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1.

図書

図書
sponsored by Semiconductor Equipment and Materials International, Components, Packaging, & Manufacturing Technology Society
出版情報: Piscataway, N.J. : IEEE Service Center, c2000  v, 388 p. ; 28 cm
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図書

図書
sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.]
出版情報: New York, N.Y. : American Society of Mechanical Engineers, c2003  xi, 893 p. ; 28 cm
シリーズ名: EPP ; v. 3
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図書

図書
sponsored by the Electronic and Photonic Packaging Division, ASME
出版情報: New York, N.Y. : American Society of Mechanical Engineers, c2004  ix, 586 p. ; 28 cm
シリーズ名: EPP ; v. 4
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4.

図書

図書
[co-sponsored by IEEE, CPMT, SEMI]
出版情報: Piscataway, N.J. : IEEE, c2004  xii, 354 p. ; 28 cm
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5.

図書

図書
sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling
出版情報: New York : American Society of Mechanical Engineers, c1995  v, 117 p. ; 28 cm
シリーズ名: EEP ; vol. 13
AMD ; vol. 214
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図書

図書
sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu ... [et al.]
出版情報: New York : American Society of Mechanical Engineers, c1995  vi, 271 p. ; 28 cm
シリーズ名: EEP ; v. 11
MD ; v. 64
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図書

図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Chao-pin Yeh, Charles Ume
出版情報: New York, N.Y. : American Society of Mechanical Engineers, c1996  v, 125 p. ; 28 cm
シリーズ名: EEP ; vol. 17
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8.

図書

図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by E. Suhir ... [et al.]
出版情報: New York, N.Y : American Society of Mechanical Engineers, c1997  2 v. ; 28 cm
シリーズ名: EEP ; vol. 19
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9.

