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1.

電子ブック
ＥＢ
1. Advanced Signal Integrity For High-Speed Digital Designs
Stephen H. Hall, Howard L. Heck, Howard L. Heck
出版情報: Wiley Online Library - AutoHoldings Books , John Wiley & Sons, Inc., 2009
所蔵情報: loading…
目次情報: 続きを見る
Preface
Introduction: The Importance of Signal Integrity / 1：
Computing Power: Past and Future / 1.1：
The Problem / 1.2：
The Basics / 1.3：
A New Realm of Bus Design / 1.4：
Scope of the Book / 1.5：
Summary / 1.6：
References
Electromagnetic Fundamentals for Signal Integrity / 2：
Maxwell's Equations / 2.1：
Common Vector Operators / 2.2：
Vector / 2.2.1：
Dot Product / 2.2.2：
Cross Product / 2.2.3：
Vector and Scalar Fields / 2.2.4：
Flux / 2.2.5：
Gradient / 2.2.6：
Divergence / 2.2.7：
Curl / 2.2.8：
Wave Propagation / 2.3：
Wave Equation / 2.3.1：
Relation Between E and H and the Transverse Electromagnetic Mode / 2.3.2：
Time-Harmonic Fields / 2.3.3：
Propagation of Time-Harmonic Plane Waves / 2.3.4：
Electrostatics / 2.4：
Electrostatic Scalar Potential in Terms of an Electric Field / 2.4.1：
Energy in an Electric Field / 2.4.2：
Capacitance / 2.4.3：
Energy Stored in a Capacitor / 2.4.4：
Magnetostatics / 2.5：
Magnetic Vector Potential / 2.5.1：
Inductance / 2.5.2：
Energy in a Magnetic Field / 2.5.3：
Power Flow and the Poynting Vector / 2.6：
Time-Averaged Values / 2.6.1：
Reflections of Electromagnetic Waves / 2.7：
Plane Wave Incident on a Perfect Conductor / 2.7.1：
Plane Wave Incident on a Lossless Dielectric / 2.7.2：
Problems
Ideal Transmission-Line Fundamentals / 3：
Transmission-Line Structures / 3.1：
Wave Propagation on Loss-Free Transmission Lines / 3.2：
Electric and Magnetic Fields on a Transmission Line / 3.2.1：
Telegrapher's Equations / 3.2.2：
Equivalent Circuit for the Loss-Free Case / 3.2.3：
Wave Equation in Terms of LC / 3.2.4：
Transmission-Line Properties / 3.3：
Transmission-Line Phase Velocity / 3.3.1：
Transmission-Line Characteristic Impedance / 3.3.2：
Effective Dielectric Permittivity / 3.3.3：
Simple Formulas for Calculating the Characteristic Impedance / 3.3.4：
Validity of the TEM Approximation / 3.3.5：
Transmission-Line Parameters for the Loss-Free Case / 3.4：
Laplace and Poisson Equations / 3.4.1：
Transmission-Line Parameters for a Coaxial Line / 3.4.2：
Transmission-Line Parameters for a Microstrip / 3.4.3：
Charge Distribution Near a Conductor Edge / 3.4.4：
Charge Distribution and Transmission-Line Parameters / 3.4.5：
Field Mapping / 3.4.6：
Transmission-Line Reflections / 3.5：
Transmission-Line Reflection and Transmission Coefficient / 3.5.1：
Launching an Initial Wave / 3.5.2：
Multiple Reflections / 3.5.3：
Lattice Diagrams and Over- or Underdriven Transmission Lines / 3.5.4：
Lattice Diagrams for Nonideal Topologies / 3.5.5：
Effect of Rise and Fall Times on Reflections / 3.5.6：
Reflections from Reactive Loads / 3.5.7：
Time-Domain Reflectometry / 3.6：
Measuring the Characteristic Impedance and Delay of a Transmission Line / 3.6.1：
Measuring Inductance and Capacitance of Reactive Structures / 3.6.2：
Understanding the TDR Profile / 3.6.3：
Crosstalk / 4：
Mutual Inductance and Capacitance / 4.1：
Mutual Inductance / 4.1.1：
Mutual Capacitance / 4.1.2：
Field Solvers / 4.1.3：
Coupled Wave Equations / 4.2：
Wave Equation Revisited / 4.2.1：
Coupled Line Analysis / 4.2.2：
Impedance and Velocity / 4.3.1：
