| Preface |
| Materials Research Society Sy mposium Proceedings |
| Novel Interconnect Concepts |
| 3D System Integration Technologies / Peter Ramm ; Armin Klumpp ; Reinhard Merkel ; Josef Weber ; Robert Wieland ; Andreas Ostmann ; Jurgen Wolf |
| Air Bridge Technology: A Comparison of Novel Interconnect Materials and Integration Schemes for Beyond 45 nm / Kenneth Foster ; Joost Waeterloos ; Don Frye ; Steve Froelicher ; Mike Mills |
| Wafer Thinning for Monolithic 3D Integration / A. Jindal ; J.-Q. Lu ; Y. Kwon ; G. Rajagopalan ; J.J. McMahon ; A.Y. Zeng ; H.K. Flesher ; T.S. Cale ; R.J. Gutmann |
| Dielectric Glue Wafer Bonding for 3D ICs |
| AlCu Pattern Generation on 3D Structured Wafer Using Multi Level Exposure Method on Electrodeposited Polymer Material / Vineet Sharma ; Arief B. Suriadi ; Frank Berauer ; Laurie S. Mittelstadt |
| Sequential Process Modeling for Determining Process-Induced Thermal Stress in Advanced Cu/Low-k Interconnects / Kwanho Yang ; Joost J. Waeterloos ; Jang-Hi Im ; Michael E. Mills |
| Interconnect Processing and Reliability |
| Some Aspects of the Materials Science of Low-k Integration / Vincent McGahay |
| Silicides for the 65 nm Technology Node / Paul R. Besser ; Simon Chan ; Eric Paton ; Thorsten Kammler ; David Brown ; Paul King ; Laura Pressley |
| Dual Damascene Process for Fat Wires in Copper/FSG Technology / J. Gambino ; T. Stamper ; H. Trombley ; S. Luce ; F. Allen ; C. Weinstein ; B. Reuter ; M. Dunbar ; V. Samek ; P. McLaughlin ; T. Kane |
| Adhesion Enhancement for Multiple Level Cu/SiLK Integration / X.T. Chen ; D. Lu ; Y.T. Tan ; Y.W. Chen ; P.D. Foo |
| Assessment of Reliability of Cap Layers Used in Cu-Black Diamond Interconnects / Ahila Krishnamoorthy ; N.Y. Huang ; Shu-Yunn Chong |
| A Study of Atomic Layer Deposition and Reactive Plasma Compatibility With Mesoporous Organosilicate Glass Films / E. Todd Ryan ; Melissa Freeman ; Lynne Svedberg ; J.J. Lee ; Todd Guenther ; Jim Connor ; Katie Yu ; Jianing Sun ; David W. Gidley |
| Electromigration |
| Impact of Low-k Dielectrics on Electromigration Reliability for Cu Interconnects / Paul S. Ho ; Ki-Don Lee ; Ennis T. Ogawa ; Sean Yoon ; Xia Lu |
| Quantitative Characterization of Dislocation Structure Coupled With Electromigration in a Passivated Al (0.5 wt% Cu) Interconnects / R.I. Barabash ; N. Tamura ; B.C. Valek ; R. Spolenak ; J.C. Bravman ; G.E. Ice ; J.R. Patel |
| Properties and Barrier Material Interactions of Electroless Copper Used for Seed Enhancement / C. Witt ; K. Pfeifer |
| Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect Trees / C.L. Gan ; C.V. Thompson ; K.L. Pey ; W.K. Choi ; C.W. Chang ; Q. Guo |
| Electromigration Study of Cu Dual-Damascene Interconnects with a CVD MSQ Low-k Dielectric / Hideki Matsuhashi ; Michael Lu ; Kai Zhang |
| Electromigration of Lower and Upper Cu Lines in Dual-Damascene Cu Interconnects / Guo Qiang ; Anand V. Vairagar ; Subodh Mhaisalkar |
| Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects / G. Zhang ; C.M. Tan ; Z.H. Gan ; K. Prasad ; D.H. Zhang |
| Near-Threshold Electromigration of Damascene Copper on TiN Barrier / William K. Meyer ; Raj Solanki ; David Evans |
| Mechanical Properties of Thin Films |