図書

図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer, Masumi Saka, Yung-Cheng Lee
出版情報: New York, N.Y : American Society of Mechanical Engineers, c1999  2 v. ; 28 cm
シリーズ名: EEP ; vol. 26
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目次情報: 続きを見る
Keynote Papers / Volume 1:
Reliability of Area-Array Packages--I
Compact Thermal Models of Air-Cooled and Conduction-Cooled Components
Mems Packaging--I
Material Considerations in Reliability of Electronic Packages
Reactive Wetting in the Sn-Cu, Sn-Au and Sn-Au-Cu Systems / Stephan J. Meschter ; Timothy Singler ; Seamus Gorman ; Liang Yin
Thermal Model of Buried Resistors and Design Guidelines for Buried Components / Sanjeev Sathe ; Bahgat Sammakia
Spherical Filler-Induced Damage in IC Plastic Packages / Hideo Miura
Effect of Additional Element (Bi and Cu) on the Thermal Fatigue Strength of QFP/Sn-3.5Ag Solder Joint / Yoshiharu Kariya ; Yasunori Hirata ; Kenji Warashina ; Masahisa Otsuka
Materials Mechanics and Thermo-Mechanical Reliability of Flip Chip Area Array Packages / Andreas Schubert ; Rainer Dudek ; Bernd Michel
Flip-Chip on Laminate Reliability: Statistics and Failure Distributions / Rod Martens ; Michael Roesch
Silicon Stress Measurements and Interconnect
Sensitivity of Van Der Pauw Sensors to Uniaxial Stress / A. K. M. Mian ; J. C. Suhling ; R. C. Jaeger
Design and Experimental Evaluation of a 3rd Generation Addressable CMOS Piezoresistive Stress Sensing Test Chip / James N. Sweet ; David W. Peterson ; Alex H. Hsia
Measurement of the Temperature Dependency of the Piezoresistance Coefficients in P-Type Silicon / Eivind Lund ; Terje Finstad
Silicon Piezoresistive Stress Sensors Using MOS and Bipolar Transistors / A. T. Bradley ; J. Xu
Verification of a Governing Parameter for Electromigration Damage in Bamboo Lines / Kazuhiko Sasagawa ; Kazushi Naito ; Masataka Hasegawa ; Masumi Saka ; Hiroyuki Abe
Prediction of Electromigration Failure in Bamboo Lines
Reliability of Area-Array Packages--II
Thermal Fatigue Reliability Assessment for Solder Joints of BGA Assembly / Qiang Yu ; Masaki Shiratori
Parameters and Materials Properties / Kris Frutschy ; Zezhong Fu ; Deepak Goyal ; Ryan Vogt
Thermal Fatigue Life Evaluation for the Solder Joint Ceramic BGA / Hidehisa Sakai ; Nobutaka Ito ; Keiko Kawase ; Kazuyuki Imamura ; Masaki Onho ; Masanori Motegi
A Parametric Study of Flip-Chip Reliability via Computer Simulation / Hua Lu ; Christopher Bailey ; Mark Cross
Thermal Fatigue Assessment for Solder Joints of Underfill Assembly / Yasuhisa Kaga
Thermal Analysis of Components and Printed Wiring Boards (PWBs)
Design-Based Thermal Performance Evaluation of a GaAs MMIC Device in a Plastic Ball Grid Array Package / V. H. Adams ; K. Ramakrishna ; T.-Y. Tom Lee ; J. V. Hause ; M. Mahalingam
Thermal Strategy for Modeling the Wirebonded PBGA Packages / Victor A. Chiriac ; Tien-Yu Tom Lee
A Multi-Scale Conjugate Thermal Modeling Approach for Air Cooled Electronic Enclosures / Lan Tang ; Yogendra K. Joshi
Conjugate Heat Transfer From a Surface-Mounted Heat Source Through the Plate Substrate / Sang Hee Park ; Kyung Ho Kim ; Taek Hong ; Wataru Nakayama
Analytical and Experimental Assessment of the Thermal Performance of Surface Mount Packages / Atris A. Ray III ; W. Z. Black ; J. G. Hartley ; Ari Glezer
Pentium II Processor Cartridge Design for Desktop / Chia-Pin Chiu ; Ram Viswanath ; Gary L. Solbrekken
Mems Packaging--II
Stress Characterization of Bonds Created by an Adhesive Layer Between Miniaturized Optical Components and a Micromachined Substrate / Donald E. Jones ; David L. Naylor
Flip-Chip Assembly for RF and Optical MEMS / Wenge Zhang ; Kevin F. Harsh ; M. Adrian Michalicek ; Victor M. Bright ; Y. C. Lee
Fast 3D Inductance Computation for RF/MEMS Packages / Mattan Kamon ; Mark G. da Silva ; Stephen F. Bart
Enabling MEMS Package-Device Co-Design Through Extraction of Compact Models / Susan Zhang ; Vladimir Rabinovich ; Joost van Kuijk ; Mark da Silva
Flip-Chip Assembly
Flip Chip Assembly on Organic Boards Using Anisotropic Conductive Adhesives/Films and Nickel/Gold Bump / Myung-Jin Yim ; Young-Doo Jeon ; Kyung Wook Paik
Study of Epoxy Material Properties for Solving Thermal Mismatch Problem on Electronic Packaging / Shyh-Rong Tzan ; Li-Sen Chen
