
1.
図書 |
[sponsored by IEEE Electron Devices Society, IEEE Components Packaging and Manufacturing Technology Society, Semiconductor Equipment & Materials International (SEMI), and Society of Applied Physics of Japan]
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2.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers
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3.
図書 |
[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society, NIST
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4.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
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5.
図書 |
[co-sponsored by IEEE, CPMT, SEMI]
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6.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
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7.
図書 |
editors: Keyun Bi, Peter G. Barnwell, Jiaji Wang ; sponsored by: Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with: IEEE-CPMT (USA) ... [et al.]
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8.
図書 |
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
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9.
図書 |
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
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10.
図書 |
edited by Mahadevan K. Iyer, Toh Kok Chuan, Mui Yew Cheong ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE CPMT Society, IMAPS
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