| Interfacial Relationships in Microelectronic Devices / Michael Lane ; Robert Rosenberg |
| Indentation Fracture Toughness Measurements of Low Dielectric Constant Materials / Dylan J. Morris ; Robert F. Cook |
| Environmental Effects on Subcritical Delamination of Dielectric and Metal Films From Organosilicate Glass (OSG) Thin Films / Y. Lin ; J.J. Vlassak ; T.Y. Tsui ; A.J. McKerrow |
| Using Multi-Dimensional Contact Mechanics Experiments to Measure Poisson's Ratio of Porous Low-k Films / B.N. Lucas ; J.C. Hay ; W.C. Oliver |
| Quantitative Measurements of Subcritical Debonding of Cu Films From Glass Substrates / M. Pang ; S.P. Baker |
| Low-k Dielectrics |
| Advanced Characterization of Ultra-Low-k Periodic Porous Silica Films--Pore Size Distribution, Pore-Diameter Anisotropy, and Size and Macroscopic Isotropy of Domain Structure / N. Hata ; C. Negoro ; S. Takada ; K. Yamada ; Y. Oku ; T. Kikkawa |
| Characterization of Nanoporous Low-k Thin Films by Contrast Match SANS / Ronald C. Hedden ; Barry J. Bauer ; Hae-Jeong Lee |
| Determination of Pore Size Distributions in Nano-Porous Thin Films From Small Angle Scattering / Christopher L. Soles ; Da-Wei Liu |
| Development and Application of On-Wafer Small Angle X-ray Scattering for the Quantification of Pore Morphology in Low-k Porous SiLK Semiconductor Dielectrics / Brian Landes ; Brandon Kern ; Ted Stokich ; Jason Niu ; Dorie Yontz ; Mike Radler ; Carol Mohler|cKacee Ouellette ; Sebring Lucero ; Jerry Hahnfeld ; Danny King ; John Quintana ; Steve Weigand |
| Evaluation of Copper Ion Drift in Low-Dielectric-Constant Interlayer Films by Transient Capacitance Spectroscopy / Takenobu Yoshino ; Nobuhiro Hata ; Takamaro Kikkawa |
| Spectrum of Defect States in Porous Organic Low-k Dielectric Films, Annealed in Argon and Nitrogen / V. Ligatchev ; T.K.S. Wong ; T.K. Goh ; Rusli ; Suzhu Yu |
| Solvent Diffusion in Porous Low-k Dielectric Films / Denis Shamiryan ; Karen Maex |
| The Study of Modified Layers in SiCOH Dielectrics Using Spectroscopic Ellipsometry / Marcus A. Worsley ; Stacey F. Bent ; Stephen M. Gates ; Kaushik Kumar ; Timothy Dalton ; Jeffrey C. Hedrick |
| Structure and Properties of Polysilsesquioxanes and Copolymers for Ultra-Low Dielectric Films / Do Y. Yoon ; Hyun Wook Ro ; Eun Su Park ; Jin-Kyu Lee ; Hie-Joon Kim ; Kookheon Char ; Hee-Woo Rhee ; Dongil Kwon |
| Organofluorosilicate Glass (OFSG): A Dense Low-k Dielectric With Superior Materials Properties / M.L. O'Neill ; Y.L. Cheng ; A.S. Lukas ; Y.L. Wang ; E.J. Karwacki ; M.S. Feng ; R.N. Vrtis ; J.L. Vincent ; B.K. Peterson ; M.D. Bitner |
| Plasma Enhanced Chemical Vapor Deposition of Porous Organosilicate Glass ILD Films With k [less than or equal] 2.4 / Raymond N. Vrtis ; Mark L. O'Neill ; Jean L. Vincent ; Aaron S. Lukas ; Brian K. Peterson ; Mark D. Bitner ; Eugene J. Karwacki |
| Development of Porous SiLK Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes / R.J. Strittmatter ; J.L. Hahnfeld ; H.C. Silvis ; T.M. Stokich ; J.D. Perry ; K.B. Ouellette ; Q.J. Niu ; J.P. Godschalx ; T.H. Kalantar ; E. Mubarekyan ; R.E. Hefner Jr.|cJ.W. Lyons ; J.M. Dominowski ; G.R. Buske |
