close
1.

図書
図書
1. 1997 proceedings, Second Annual IEEE International Conference on Innovative Systems in Silicon, Austin, Texas, USA (: case)
sponsored by IEEE Computer Society, IEEE Components, Packaging & Manufacturing Technology Society ; edited by Laurence LaForge...[et al.]
出版情報: Piscataway, NJ : IEEE Service Center, c1997  ix, 372 p. ; 22 cm
所蔵情報: loading…
2.

図書
図書
2. 1994 proceedings : Sixth annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA (: soft. ; : case. ; : micro.)
sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society ; edited by R. Mike Lea and Stuart Tewksbury
出版情報: Los Alamitos, Ca. ; Tokyo : IEEE Computer Society Press, c1994  ix, 404 p. ; 24 cm
所蔵情報: loading…
3.

図書
図書
3. 1995 proceedings : Seventh annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA (: soft. ; : case. ; : micro.)
sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society ; edited by Stuart Tewksbury and Glenn Chapman
出版情報: Piscataway, N.J. : IEEE, c1995  ix, 382 p. ; 24 cm
所蔵情報: loading…
4.

図書
図書
4. 1996 proceedings, Eighth Annual IEEE International Conference on Innovative Systems in Silicon, Austin, Texas, USA (: soft. ; : case.)
sponsored by IEEE Computer Society, IEEE Components, Packaging & Manufacturing Technology Society ; edited by Stuart Tewksbury and Glenn Chapman
出版情報: Piscataway, NJ : IEEE Service Center, c1996  vii, 391 p. ; 23 cm
所蔵情報: loading…
文献の複写および貸借の依頼を行う
 文献複写・貸借依頼