Coupled Noise / 4.3.2：
Modal Analysis / 4.4：
Modal Decomposition / 4.4.1：
Modal Impedance and Velocity / 4.4.2：
Reconstructing the Signal / 4.4.3：
Modal Analysis of Lossy Lines / 4.4.4：
Crosstalk Minimization / 4.5：
Nonideal Conductor Models / 4.6：
Signals Propagating in Unbounded Conductive Media / 5.1：
Propagation Constant for Conductive Media / 5.1.1：
Skin Depth / 5.1.2：
Classic Conductor Model for Transmission Lines / 5.2：
Dc Losses in Conductors / 5.2.1：
Frequency-Dependent Resistance in Conductors / 5.2.2：
Frequency-Dependent Inductance / 5.2.3：
Power Loss in a Smooth Conductor / 5.2.4：
Surface Roughness / 5.3：
Hammerstad Model / 5.3.1：
Hemispherical Model / 5.3.2：
Huray Model / 5.3.3：
Conclusions / 5.3.4：
Transmission-Line Parameters for Nonideal Conductors / 5.4：
Equivalent Circuit, Impedance, and Propagation Constant / 5.4.1：
Telegrapher's Equations for a Real Conductor and a Perfect Dielectric / 5.4.2：
Electrical Properties of Dielectrics / 6：
Polarization of Dielectrics / 6.1：
Electronic Polarization / 6.1.1：
Orientational (Dipole) Polarization / 6.1.2：
Ionic (Molecular) Polarization / 6.1.3：
Relative Permittivity / 6.1.4：
Classification of Dielectric Materials / 6.2：
Frequency-Dependent Dielectric Behavior / 6.3：
Dc Dielectric Losses / 6.3.1：
Frequency-Dependent Dielectric Model: Single Pole / 6.3.2：
Anomalous Dispersion / 6.3.3：
Frequency-Dependent Dielectric Model: Multipole / 6.3.4：
Infinite-Pole Model / 6.3.5：
Properties of a Physical Dielectric Model / 6.4：
Relationship Between ?' and ?" / 6.4.1：
Mathematical Limits / 6.4.2：
Fiber-Weave Effect / 6.5：
Physical Structure of an FR4 Dielectric and Dielectric Constant Variation / 6.5.1：
Mitigation / 6.5.2：
Modeling the Fiber-Weave Effect / 6.5.3：
Environmental Variation in Dielectric Behavior / 6.6：
Environmental Effects on Transmission-Line Performance / 6.6.1：
Modeling the Effect of Relative Humidity on an FR4 Dielectric / 6.6.2：
Transmission-Line Parameters for Lossy Dielectrics and Realistic Conductors / 6.7：
Telegrapher's Equations for Realistic Conductors and Lossy Dielectrics / 6.7.1：
Differential Signaling / 7：
Removal of Common-Mode Noise / 7.1：
Differential Crosstalk / 7.2：
Virtual Reference Plane / 7.3：
Propagation of Modal Voltages / 7.4：
Common Terminology / 7.5：
Drawbacks of Differential Signaling / 7.6：
Mode Conversion / 7.6.1：
Reference / 7.6.2：
Mathematical Requirements for Physical Channels / 8：
Frequency-Domain Effects in Time-Domain Simulations / 8.1：
Linear and Time Invariance / 8.1.1：
Time- and Frequency-Domain Equivalencies / 8.1.2：
Frequency Spectrum of a Digital Pulse / 8.1.3：
System Response / 8.1.4：
Single-Bit (Pulse) Response / 8.1.5：
Requirements for a Physical Channel / 8.2：
Causality / 8.2.1：
Passivity / 8.2.2：
Stability / 8.2.3：
Network Analysis for Digital Engineers / 9：
High-Frequency Voltage and Current Waves / 9.1：
Input Reflection into a Terminated Network / 9.1.1：
Input Impedance / 9.1.2：
Network Theory / 9.2：
Impedance Matrix / 9.2.1：
Scattering Matrix / 9.2.2：
ABCD Parameters / 9.2.3：
Cascading S-Parameters / 9.2.4：
Calibration and Deembedding / 9.2.5：
Changing the Reference Impedance / 9.2.6：
Multimode S-Parameters / 9.2.7：
Properties of Physical S-Parameters / 9.3：
Reality / 9.3.1：
Subjective Examination of S-Parameters / 9.3.3：