Optimized Structure for Organic Flip Chip Package / Yoshiaki Sugizaki ; Eiichi Hosomi ; Eiji Takano ; Daijo Chida ; Yumiko Ohshima ; Chiaki Takubo ; Takahito Nakazawa
Development of Interposer Material (TFI) for Face Down Type CSP / Toyosei Takahashi
Development of Underfill Material With High Valued Performance / Satoru Katsurayama ; Masahiro Wada
Modeling of Solder Solidification and Fatigue
Modelling the Melting and Solidification of Solder Material / Daniel Wheeler
Modelling the Fillet Lifting Defect / C. Bailey ; W. J. Boettinger
A Comparison of Thermal Stress/Strain Behavior of Ellipse/Round Solder Pads / Kuo-Ning Chiang ; Hsien-Chie Cheng ; Chang-Ming Liu
Thermomechanical Analysis of Solder Joints Under Thermal and Vibration Loading / Cemal Basaran ; Rumpa Chandaroy
Ceramic Ball Grid Array Solder Joint Thermal Fatigue Life Prediction Model / T. E. Wong ; H. M. Cohen ; T. Y. Jue ; K. T. Teshiba
Calibration of the Disturbed State Model for Thermo-Mechanical Behavior of Various Solders / Terrance J. Dishongh ; Chandra S. Desai
Reliability of Area-Array Packages--III
Analyses of Fatigue Crack Extension in Electronic Solder Joints / Makio lino ; Ken Kaminishi ; Hiroki Bessho ; Motoharu Taneda
Mechanical Fatigue Tests of Solder Bumps / Minoru Mukai ; Hiroyuki Takahashi ; Takashi Kawakami ; Kuniaki Takahashi ; Ken Iwasaki ; Kikuo Kishimoto
Development of Fine Pitch Ball Grid Array With Reliability Enhancement / Takashi Aihara ; Shingo Ito ; Hideaki Sasajima ; Ken Oota
Evaluation for Fatigue Life of CSP Solder Joints Using Piezoelectric Translator for the Actuator and the Measurement Without Dislocation / Yutaka Okumoto ; Hayato Kobayashi
Failure Prediction in Plastic Ball Grid Array Electonic Packaging / Meng-Kao Yeh ; Kuo-Chin Chang
Characterization and Optimization / Heat Sink I:
Design of Heat Sinks and Planer Spreaders With Airflow Bypass / Emerson dos Reis ; Carlos A. Altemani
Compressible Gas-Cooled Micro-Channel Heat Sink Board / Maurice J. Marongiu ; B. Kusha ; G. S. Fallon
Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks / Keiji Sasao ; Mitsuru Honma ; Atsuo Nishihara ; Takayuki Atarashi
Natural Convection Air Cooling Between Vertical Parallel Plates With Heated Protrusions Simulating Plate-Mounted Electronic Components Within an Enclosure / Sung K. Park
Conjugate Heat Transfer From Small Heat Sources Mounted on a Conductive Wall / Xing Zhang ; Tomohisa Imamura ; Motoo Fujii
Flat Plate Fin Heat Sinks in Natural Convection Telecommunication Modules / Melik Sahraoui ; Gamal Refai-Ahmed
Optoelectronics and Photonics Packaging
Introduction / Ephraim Suhir ; Fouad Kiamilev
Optical and Mechanical Behavior of Optoelectronics Materials and Packages--I
Integrated Micro-Optical Systems / M. Feldman ; H. Han ; A. Kathman ; E. Johnson ; Jared Stack
New Technological Approach for Submicronic Optoelectronic Chip Assemblies / Claude Massit ; Gerard Nicolas ; Guy Parat ; Patrick Mottier ; Gilles Grand ; Laurence Pujol
Analysis on Acoustic Emission of Optical Glass Fiber Produced by a Breaking Test: A Dependency of AE Energy on Constitution of Fiber / Mitsuyuki Nakayama ; Keisuke Matsuda ; Hideto Suzuki
A Thermo-Electro-Mechanical Study of a VCSEL Array Package / E. Yu ; A. Przekwas
Solders
Temperature and Strain Rate Effect on Mechanical Properties of 63Sn/37Pb Solder Alloy / X. Q. Shi ; H. L. J. Pang ; W. Zhou ; Z. P. Wang
Soldering of Thin Film-Metallized, Soda-Lime Glass Substrates / F. Michael Hosking ; Cynthia L. Hernandez ; S. Jill Glass
Pb-Free Solder Alloy of Sn-Ag-Bi System With a Small Amount of Ge / Kazutaka Habu ; Naoko Takeda ; Haruo Watanabe ; Hiroshi Ooki ; Jiro Abe ; Takashi Saito ; Yoshikuni Taniguchi ; Kinjiro Takayama
Laser Microsoldering Characteristics of Lead-Free Solders / Tadashi Takemoto ; Atsushi Nakamae ; Akira Matsunawa
Tensile Deformation Properties and Microstructure of Sn-Zn System Lead-Free Solders / Masahiro Takahashi
Analysis of Phase Growth Process in Sn/Pb Eutectic Solder Joint / Toshihiko Sayama ; Takeshi Takayanagi ; Takao Mori
Modeling and Characterization of Packaging Material
An Analytical Cure Model for Underfill Epoxies / Chetan P. Malhotra ; Roop L. Mahajan
