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1.

図書
図書
1. 1994 proceedings : Sixth annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA (: soft. ; : case. ; : micro.)
sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society ; edited by R. Mike Lea and Stuart Tewksbury
出版情報: Los Alamitos, Ca. ; Tokyo : IEEE Computer Society Press, c1994  ix, 404 p. ; 24 cm
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2.

図書
図書
2. 1995 proceedings : Seventh annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA (: soft. ; : case. ; : micro.)
sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society ; edited by Stuart Tewksbury and Glenn Chapman
出版情報: Piscataway, N.J. : IEEE, c1995  ix, 382 p. ; 24 cm
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