| Polymeric Materials for Electronics |
| Packaging and Interconnection: An Overview Cure |
| Studies of PMDA-ODA- and BTDA-ODA-Based |
| Polyimides by Fluorescence Spectroscopy Dynamic |
| Fourier Transform-IR Analysis of Cure |
| Reactions and Kinetics of Polyimides |
| Polyimide Hydrolysis: Measurement by Fourier |
| Transform-IR Spectroscopy Dielectric |
| Characterization of Water in Polyimide and Poly(amide-imide) |
| Thin Films Calculated Final-State Effects of the PMDA-ODA |
| Polyimide X-Ray Photoemission Spectrum |
| Effect of Diamic Acid Additives on Dielectric |
| Constants of Polyimides Organic Dielectrics with Reduced |
| Moisture Absorption and Improved |
| Electrical Properties Synthesis and Characterization of the t-Butyl |
| Ester of the Oxdianiline-Pyromellitic Dianhydride |
| Polyamic Acid Curing of Binary |
| Mixtures of Polymides Polyimides for Dielectric Layers |
| Siloxane Polyimides for Interlayer |
| Dielectric Applications Electrophoretic |
| Deposition of Polyimides: Electrocoating on the Cathode Accelerated |
| Testing of Polyimide Coatings for Neural |
| Prostheses Conduction Transients in Polyimides Polymer |
| Insulating Layers for Multilayer Hybrid Circuits |
| Fabrication and Properties of Thermoset Films |
| Derived from Bis-Benzocyclobutene for Multilayer |
| Applications Synthesis of Poly(arylene ether phenylquinoxaline) |
| High-Performance Silicone Gel for Packaging of Devices with Very Large |
| Scale Integration (VLSI) Modeling of Triple-Track and Comb-Pattern |
| Leakage Current Measurements Silicone Gels and Coatings for Integrated-Circuit |
| Packaging Ultraviolet-Curable Silicones for Integrated-Circuit |
| Protection Moisture Transport Phenomena in Epoxies for Microelectronics |
| Applications Heterogeneous Conduction Processes in Integrated-Circuit |
| Encapsulation Novel Coatings That Maintain Low Surface-Water |
| Concentrations Thermal Stress in Epoxy Molding |
| Compounds and Packaged Devices |
| Characterization of Stresses in Polymer Films for Microelectronics |
| Applications Stress Factors in Molding |
| Compounds New Transfer Molding |
| Compounds Chemistry of Stable |
| Brominated Epoxies Performance of Stable Brominated |
| Epoxies in Encapsulants for Microelectronic |
| Devices New Polymeric Materials for Electronics Packaging |
| Degradation of Brominated |
| Epoxy Resin and Effects on Integrated-Circuit-Device Wirebonds |
| Enhancement of Gold-Aluminum Wirebond |
| Reliability in Plastic Encapsulated Very Large Scale |
| Integration (VLSI) Devices Through C-Br Bond Stabilization Ordered |
| Polymers for Interconnection Substrates |
| Three-Dimensional Circuit Interconnections with Thermoplastic |
| Performance Polymers Significance of Developments in New Substrate Materials |
| Polymeric Materials for Electronics |
| Packaging and Interconnection: An Overview Cure |
| Studies of PMDA-ODA- and BTDA-ODA-Based |
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