Topics in High-Speed Channel Modeling / 10：
Creating a Physical Transmission-Line Model / 10.1：
Tabular Approach / 10.1.1：
Generating a Tabular Dielectric Model / 10.1.2：
Generating a Tabular Conductor Model / 10.1.3：
NonIdeal Return Paths / 10.2：
Path of Least Impedance / 10.2.1：
Transmission Line Routed Over a Gap in the Reference Plane / 10.2.2：
Vias / 10.2.3：
Via Resonance / 10.3.1：
Plane Radiation Losses / 10.3.2：
Parallel-Plate Waveguide / 10.3.3：
I/O Circuits and Models / 11：
I/O Design Considerations / 11.1：
Push-Pull Transmitters / 11.2：
Operation / 11.2.1：
Linear Models / 11.2.2：
Nonlinear Models / 11.2.3：
Advanced Design Considerations / 11.2.4：
CMOS receivers / 11.3：
Modeling / 11.3.1：
ESD Protection Circuits / 11.3.3：
On-Chip Termination / 11.4.1：
Bergeron Diagrams / 11.5.1：
Theory and Method / 11.6.1：
Limitations / 11.6.2：
Open-Drain Transmitters / 11.7：
Differential Current-Mode Transmitters / 11.7.1：
Low-Swing and Differential Receivers / 11.8.1：
IBIS Models / 11.9.1：
Model Structure and Development Process / 11.10.1：
Generating Model Data / 11.10.2：
Differential I/O Models / 11.10.3：
Example of an IBIS File / 11.10.4：
Equalization / 11.11：
Analysis and Design Background / 12.1：
Maximum Data Transfer Capacity / 12.1.1：
Linear Time-Invariant Systems / 12.1.2：
Ideal Versus Practical Interconnects / 12.1.3：
Equalization Overview / 12.1.4：
Continuous-Time Linear Equalizers / 12.2：
Passive CTLEs / 12.2.1：
Active CTLEs / 12.2.2：
Discrete Linear Equalizers / 12.3：
Transmitter Equalization / 12.3.1：
Coefficient Selection / 12.3.2：
Receiver Equalization / 12.3.3：
Nonidealities in DLEs / 12.3.4：
Adaptive Equalization / 12.3.5：
Decision Feedback Equalization / 12.4：
Modeling and Budgeting of Timing Jitter and Noise / 12.5：
Eye Diagram / 13.1：
Bit Error Rate / 13.2：
Worst-Case Analysis / 13.2.1：
Bit Error Rate Analysis / 13.2.2：
Jitter Sources and Budgets / 13.3：
Jitter Types and Sources / 13.3.1：
System Jitter Budgets / 13.3.2：
Noise Sources and Budgets / 13.4：
Noise Sources / 13.4.1：
Noise Budgets / 13.4.2：
Peak Distortion Analysis Methods / 13.5：
Superposition and the Pulse Response / 13.5.1：
Worst-Case Bit Patterns and Data Eyes / 13.5.2：
Peak Distortion Analysis Including Crosstalk / 13.5.3：
System Analysis Using Response Surface Modeling / 13.5.4：
Model Design Considerations / 14.1：
Case Study: 10-Gb/s Differential PCB Interface / 14.2：
RSM Construction by Least Squares Fitting / 14.3：
Measures of Fit / 14.4：
Residuals / 14.4.1：
Fit Coefficients / 14.4.2：
Significance Testing / 14.5：
Model Significance: The F-Test / 14.5.1：
Parameter Significance: Individual t-Tests / 14.5.2：
Confidence Intervals / 14.6：
Sensitivity Analysis and Design Optimization / 14.7：
Defect Rate Prediction Using Monte Carlo Simulation / 14.8：
Additional RSM Considerations / 14.9：
Useful Formulas, Identities, Units, and Constants / 14.10：
Four-Port Conversions Between T- and S-Parameters / Appendix B：
Critical Values of the F-Statistic / Appendix C：
Critical Values of the T-Statistic / Appendix D：
Causal Relationship Between Skin Effect Resistance and Internal Inductance for Rough Conductors / Appendix E：
Spice Level 3 Model for 0.25 ?m MOSIS Process / Appendix F：
Index
Preface
Introduction: The Importance of Signal Integrity / 1：
Computing Power: Past and Future / 1.1：
2.

