| Preface |
| Materials Research Society Symposium Proceedings |
| CMP Modeling |
| Three-Dimensional Wafer Process Model for Nanotopography / Takafumi Yoshida |
| A Model of Chemical Mechanical Polishing: The Role of Inhibitors / Ed Paul ; Robert Vacassy |
| Re-Examining the Physical Basis of Pattern Density and Step Height CMP Models / Xiaolin Xie ; Tae Park ; Brian Lee ; Tamba Tugbawa ; Hong Cai ; Duane Boning |
| Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization / Ara Philipossian ; Erin Mitchell |
| Study of Slurry Composition Transition in a Rotary Copper CMP Process / Sharath Hegde ; Udaya B. Patri ; Anurag Jindal ; S.V. Babu |
| In Situ Temperature Measurement During Oxide Chemical Mechanical Planarization / Jesse Cornely ; Chris Rogers ; Vincent Manno |
| News from the M in CMP--Viscosity of CMP Slurries, A Constant? / W. Lortz ; F. Menzel ; R. Brandes ; F. Klaessig ; T. Knothe ; T. Shibasaki |
| Atomistic Mechanisms Underlying Chemical Mechanical Planarization of Copper / Y.Y. Ye ; R. Biswas ; A. Bastawros ; A. Chandra |
| Dynamic Contact Characteristics During Chemical Mechanical Polishing (CMP) / Wonseop Choi ; Seung-Mahn Lee ; Rajiv K. Singh |
| Spectral Analysis of Frictional Forces in ILD CMP / Daniel Rosales-Yeomans ; Leslie Charns ; Toshiroh Doy ; Masaharu Kinoshita |
| CMP Science |
| Single Asperity Chemical Mechanical Wear Studied by Atomic Force Microscopy / Forrest Stevens ; Steve Langford ; J. Thomas Dickinson |
| The Effect of Pad Properties on Planarity in a CMP Process / Hoyoung Kim ; Dong-Woon Park ; Chang-Ki Hong ; Woo-Sung Han ; Joo-Tae Moon |
| Multi-Scale Characterization of Pad Role on Material Removal Rate in CMP / Sunil D. Gouda ; Ashraf Bastawros ; Abhijit Chandra |
| Pad Degradation During CMP Process: Effect of Soak in Slurry and Water on Thermal and Mechanical Properties of the CMP Pads / A. Tregub ; G. Ng ; M. Moinpour |
| Transfer Wear During Cu CMP / H. Liang ; G. Helen Xu ; J.M. Martin ; Th. Le Mongne |
| Effect of Pad Surface Texture and Slurry Abrasive Concentration on Tribological and Kinetic Attributes of ILD CMP / Scott Olsen |
| Transient Electrochemical Measurements During Copper Chemical Mechanical Polishing / Valentin Craciun |
| A Novel CMP Process on Fixed Abrasive Pads for the Manufacturing of Highly Planar Thick Film SOI Substrates / Martin Kulawski ; Kimmo Henttinen ; Ilkka Suni ; Frauke Weimar ; Jari Makinen |
| CMP Slurries, Particles |
| Ta/Low-k CMP With Colloidal Silica Particles / Patrice Beaud ; Didier Bouvet ; Pierre Fazan ; Eric Jacquinot ; Hiroyuki Aoki ; Tomoko Aoki |
| Effect of Ceria Particle-Size Distribution and Pressure Interactions in Chemo-Mechanical Polishing (CMP) of Dielectric Materials / Naga Chandrasekaran ; Ted Taylor ; Gundu Sabde |
| Interaction Between Ceria and Hydroxylamine / Subramanian Tamilmani ; Jilei Shan ; Wayne Huang ; Srini Raghavan ; Robert Small ; Cass Shang ; Brandon Scott |
| The Effects of Particle Adhesion in Chemical Mechanical Polishing / Zhenyu Lu ; Egon Matijevic |
| CeO[subscript 2] Particles for Chemical Mechanical Planarization / Xiandong Feng ; Yie-Shein Her ; W. Linda Zhang ; Jackie Davis ; Eric Oswald ; Jin Lu ; Vicky Bryg ; Sara Freeman ; Dave Gnizak |