Particle Size Distribution of Nanoparticulate Materials Using SAXS / Kal R. Sharma
Calculating Stresses During Thermoset Cure: Nonlinear Viscoelasticity and Evolving Material Properties / Douglas B. Adolf ; Robert S. Chambers ; James M. Caruthers
Nonlinear Viscoelastic Analysis of Engineering Polymers
Sensor for the Measurement of Liquid Permittivity Using Quartz Crystals / V. Matko ; J. Koprivnikar
Permitivity of Thin Molecular Films / J. P. Setrajcic ; I. D. Vragovic ; S. Vucenovic
Manufacturing-Process Monitoring and Control
Neural Network Based Diagnosis of CVD Barrel Reactor / Sanjay R. Bhatikar
Supervisory Control of the Via Formation Process in HDI Layers for MCM-D Applications Using Neural Networks / Tae Seon Kim ; Gary S. May
Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes / German Rodriguez ; Daniel F. Baldwin
Application of the Taguchi Method to Chip Scale Package (CSP) / Atila Mertol
Optimisation of the Chip on Glass (COG) Bonding Parameters for Mass Production With Taguchi Method / Petteri Palm ; Jarmo Maattanen ; Pekka Ahokas
Reliability of Area-Array Packages--IV
A Study of Fatigue Life Predictions for PBGA Joints and Comparisons With Test Data / Hasan U. Akay ; Gunasekaran Kaliappan ; Nasser H. Paydar ; Mostafa Rassaian
Creep Behavior of BGA Solder Joints During Thermal Cycling by Moire Interferometry / Y. Zhao ; T. Dishongh ; A. Cartwright ; C. Basaran
Peel Strength Evaluation of CSP Joints Mounted on a Buildup PWB / Osamu Ido ; Nobutaka Itoh ; Mami Nagatake ; Kinuko Mishiro ; Yutaka Higashiguchi ; Ken-ichiro Tsubone
Fatigue Life Assessment of Bump Type Solder Joint Under Vibration Environment / S. B. Lee ; S. J. Ham
Vibration Reliability Analysis of a PBGA Assembly Under Foundation Excitations / Q. J. Yang ; G. H. Lim ; F. F. Yap ; R. M. Lin
Experimental Study on the Performance of Compact Heat Sink for LSI Packages / Masaru Ishizuka ; Yasuyuki Yokono ; Katsumi Hisano ; Debasish Biswas ; Hideo IwasakiHeat Sink II:
Compact Modeling of Fluid Flow and Heat Transfer in Heat Sinks / Sung Jin Kim ; Duckjong Kim
Performance of a Thermosyphon Pin Fin Heat Sink / Jianchun Sun ; Kok-Chuan Toh ; Chang-Yu Liu
Optimum Performance of Cellular Metal Heat Sinks for Thermal Management of High Power Electronics / Ashraf F. Bastawros ; Anthony G. Evans
Heat Sink Optimization for Maximum Performance and Minimum Mass / Mohamed Fadi Ben Achour ; Avram Bar-Cohen
Optical and Mechanical Behavior of Optoelectronics Materials and Packages--II
Single-Mode Bi-Directional Links for FITL and Optical Networks / Robert A. Boudreau ; Terry P. Bowen ; Jeffrey S. Schramm ; Richard H. Sargent ; Michael Feldman ; R. Brian Hooker ; Craig A. Armiento ; Arvind Baliga ; Jerry Radcliffe
Guided-Wave Si CMOS Process-Compatible Optical Interconnects / R. T. Chen ; L. Wu ; L. Lin ; C. Choi ; Y. Liu ; B. Bihari ; S. Tang ; R. Wickman ; B. Picor ; Y. S. Liu
Polymers for Optoelectronic Devices / J. D. Swalen
Dielectrics
Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate / Shoji Kamiya ; Hironori Takahashi
Evaluation of Ternary Polymer Blend as Semi-Permeable Membrane in the Production of Hydrogen Compared With the Inorganic High Surface Area Materials
Plasma Nitridation on Commercial Copper Leadframe for Cu/EMC Adhesion Enhancement / R. Gopal Krishnan ; Khine Nyunt ; T. C. Chai ; Andrew Wong ; G. Sarkar
New Small CTE Materials for Packages Using COPNA Resin / Kazunari Nawa ; Yoshihisa Kishimoto ; Masakazu Ohkita
Manufacturing-Process Modeling and Simulation
Study of Thermal Deformation in Underfilled Flip-Chip Packages Using High-Resolution Moire Interferometry / Mikel R. Miller ; Ilyas Mohammed ; Paul S. Ho ; Xiang Dai
Role of Underfill Materials and Thermal Cycling on Die Stresses / Carlton E. Hanna ; Suresh K. Sitaraman
FEA Modeling of FCOB Assembly Warpage and Stresses Due to Underfill Encapsulation and Thermal Cycling Loading / John H. L. Pang ; Y. R. Chong
Optimising Matrix Molds and Wiresweep for Transfer Molding of IC Plastic Packages / K. Sivakumar ; Silvia Radente ; Christophe Prior
Finite Element Analysis of the Degating Process in IC Packaging / Srikanth Narasimalu ; Kuah Teng Hock ; Ho Shu Chuen
Wafer Scale Packaging Based on Underfill Applied at the Wafer Level for Low-Cost Flip Chip Processing / C. Dustin Johnson ; Stephen C. Busch