電子ブック
ＥＢ
2. Advanced signal integrity for high-speed digital designs / (: electronic bk)
Stephen H. Hall, Howard L. Heck
出版情報: Hoboken, N.J. : Wiley : IEEE, 〓2009  1 online resource (xvii, 660 pages)
所蔵情報: loading…
目次情報: 続きを見る
Preface
Acknowledgments
Introduction: The importance of signal integrity. / Chapter 1：
Computing Power: Past and Future / 1.1：
The problem / 1.2：
The Basics / 1.3：
A new realm of bus design / 1.4：
Scope / 1.5：
Summary / 1.6：
References / 1.7：
Electromagnetic Fundamentals for Signal Integrity. / Chapter 2：
Introduction / 2.1：
MaxwellÆs Equations / 2.2：
Common Vector Operators / 2.3：
Wave Propagation / 2.4：
Electrostatics / 2.5：
Magnetostatics / 2.6：
Power Flow and the Poynting Vector / 2.7：
Reflections of Electromagnetic Waves / 2.8：
Problems / 2.9：
Ideal Transmission Line Fundamentals. / Chapter 3：
Transmission Line Structures / 3.1：
Wave propagation on loss free transmission lines / 3.2：
Transmission line properties / 3.3：
Transmission line parameters for the loss free case / 3.4：
Transmission line reflections / 3.5：
Time domain Reflectometry / 3.6：
Crosstalk. / 3.7：
Mutual Inductance and Capacitance / 4.1：
Coupled Wave Equations / 4.2：
Coupled Line Analysis / 4.3：
Modal Analysis / 4.4：
Crosstalk Minimization / 4.5：
Non-ideal conductor models for transmission lines. / 4.6：
Signals propagating in an unbounded conductive media / 5.1：
Classic conductor model for transmission lines / 5.2：
Surface Roughness / 5.3：
Transmission line parameters with a non-ideal conductor / 5.4：
Electrical properties of dielectrics. / 5.5：
Polarization of dielectrics / 6.1：
Classification of dielectric materials / 6.2：
Frequency dependent dielectric behavior / 6.3：
Properties of a physical dielectric model / 6.4：
The fiber-weave effect / 6.5：
Environmental variation in dielectric behavior / 6.6：
Transmission line parameters for lossy dielectrics and realistic conductors / 6.7：
Differential signaling. / 6.8：
Removal of common mode noise / 7.1：
Differential Crosstalk / 7.2：
Virtual reference plane / 7.3：
Propagation of Modal Voltages / 7.4：
Common terminology / 7.5：
Drawbacks of differential signaling / 7.6：
Mathematical Requirements of Physical Channels. / 7.7：
Frequency domain effects in time domain simulations / 8.1：
Requirements for a physical Channel / 8.2：
Network Analysis for Digital Engineers. / 8.3：
High frequency voltage and current waves / 9.1：
Network Theory / 9.2：
Properties of Physical S-parameters / 9.3：
Topics in High-Speed Channel Modeling. / 9.4：
Creating a physical transmission line mode / 10.1：
Non-Ideal Return Paths / 10.2：
Vias / 10.3：
I/O Circuits and Models. / 10.4：
Push-Pull Transmitters / 11.1：
CMOS Receivers / 11.3：
ESD Protection Circuits / 11.4：
On-Chip Termination / 11.5：
Bergeron Diagrams / 11.6：
Open Drain Transmitters / 11.7：
Differential Current Mode Transmitters / 11.8：
Low Swing/Differential Receivers / 11.9：
IBIS Models / 11.10：
Equalization. / 11.11：
Continuous Time Linear Equalizers / 12.1：
Discrete Linear Equalizers / 12.3：
Decision Feedback Equalization / 12.4：
Modeling and Budgeting of Timing Jitter and Noise. / 12.5：
