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1.

図書
図書
1. Applications of experimental mechanics to electronic packaging : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California
sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling
出版情報: New York : American Society of Mechanical Engineers, c1995  v, 117 p. ; 28 cm
シリーズ名: EEP ; vol. 13
AMD ; vol. 214
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2.

図書
図書
2. Applications of experimental mechanics to electronic packaging 1997 : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu
出版情報: New York : American Society of Mechanical Engineers, c1997  vi, 136 p. ; 28 cm
シリーズ名: EEP ; vol. 22
AMD ; vol. 226
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