| 1.
図書 |
図書
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[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society
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| 2.
図書 |
図書
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Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Components, Assemblies & Materials Association (ECA) ; Electronic components sector of the Electronic Industries Alliance
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| 3.
図書 |
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sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by C. H. Amon ... [et al.]
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| 4.
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[sponsored by IEEE Electron Devices Society, IEEE Components Packaging and Manufacturing Technology Society, Semiconductor Equipment & Materials International (SEMI), and Society of Applied Physics of Japan]
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| 5.
図書 |
図書
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co-sponsored by : International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packing, and Manufacturing Technology (CPMT), Georgia Institute of Technology, Packaging Research Center (PRC) ; general chair, James E. Morris ; technical chairs, Andreas Schubert
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| 6.
図書 |
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Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Components, Assemblies & Materials Association (ECA) ; Electronic components sector of the Electronic Industries Alliance
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| 7.
図書 |
図書
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sponsored by IEEE, Components, Packaging, and Manufacturing Technology Society
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| 8.
図書 |
図書
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sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers
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| 9.
図書 |
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[sponsored by] IEEE Components, Packaging and Manufacturing Technology Society
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| 10.
図書 |
図書
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sponsored jointly by the Components, Packaging, and Manufacturing Technology (CPMT) Society of the IEEE and the Electronic Components, Assemblies & Materials Association (ECA), the Electronic Components Sector of the Electronic Industries Alliance
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