The Eye Diagram / 13.1：
Bit Error Rate / 13.2：
Jitter Sources and Budgets / 13.3：
Noise Sources and Budgets / 13.4：
Peak Distortion Analysis Methods / 13.5：
System Analysis Using Response Surface Modeling. / 13.6：
Case Study: 10 Gb/s differential PCB interface / 14.1：
RSM Construction by Least Squares Fitting / 14.3：
Measures of Fit / 14.4：
Significance Testing / 14.5：
Confidence Intervals / 14.6：
Sensitivity Analysis and Design Optimization / 14.7：
Defect Rate Prediction Using Monte Carlo Simulation / 14.8：
Additional RSM Considerations / 14.9：
Useful formulae, identities, units and constants / 14.10：
4-port Conversions between T and S-parameters / Appendix B：
Critical values of the F-statistic / Appendix C：
Critical values of the t-statistic. / Appendix D：
Derivation of the internal inductance using the Hilbert Transform / Appendix E：
Introduction: The importance of signal integrity
Electromagnetic Fundamentals for Signal Integrity
Maxwell's Equations
Ideal Transmission Line Fundamentals
Crosstalk
Non-ideal conductor models for transmission lines
Electrical properties of dielectrics
Differential signaling
Mathematical Requirements of Physical Channels
Network Analysis for Digital Engineers
Topics in High-Speed Channel Modeling
I/O Circuits and Models
Equalization
Modeling and Budgeting of Timing Jitter and Noise
Introduction: The Importance of Signal Integrity / 13<$$$>：
The Problem
A New Realm of Bus Design
Scope of the Book
Maxwell's Equations / 2：
Vector / 2.2.1：
Dot Product / 2.2.2：
Cross Product / 2.2.3：
Vector and Scalar Fields / 2.2.4：
Flux / 2.2.5：
Gradient / 2.2.6：
Divergence / 2.2.7：
Curl / 2.2.8：
Wave Equation / 2.3.1：
Relation Between E and H and the Transverse Electromagnetic Mode / 2.3.2：
Time-Harmonic Fields / 2.3.3：
Propagation of Time-Harmonic Plane Waves / 2.3.4：
Electrostatic Scalar Potential in Terms of an Electric Field / 2.4.1：
Energy in an Electric Field / 2.4.2：
Capacitance / 2.4.3：
Energy Stored in a Capacitor / 2.4.4：
Magnetic Vector Potential / 2.5.1：
Inductance / 2.5.2：
Energy in a Magnetic Field / 2.5.3：
Time-Averaged Values / 2.6.1：
Plane Wave Incident on a Perfect Conductor / 2.7.1：
Plane Wave Incident on a Lossless Dielectric / 2.7.2：
Ideal Transmission-Line Fundamentals / 3：
Transmission-Line Structures
Wave Propagation on Loss-Free Transmission Lines
Electric and Magnetic Fields on a Transmission Line / 3.2.1：
Telegrapher's Equations / 3.2.2：
Equivalent Circuit for the Loss-Free Case / 3.2.3：
Wave Equation in Terms of LC / 3.2.4：
Transmission-Line Properties
Transmission-Line Phase Velocity / 3.3.1：
Transmission-Line Characteristic Impedance / 3.3.2：
Effective Dielectric Permittivity / 3.3.3：
Simple Formulas for Calculating the Characteristic Impedance / 3.3.4：
Validity of the TEM Approximation / 3.3.5：
Transmission-Line Parameters for the Loss-Free Case
Laplace and Poisson Equations / 3.4.1：
Transmission-Line Parameters for a Coaxial Line / 3.4.2：
Transmission-Line Parameters for a Microstrip / 3.4.3：
Charge Distribution Near a Conductor Edge / 3.4.4：
Charge Distribution and Transmission-Line Parameters / 3.4.5：
Field Mapping / 3.4.6：