| Mechanical Properties of Organosilicon Thin Films Deposited From Cyclic and Acyclic Precursors Using Water as an Oxidant / Daniel D. Burkey ; Karen K. Gleason |
| Accelerated Oxidation of Hydrogen Silsesquioxane Thin Films Facilitated by an Organosilicone Resin Additive / Brian R. Harkness ; Ron Boisvert ; Qian Deng ; Ben Zhong ; David Gidley |
| New Nano-Porous Composite Films of Silsesquioxane Polymer and Silicalite-1 for Low Dielectric Applications / Ruo Qing Su ; Gabriela Zadrozna ; Thomas E. Muller ; Johannes A. Lercher |
| Creating Nanoporosity by Selective Extraction of Porogens Using Supercritical Carbon Dioxide/Cosolvent Processes / B. Lahlouh ; T. Rajagopalan ; J.A. Lubguban ; N. Biswas ; S. Gangopadhyay ; J. Sun ; D. Huang ; S.L. Simon ; H.C. Kim ; W. Volksen ; R.D. Miller |
| Supercritical Carbon Dioxide-Based Fluids Used as a Recovery Tool for Low-k Materials / Rosa A. Orozco-Teran ; Brian P. Gorman ; Zhengping Zhang ; Dennis W. Mueller ; Richard F. Reidy |
| Effects of Supercritical CO[subscript 2] Drying and Photoresist Strip on Low-k Films / R.F. Reidy ; R.A. Orozco-Teran ; B.P. Gorman ; D.W. Mueller |
| Nanoporous Silica Films Derived From Structural Controllable Poly(silsesquioxane) Oligomers by Templating / Wei-Chih Liu ; Yang-Yen Yu ; Wen-Chang Chen |
| The Characterization and Preparation of Porous Low Dielectric Films Using Various Cyclodextrins as Template Materials / Jin-Heong Yim ; Jung-Bae Kim ; Hyun-Dam Jeong ; Yi-Yeoul Lyu ; Sang Kook Mah ; Jingyu Hyeon-Lee ; Kwang Hee Lee ; Seok Chang ; Lyong Sun Pu ; Y.F. Hu ; J.N. Sun ; D.W. Gildley |
| Optimized Materials Properties for Organosilicate Glasses Produced by Plasma-Enhanced Chemical Vapor Deposition |
| Electrical, Mechanical, and Structural Properties of Fluoro-Containing Poly(silsesquioxanes) Based Porous Low-k Thin Films / Jihoon Rhee ; Jungbae Kim |
| Plasma Hydrogenation--A New Method of Reducing the k Value of the Low-k Polyimide Film / Yue Kuo ; Taewoo Chung ; Helinda Nominanda |
| Expanding Thermal Plasma for Low-k Dielectrics Deposition / M. Creatore ; Y. Barrell ; W.M.M. Kessels ; M.C.M. van de Sanden |
| Stress Stability of PECVD Silicon Nitride Films During Device Fabrication / Michael P. Hughey |
| Characterization of Boron Carbo-Nitride Films Deposited by Low Temperature Chemical Vapor Deposition / E.R. Engbrecht ; C.J. Cilino ; K.H. Junker ; Y-M. Sun ; J.M. White ; J.G. Ekerdt |
| MIM Capacitors With HfO[subscript 2] and HfAlO[subscript x] for Si RF and Analog Applications / Xiongfei Yu ; Chunxiang Zhu ; Hang Hu ; Albert Chin ; M.F. Li ; B.J. Cho ; Dim-Lee Kwong ; M.B. Yu |
| Material and Electrical Characterization of HfO[subscript 2] Films for MIM Capacitors Application / Y.F. Lu ; Y.H. Wu ; T. Liew ; N. Yakovlev |
| Metal Films |
| Observation of Grain Growth in Cu Films by In Situ EBSD Analysis / D.P. Field ; M.M. Nowell ; O.V. Kononenko |
| Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects / G. Steinlesberger ; M. Engelhardt ; G. Schindler ; W. Steinhogl ; M. Traving ; W. Honlein ; E. Bertagnolli |
| AFM Studies of Deformation and Interfacial Sliding in Interconnect Structures in Microelectronic Devices / C. Park ; I. Dutta ; K.A. Peterson ; J. Vella |
| Effect of Barrier Layers on the Texture and Microstructure of Copper Films / Tejodher Muppidi ; David P. Field ; John E. Sanchez |
