| 1.
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[sponsored by IEEE Electron Devices Society, IEEE Components Packaging and Manufacturing Technology Society, Semiconductor Equipment & Materials International (SEMI), and Society of Applied Physics of Japan]
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| 2.
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図書
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sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers
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| 3.
図書 |
図書
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[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society, NIST
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| 4.
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図書
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sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
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| 5.
図書 |
図書
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[co-sponsored by IEEE, CPMT, SEMI]
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| 6.
図書 |
図書
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sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
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| 7.
図書 |
図書
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editors: Keyun Bi, Peter G. Barnwell, Jiaji Wang ; sponsored by: Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with: IEEE-CPMT (USA) ... [et al.]
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| 8.
図書 |
図書
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sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
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| 9.
図書 |
図書
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sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
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| 10.
図書 |
図書
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edited by Mahadevan K. Iyer, Toh Kok Chuan, Mui Yew Cheong ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE CPMT Society, IMAPS
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