Transmission-Line Reflections
Transmission-Line Reflection and Transmission Coefficient / 3.5.1：
Launching an Initial Wave / 3.5.2：
Multiple Reflections / 3.5.3：
Lattice Diagrams and Over- or Underdriven Transmission Lines / 3.5.4：
Lattice Diagrams for Nonideal Topologies / 3.5.5：
Effect of Rise and Fall Times on Reflections / 3.5.6：
Reflections from Reactive Loads / 3.5.7：
Time-Domain Reflectometry
Measuring the Characteristic Impedance and Delay of a Transmission Line / 3.6.1：
Measuring Inductance and Capacitance of Reactive Structures / 3.6.2：
Understanding the TDR Profile / 3.6.3：
Mutual Inductance / 4：
Mutual Capacitance / 4.1.2：
Field Solvers / 4.1.3：
Wave Equation Revisited / 4.2.1：
Impedance and Velocity / 4.2.2：
Coupled Noise / 4.3.2：
Modal Decomposition / 4.4.1：
Modal Impedance and Velocity / 4.4.2：
Reconstructing the Signal / 4.4.3：
Modal Analysis of Lossy Lines / 4.4.4：
Nonideal Conductor Models / 5：
Signals Propagating in Unbounded Conductive Media
Propagation Constant for Conductive Media / 5.1.1：
Skin Depth / 5.1.2：
Classic Conductor Model for Transmission Lines
Dc Losses in Conductors / 5.2.1：
Frequency-Dependent Resistance in Conductors / 5.2.2：
Frequency-Dependent Inductance / 5.2.3：
Power Loss in a Smooth Conductor / 5.2.4：
Hammerstad Model / 5.3.1：
Hemispherical Model / 5.3.2：
Huray Model / 5.3.3：
Conclusions / 5.3.4：
Transmission-Line Parameters for Nonideal Conductors
Equivalent Circuit, Impedance, and Propagation Constant / 5.4.1：
Telegrapher's Equations for a Real Conductor and a Perfect Dielectric / 5.4.2：
Electrical Properties of Dielectrics / 6：
Polarization of Dielectrics
Electronic Polarization / 6.1.1：
Orientational (Dipole) Polarization / 6.1.2：
Ionic (Molecular) Polarization / 6.1.3：
Relative Permittivity / 6.1.4：
Classification of Dielectric Materials
Frequency-Dependent Dielectric Behavior
Dc Dielectric Losses / 6.3.1：
Frequency-Dependent Dielectric Model: Single Pole / 6.3.2：
Anomalous Dispersion / 6.3.3：
Frequency-Dependent Dielectric Model: Multipole / 6.3.4：
Infinite-Pole Model / 6.3.5：
Properties of a Physical Dielectric Model
Relationship Between ?' and ?" / 6.4.1：
Mathematical Limits / 6.4.2：
Fiber-Weave Effect
Physical Structure of an FR4 Dielectric and Dielectric Constant Variation / 6.5.1：
Mitigation / 6.5.2：
Modeling the Fiber-Weave Effect / 6.5.3：
Environmental Variation in Dielectric Behavior
Environmental Effects on Transmission-Line Performance / 6.6.1：
Modeling the Effect of Relative Humidity on an FR4 Dielectric / 6.6.2：
Transmission-Line Parameters for Lossy Dielectrics and Realistic Conductors
Telegrapher's Equations for Realistic Conductors and Lossy Dielectrics / 6.7.1：
Differential Signaling / 7：
Removal of Common-Mode Noise
Virtual Reference Plane
Common Terminology
Drawbacks of Differential Signaling
Mode Conversion / 7.6.1：
Reference / 7.6.2：
Mathematical Requirements for Physical Channels / 8：
Frequency-Domain Effects in Time-Domain Simulations
Linear and Time Invariance / 8.1.1：
Time- and Frequency-Domain Equivalencies / 8.1.2：
Frequency Spectrum of a Digital Pulse / 8.1.3：
System Response / 8.1.4：
