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1.

図書

図書
editors: Qinghuang Lin ... [et al.]
出版情報: Warrendale, Pa. : Materials Research Society, c2007  xiv, 338 p. ; 24 cm
シリーズ名: Materials Research Society symposium proceedings ; v. 990
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2.

図書

図書
editors, Mikhail R. Baklanov ... [et al.]
出版情報: Warrendale, Pa. : Materials Research Society , Cambridge ; New York : Cambridge University Press, 2012  ix, 127 p. ; 24 cm
シリーズ名: Materials Research Society symposium proceedings ; v. 1335
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目次情報: 続きを見る
Low-k Materials / Part I:
Ultra low-k materials based on self-assembled organic polymers / Marianna Pantouvaki1:
New designs of hydrophobic and mesostructured ultra low k materials with isolated mesopores / Anthony Grunenwald2:
Evaluation of ultra-thin layer fabricated by wet-process as a pore-seal for porous low-k films / Shoko Ono3:
Ozone treatment on nanoporous ultralow dielectric materials to optimize their mechanical and dielectrical properties / Hee-Woo Rhee4:
Integration / Part II:
Optimizing stressor film deposition sequence in polish rate order for best planarization / John H. Zhang5:
Effect of chemical solutions and surface wettability on the stability of advanced porous low-k materials / Quoc Toan Le6:
A less damaging patterning regime for a successful integration of ultra low-k materials in modern nanoelectronic devices / Sven Zimmermann7:
Defects in low-ĸ insulators (ĸ=2.5âÇô2.0): ESR analysis and charge injection / Valeri Afanas'ev8:
Patterning organic fluorescent molecules with SAM patterns / Nan Lu9:
Optical interconnect technologies based on silicon photonics / Wim Bogaerts10:
Metallization / Part III:
32nm node highly reliable Cu/low-k integration technology with CuMn alloy seed / Shaoning Yao11:
Amorphous Ta-N as a diffusion barrier for Cu metallization / Neda Dalili12:
Comparison of TiN thin films grown on SiO2 by reactive dc magnetron sputtering and high power impulse magnetron sputtering / Jon Gudmundsson13:
Specific contact resistance of ohmic contacts on n-type SiC membranes / Patrick Leech14:
Development of electrochemical copper deposition screening methodologies for next generation additive selection / Kevin Ryan15:
3D Packaging / Part IV:
Microbump impact on reliability and performance in through-silicon via stacks / Aditya Karmarkar16:
Tailoring the crystallographic texture and electrical properties of inkjet-printed interconnects for use in microelectronics / Romain Cauchois17:
Low-k Materials / Part I:
Ultra low-k materials based on self-assembled organic polymers / Marianna Pantouvaki1:
New designs of hydrophobic and mesostructured ultra low k materials with isolated mesopores / Anthony Grunenwald2:
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