| Grain Boundary Characteristics and Stress-Induced Damage Morphologies in Sputtered and Electroplated Copper Films / Hyun Park ; Soo-Jung Hwang ; Kyu Hwan Oh ; Young-Chang Joo |
| High-Frequency Heterodyne Force Microscopy Investigations of Copper Interconnects / Yuegui Zheng ; Robert Geer |
| A Novel Technique to Re-Construct 3D Void in Passivated Metal Interconnects / Cher Ming Tan ; Zhenghao Gan ; Guan Zhang ; Krishnamachar Prasad ; Dao Hua Zhang |
| Characterization of Electroplated Copper Films With Laser-Generated Surface Acoustic Waves / A.A. Maznev ; M. Gostein ; S.H. Brongersma |
| Detection of Voids in Tungsten Interconnect Vias Using Laser-Induced Surface Acoustic Waves / Joshua Tower ; Michael Gostein ; Koichi Otsubo ; Atsushi Kawasaki |
| Copper Oxidation Studied by In Situ Raman Spectroscopy / Robert Schennach ; Andreas Gupper |
| The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum-Based Thin Films for Copper Diffusion Barrier Applications / Degang Cheng ; Eric T. Eisenbraun |
| Characterization of CVD Ti[subscript x]C[subscript y]N[subscript z] Films Deposited as Diffusion Barriers for Cu on Low-k Dielectrics Methylsilsequiazane / W.C. Gau ; P.T. Liu ; T.C. Chang ; L.J. Chen |
| Characterization of Atomic Layer Deposited WN[subscript x]C[subscript y] Thin Film as a Diffusion Barrier for Copper Metallization / Soo-Hyun Kim ; Su Suk Oh ; Hyun-Mi Kim ; Dae-Hwan Kang ; Ki-Bum Kim ; Wei-Min Li ; Suvi Haukka ; Marko Tuominen |
| Enhancement of Copper Wetting via Surfactant-Based Post-Treatment of Ultra-Thin Atomic Layer Deposited Tantalum Nitride Liners / Oscar van der Straten ; Yu Zhu ; Kathleen Dunn ; Alain Kaloyeros |
| Vapor Treatment of Copper Surface Using Organic Acids / Kenji Ishikawa ; Teruo Yagishita ; Moritaka Nakamura |
| Anisotropic Plasma Chemical Vapor Deposition of Copper Films in Trenches / Kosuke Takenaka ; Masao Onishi ; Manabu Takenshita ; Toshio Kinoshita ; Kazunori Koga ; Masaharu Shiratani ; Yukio Watanabe |
| Effect of Plasma Pre-Treatment on Dewetting Properties of CVD Cu on CVD W[subscript 2]N Barrier Layer / Guillermo Nuesca ; Eric Eisenbraun |
| The Correlation of Adhesion Strength With Barrier Structure in Cu Metallization / A. Sekiguchi ; J. Koike ; K. Ueoka ; J. Ye ; H. Okamura ; N. Otsuka ; S. Ogawa ; K. Maruyama |
| The Formation of Low Temperature Cu[subscript 3]Si in Ag(Cu)/Si Structure Upon Annealing and Its Effects on Adhesion and Resistivity / Sungjin Hong ; Seob Lee ; Yeonkyu Ko ; Jaegab Lee |
| Deposition and Characteristics of Tantalum Nitride Films by Plasma Assisted Atomic Layer Deposition as Cu Diffusion Barrier / Kyoung-Il Na ; Se-Jong Park ; Woo-Cheol Jeong ; Se-Hoon Kim ; Sung-Eun Boo ; Nam-Jin Bae ; Jung-Hee Lee |
| Enhanced Adhesion of Cu Film on a Low-k Material by Using Ti Glue Layer, B Dopant and N[subscript 2] Plasma Treatment / Y.K. Ko ; S. Lee ; H.J. Yang ; C. Shim ; D. Jung ; J.G. Lee |
| Reduced Time for Uniform Etching of Cu Power Planes During FIB Editing / V.V. Makarov ; W.B. Thompson ; T.R. Lundquist |
| Author Index |
| Subject Index |
| Preface |
| Materials Research Society Sy mposium Proceedings |
| Novel Interconnect Concepts |
図書