| CMP Topics, Including Novel Devices |
| Slurry Admittance and Its Effect on Polishing / David R. Evans |
| Dispersion Number Studies in Chemical Mechanical Planarization |
| Slurry Development for Cu/Ultra Low-k CMP / Hugh Li ; Matt VanHaneham ; John Quanci |
| CMP Revisited for the MEMS/Foundry Era / Lawrence Camilletti |
| Effect of Tool Kinematics, Brush Pressure and Cleaning Fluid pH on Coefficient of Friction and Tribology of Post-CMP PVA Brush Scrubbing Processes / Lateef Mustapha |
| Planarization of Patterned Aluminum/Diamond Surfaces for SAW Devices / Anthony S. Holland ; Geoffrey K. Reeves ; Patrick W. Leech |
| The Development of a Direct-Polish Process for STI CMP / Antonella Martin ; Giulia Spinolo ; Sonia Morin ; Maurizio Bacchetta ; Francesca Frigerio ; Benjamin A. Bonner ; Peter McKeever ; Maurizio Tremolada ; Anand Iyer |
| Copper and Barrier Slurries |
| Supramolecular Abrasive-Free System for Cu CMP / Jason Keleher ; Ken Rushing ; Joe Zhao ; Bill Wojtczak ; Yuzhuo Li |
| Electrochemical Measurements Demonstrate Performance of BTAH and Alternative Passivating Agents on Copper in a Hydroxylamine CMP System / Melvin Keith Carter |
| Selectivity Studies on Tantalum Barrier Layer in Copper CMP / Arun Vijayakumar ; Tianbao Du ; Kalpathy B. Sundaram ; Vimal Desai |
| Electrochemical Studies of Copper Chemical Mechanical Polishing Mechanism: Effects of Oxidizer Concentration / J. Lu ; J.E. Garland ; C.M. Petite ; D. Roy |
| Mechanisms of Passivation of Copper in CMP Slurries Containing Peroxide and Glycine / Ling Wang ; Fiona M. Doyle |
| The pH Effect on Chemical Mechanical Planarization of Copper |
| Comparison of Glycine and Citric Acid as Complexing Agents in Copper Chemical-Mechanical Polishing Slurries / Venkata Gorantla |
| Slurries for Copper Damascene Patterning: Similarities and Differences / A. Jindal ; G. Rajagopalan ; M. Gupta ; J.-Q. Lu ; K. Rose ; R.J. Gutmann |
| Polishing Behavior of the Various Interconnect Thin Films in Cu Damascene Process With Different Slurries / Parshuram B. Zantye ; Arun K. Sikder ; Ashok Kumar |
| Chemical-Mechanical Planarization of Copper: The Effect of Inhibitor and Complexing Agent / Ying Luo |
| CMP Integration |
| Mechanical Modeling of the 2D Interfacial Slurry Pressure in CMP / C. Fred Higgs III ; Sum Huan Ng ; Inho Yoon ; Lei Shan ; Lipkong Yap ; Steven Danyluk |
| A New Cleaning Technique for Corrosion Protection on Aluminum Metallization / Masako Kodera ; Shin-ichiro Uekusa ; Yoshitaka Matsui ; Naoto Miyashita ; Atsushi Shigeta ; Shinya Takahashi ; Murato Kawai ; Hiroshi Kawamoto ; Manabu Tsujimura |
| Delamination Behavior of Cu-Low-k Stack Under Different Slurries / A.K. Sikder ; S. Thagella ; P.B. Zantye |
| Integration Challenges for Chemical Mechanical Polishing of Cu/Low-k Interconnects / Jeffrey A. Lee ; Mansour Moinpour ; Huey-Chiang Liou ; Thomas Abell |
| Integrated Chip-Scale Prediction of Copper Interconnect Topography / Chidi Chidambaram ; Chris Borst ; Greg Shinn |
| Author Index |
| Subject Index |
| Preface |
| Materials Research Society Symposium Proceedings |
| CMP Modeling |
図書
