band Transitions / 7.1.1:
Free-to-Bound Transitions / 7.1.2:
Donor-Acceptor Pair Transitions / 7.1.3:
Excitons and Bound Excitons / 7.1.4:
Luminescence Excitation Spectroscopy / 7.1.5:
Light Scattering Spectroscopies / 7.2:
Macroscopic Theory of Inelastic Light Scattering by Phonons / 7.2.1:
Raman Tensor and Selection Rules / 7.2.2:
Experimental Determination of Raman Spectra / 7.2.3:
Microscopic Theory of Raman Scattering / 7.2.4:
A Detour into the World of Feynman Diagrams / 7.2.5:
Brillouin Scattering / 7.2.6:
Experimental Determination of Brillouin Spectra / 7.2.7:
Resonant Raman and Brillouin Scattering / 7.2.8:
Photoelectron Spectroscopy / 8:
Photoemission / 8.1:
Angle-Integrated Photoelectron Spectra of the Valence Bands / 8.1.1:
Angle-Resolved Photoelectron Spectra of the Valence Bands / 8.1.2:
Core Levels / 8.1.3:
Inverse Photoemission
Surface Effects / 8.2:
Surface States and Surface Reconstruction / 8.3.1:
Surface Energy Bands / 8.3.2:
Fermi Level Pinning and Space Charge Layers / 8.3.3:
Effect of Quantum Confinement on Electrons and Phonons in Semiconductors / 9:
Quantum Confinement and Density of States / 9.1:
Quantum Confinement of Electrons and Holes / 9.2:
Semiconductor Materials for Quantum Wells and Superlattices / 9.2.1:
Classification of Multiple Quantum Wells and Superlattices / 9.2.2:
Confinement of Energy Levels of Electrons and Holes / 9.2.3:
Some Experimental Results / 9.2.4:
Phonons in Superlattices / 9.3:
Phonons in Superlattices: Folded Acoustic and Confined Optic Modes / 9.3.1:
Folded Acoustic Modes: Macroscopic Treatment / 9.3.2:
Confined Optical Modes: Macroscopic Treatment / 9.3.3:
Electrostatic Effects in Polar Crystals: Interface Modes / 9.3.4:
Raman Spectra of Phonons in Semiconductor Superlattices / 9.4:
Raman Scattering by Folded Acoustic Phonons / 9.4.1:
Raman Scattering by Confined Optical Phonons / 9.4.2:
Raman Scattering by Interface Modes / 9.4.3:
Macroscopic Models of Electron-LO Phonon (Fröhlich) Interaction in Multiple Quantum Wells / 9.4.4:
Electrical Transport: Resonant Tunneling / 9.5:
Resonant Tunneling Through a Double-Barrier Quantum Well / 9.5.1:
I-V Characteristics of Resonant Tunneling Devices / 9.5.2:
Quantum Hall Effects in Two-Dimensional Electron Gases / 9.6:
Landau Theory of Diamagnetism in a Three-Dimensional Free Electron Gas / 9.6.1:
Magneto-Conductivity of a Two-Dimensional Electron Gas: Filling Factor / 9.6.2:
The Experiment of von Klitzing, Pepper and Dorda / 9.6.3:
Explanation of the Hall Plateaus in the Integral Quantum Hall Effect / 9.6.4:
Concluding Remarks / 9.7:
Appendix: Pioneers of Semiconductor Physics Remember
Ultra-Pure Germanium: From Applied to Basic Research or an Old Semiconductor Offering New Opportunities / Eugene E. Haller
Two Pseudopotential Methods: Empirical and Ab Initio / Marvin L. Cohen
The Early Stages of Band-Structures Physics and Its Struggles for a Place in the Sun / Conyers Herring
Cyclotron Resonance and Structure of Conduction and Valence Band Edges in Silicon and Germanium / Charles Kittel
Optical Properties of Amorphous Semiconductors and Solar Cells / Jan Tauc
Optical Spectroscopy of Shallow Impurity Centers / Elias Burstein
On the Prehistory of Angular Resolved Photoemission / Neville V. Smith
The Discovery and Very Basics of the Quantum Hall Effect / Klaus von Klitzing
The Birth of the Semiconductor Superlattice / Leo Esaki
References
Subject Index
Table of Fundamental Physical Constants (Inside Front Cover)
Table of Units (Inside Back Cover)
Introduction / 1:
A Survey of Semiconductors / 1.1:
Elemental Semiconductors / 1.1.1:
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