Single-Bit (Pulse) Response / 8.1.5：
Requirements for a Physical Channel
Causality / 8.2.1：
Passivity / 8.2.2：
Stability / 8.2.3：
High-Frequency Voltage and Current Waves / 9：
Input Reflection into a Terminated Network / 9.1.1：
Input Impedance / 9.1.2：
Impedance Matrix / 9.2.1：
Scattering Matrix / 9.2.2：
ABCD Parameters / 9.2.3：
Cascading S-Parameters / 9.2.4：
Calibration and Deembedding / 9.2.5：
Changing the Reference Impedance / 9.2.6：
Multimode S-Parameters / 9.2.7：
Properties of Physical S-Parameters
Reality / 9.3.1：
Subjective Examination of S-Parameters / 9.3.3：
Creating a Physical Transmission-Line Model / 10：
Tabular Approach / 10.1.1：
Generating a Tabular Dielectric Model / 10.1.2：
Generating a Tabular Conductor Model / 10.1.3：
NonIdeal Return Paths
Path of Least Impedance / 10.2.1：
Transmission Line Routed Over a Gap in the Reference Plane / 10.2.2：
Via Resonance / 10.2.3：
Plane Radiation Losses / 10.3.2：
Parallel-Plate Waveguide / 10.3.3：
I/O Design Considerations / 11：
Operation / 11.2.1：
Linear Models / 11.2.2：
Nonlinear Models / 11.2.3：
Advanced Design Considerations / 11.2.4：
CMOS receivers
Modeling / 11.3.1：
Theory and Method / 11.3.3：
Limitations / 11.6.2：
Open-Drain Transmitters
Differential Current-Mode Transmitters / 11.7.1：
Low-Swing and Differential Receivers / 11.8.1：
Model Structure and Development Process / 11.9.1：
Generating Model Data / 11.10.2：
Differential I/O Models / 11.10.3：
Example of an IBIS File / 11.10.4：
Analysis and Design Background / 12：
Maximum Data Transfer Capacity / 12.1.1：
Linear Time-Invariant Systems / 12.1.2：
Ideal Versus Practical Interconnects / 12.1.3：
Equalization Overview / 12.1.4：
Continuous-Time Linear Equalizers
Passive CTLEs / 12.2.1：
Active CTLEs / 12.2.2：
Transmitter Equalization / 12.3.1：
Coefficient Selection / 12.3.2：
Receiver Equalization / 12.3.3：
Nonidealities in DLEs / 12.3.4：
Adaptive Equalization / 12.3.5：
Eye Diagram / 13：
Worst-Case Analysis / 13.2.1：
Bit Error Rate Analysis / 13.2.2：
Jitter Types and Sources / 13.3.1：
System Jitter Budgets / 13.3.2：
Noise Sources / 13.4.1：
Noise Budgets / 13.4.2：
Superposition and the Pulse Response / 13.5.1：
Worst-Case Bit Patterns and Data Eyes / 13.5.2：
Peak Distortion Analysis Including Crosstalk / 13.5.3：
System Analysis Using Response Surface Modeling / 13.5.4：
Model Design Considerations
Case Study: 10-Gb/s Differential PCB Interface
Residuals / 14.4.1：
Fit Coefficients / 14.4.2：
Model Significance: The F-Test / 14.5.1：
Parameter Significance: Individual t-Tests / 14.5.2：
Useful Formulas, Identities, Units, and Constants
Four-Port Conversions Between T- and S-Parameters
Critical Values of the F-Statistic
Critical Values of the T-Statistic
Causal Relationship Between Skin Effect Resistance and Internal Inductance for Rough Conductors
Spice Level 3 Model for 0.25 ?m MOSIS Process / Appendix F：
Index
Preface
Acknowledgments
Introduction: The importance of signal integrity. / Chapter 1：
3.

図書
図書
3. ホール&ヘック高速デジタル回路設計 : アドバンスト・シグナルインテグリティ
Stephen H. Hall, Howard L. Heck [著] ; 荒井正史 [ほか] 訳
出版情報: 東京 : 丸善出版, 2012.1  xix, 627p ; 21cm
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