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1.

図書

図書
sponsored by the Fuels and Combustion Technologies Division, ASME, the Nuclear Engineering Division, ASME, the Power Division, ASME
出版情報: New York : American Society of Mechanical Engineers, c2001  2 v. ; 28 cm.
所蔵情報: loading…
目次情報:
v. 1. Fuels and combustion technologies
v. 2. Nuclear Engineering Power
v. 1. Fuels and combustion technologies
v. 2. Nuclear Engineering Power
2.

図書

図書
sponsored by the Fuels and Combustion Technologies Division, ASME ... [et al.]
出版情報: New York : American Society of Mechanical Engineers, c1998  2 v. ; 28 cm.
シリーズ名: FACT ; vol. 22
PWR ; vol. 33
所蔵情報: loading…
目次情報: 続きを見る
The Future
Matching Customer Information Needs With RandD Strategy: Predicting Market Demographics to Achieve Market Driven Innovation / Ralph W. Wyndrum, Jr
Microelectronics: It Is Polymer World in the 21st Century / Rao R. Tummala
High-Speed, Low-Loss Polymer Optical Fiber / Yasuhiro Koike ; Takaaki Ishigure
Modeling of the Mechanical Behavior of Polymers / S. Matsuoka
Physics of Polymeric Materials
Effects of Temperature on Viscoelastic Properties of Thermosetting Resin During Curing Process / Kozo Ikegami ; Hiroaki Matsui
A Novel Positive Working Photosensitive Polybenzoxazole for Semiconductor Surface Coating / Takashi Hirano ; Toshio Banba ; Hiroaki Makabe
Crazing in Thin Polymer Films / T. N. Krupenkin
Thermal Phenomena In Polymeric Materials and Plastic Packages of Ic Devices
Improvement of the Thermo-Mechanical Performance of Advanced Packages by Experimentally Assisted FE-Analysis / Bernd Michel ; Rainer Dudek ; Andreas Schubert
Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages / Thomas Winkler ; Eberhard Kaulfersch
Silicon Test Structures for Investigating the Thermomechanical Impact of Polymeric Packaging Materials on Microsystem Performance and Reliability / Jon B. Nysaether ; Johan Liu ; Bernt Liver[o slash]d ; Andre Larsen ; Per A. Ohickers
Thermal Management Enhancement for GaAs Devices Using CVD Diamond Heat Spreaders in a Plastic Package Environment / Philip M. Fabis ; Henry Windischmann
Over-Temperature Protection on Electronic Packages Through a Transient R-C Model / Ben-Je Lwo ; Kun-Fu Tseng ; Ching-Hsing Kao ; Luke Su Lu
Electronic Packaging Polymerics Extension to Cool Irrigation Technology / Dale L. Schruben ; Bo Yang ; Carlos R. Corleto ; Mario A. Medina
Mechanical Performance of Polymeric Materials
New Reworkable High Temperature (in Excess of 350[degree]-400[degree]C) Adhesives for MCM-D Assembly / C. P. Wong ; Jiali Wu ; Randy T. Pike
Fracture Behavior of Silica Particulate Filled Epoxide Resin for Semiconductor Packaging / Kikuo Kishimoto ; Mitsuo Notomi ; Toshikazu Shibuya ; Noriyasu Kawamura ; Takashi Kawakami
In-Situ Measurement of Mechanical Properties of Polyimide Films Using Micromachined Resonant String Structures / Yong-Jun Kim ; Mark G. Allen
On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications / Jang-hi Im ; Ed O. Schaffer II ; Ted Stokich, Jr. ; Andrew Strandjord ; Jack Hetzner ; Jim Curphy ; Cheryl Karas ; Greg Meyers ; Dave Hawn ; Ashok Chakrabarti ; Steve Froelicher
Application of Dynamic-Order Operators to the Problems of Contact Mechanics / D. Ingman ; J. Suzdainitsky ; M. Zeifman
Mechanical Reliability of Composites and Plastic Packages of IC Devices
Strength of CFRP Composites in Space Environment / Yoshihito Ozawa ; Hiroshi Suzuki
Quantifying the Effect of Prebaking on Delamination in Plastic IC Packages / A. A. O. Tay ; T. Y. Lin
The Effect of Polymer Die Attach Material on Solder Joint Reliability / Masazumi Amagai
Polymer Interface Crack and Adhesion Resistance / M. N. Perelmuter
Experimental Techniques
Characterization of Plastic Encapsulant Materials as a Baseline for Reliability Testing / L. Lantz ; M. G. Pecht
Study of Residual Stresses in PBGA Electronic Packages / Zhu Wu ; Jian Lu ; Yifan Guo
Microdeformation Analysis of Packages and Interconnects by the MicroDAC Method / Dietmar Vogel
Microwave Imaging for Nondestructive Inspection of Delamination in IC Packages by Open-Ended Coaxial Line Sensor / Yang Ju ; Masumi Saka ; Hiroyuki Abe
Manufacturing and Moisture Sensitivity Problems
Hygrothermo-Mechanical Behavior of Mold Compound Materials at Elevated Environment / Sung Yi ; Guan Hock Neo
SN Ratio Decibel (Taguchi) in Molding, Manufacturing or Other Processes / Tadao Shibayama
Elastic-Plastic Finite Element Analysis of Auto-Body Panel Stamping Processes Using Dynamic Explicit Time Integration Scheme / Dong Won Jung
Hygrothermally Induced Residual Stresses in a Plastic BGA / Chee Yoon Yue
Moisture Ingress and Absorption in a CCD Package Characterisation, Modelisation and Measurement / O. Puig ; P. Roustan
Polymer Coated Optical Fibers
Coated Optical Fiber Interconnect Subjected to the Ends Off-Set and Axial Loading / E. Suhir
Critical Strain and Postbuckling Stress in Polymerically Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating?
Author Index
The Future
Matching Customer Information Needs With RandD Strategy: Predicting Market Demographics to Achieve Market Driven Innovation / Ralph W. Wyndrum, Jr
Microelectronics: It Is Polymer World in the 21st Century / Rao R. Tummala
3.

図書

図書
sponsored by the Fuels and Combustion Technologies Division, ASME ... [et al.]
出版情報: New York : American Society of Mechanical Engineers, c1999  2 v. ; 28 cm.
シリーズ名: FACT ; vol. 23
PWR ; vol. 34
所蔵情報: loading…
目次情報:
v. 1. Fuels and combustion technologies. Gas turbines. Nuclear engineering / edited by Scott R. Penfield, Jr., N. Albert Moussa
v. 2. Power / edited by Scott R. Penfield, Jr., Robert H. Hayes, Robert McMullen
v. 1. Fuels and combustion technologies. Gas turbines. Nuclear engineering / edited by Scott R. Penfield, Jr., N. Albert Moussa
v. 2. Power / edited by Scott R. Penfield, Jr., Robert H. Hayes, Robert McMullen
4.

図書

図書
sponsored by the Power Division, ASME ... [et al.]
出版情報: New York : American Society of Mechanical Engineers, c2000  xi,779 p. ; 28 cm.
所蔵情報: loading…
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