Instrumentation and Measurement Techniques
Development of Scanning Type Infrared Laser Photoelasticity and Evaluation of Residual Stress in {100} GaAs Wafers / Yasushi Niitsu ; Kenji Gomi
Application of Highly Focused, High Frequency Transducers for Evaluation of Near-Surface Flaws and Thin Packages: Smart Cards, Flip Chip, Flex Circuits and Thick Films / Janet E. Semmens ; Sridhar Canumalla
Microwave Imaging for the Integrity Assessment of IC Package / Yang Ju
Tomographic Acoustic Micro-Imaging (TAMI) Improves Acoustical Analysis of Flip Chip Packages / Joel Sigmund ; John Goings ; Michael A. Kearney
Stress Evaluation of {100} Si Wafer by Raman Spectroscopy / Tomo Ikebe ; Yusei Okubo ; Teruki Ikeda
A Method of Film Fatigue Testing and the Effects of Rolling Direction on Fatigue Properties in Copper Film / Tashiyuki Torii ; Kenichi Shimizu
Characterization of PCB Expansion Using Moire Interferometry and the Impact of Expansion Variability on the Life of Solder Joints / B. Hunter ; G. Subbarayan ; D. Rose
Characterization of Thermal Heat Spreaders
Optimal Sizing of Rectangular Isotropic Thermal Spreaders / John W. Welch ; Tung T. Lam ; Wing K. Yeung
Thermal Resistance in Rectangular Orthotropic Heat Spreaders / William D. Fischer
Thermal Management Enhancement Using CVD Diamond Heat Spreaders in a Plastic Package Environment / Philip M. Fabis ; Henry Windischmann
Analysis of Heat Conduction Properties of Packaged Laser Diodes From Highly Resolved Temperature Transient Measurments / Paolo Emilio Bagnoli ; Claudio Casarosa ; Mario Madella ; Agnese Piccirillo
Modeling Electro-Thermal Behavior of Integrated Circuit Devices / Massimo (Max) Capobianchi ; John Voight ; Satish Surapaneni
Optical Interconnections
Optoelectronic-VLSI Technologies Based on Direct Attachment of Photonic Devices to Silicon CMOS Circuits / Ashok V. Krishnamoorthy
Optical Interconnects for Silicon Chip Stacks / S. Esener ; P. Marchand ; F. Kiamilev ; V. Ozguz
Mode-Transforming Waveguides for Optical Interconnections / Regis S. Fan
Parallel 10-Channel Optical Interconnect Receiver Module Operating Over 4 gbit/sec Based on Silicon Optical Bench Technology / Franco Delpiano ; Bruno Bostica ; Marco Burzio ; Paolo Pellegrino ; Luca Pesando ; Saverio Ricchiuto
Materials and Processes
Effect of Processing on the Molecular Orientation of Very Different Polymers / Robert J. Samuels
Thermodynamic Stability of Nanocomposites
Thermoplastic Nanocomposite With High Thermal Conductivity
Alternative Materials and Processes for HF-Modules / Tarja Juhola ; Boris Kerzar ; Mehran Mokhtari ; Lester Eastman
High Reliability Desiccant Package Designs With Controlled Moisture Ingress Rates for Use in Low Particulate Environments / Henry H. Law
In-Situ Ultrasonic Stress Measurements During Ball Bonding Using Integrated Piezoresistive Microsensors / Michael Mayer ; Jurg Schwizer ; Oliver Paul ; Daniel Bolliger ; Henry Baltes
Thermal Modeling and Characterization--II
Integrated Thermal Analysis of an Automotive Electronic System / S. S. Murthy ; Y. K. Joshi
Orientation Specific Thermal Properties of Polyimide Film / Nancy E. Mathis
Advanced Thermal Resistance Characterization Technique for IC Packages / Hendrik Decruyenaere ; Daniel Vanderstraeten ; Anelia Pergoot
Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Airflows by Experimental Analysis / Peter Rodgers ; John Lohan ; Valerie Eveloy ; Carl-Magnus Fager ; Jukka Rantala
Moody's Diagram Heat Transfer Friction Flow Losses in Porous Materials / James T. Dickey ; George P. Peterson
Study of Liquid Cooled Power Cells / Randall Mathieu ; Mulugeta Berhe ; Rajesh Nair
Mechanical Modeling and Analysis
Object-Oriented CAE System for Structural Design of LSI Packages / Kiyomi Kojima ; Takeshi Terasaki ; Asao Nishimura
Analysis and Reduction of Structures in Reliability / Miguel A. R. Mojena ; Katia L. Cavalca
Viscoelastic Warpage Analysis of Surface Mount Package / Kiyoshi Miyake ; Tsukasa Yoshida ; Hyung Gil Baik ; Sang Wook Park
The Effect of Residual Stress on the Stress Distribution of an IC Solder Joint / J. H. Kuang ; M. T. Sheen ; Y. C. Hsu
Effect of Solder Reflow Temperature Profile on Popcorning / Iok-Tong Chong ; David C. C. Lam ; Pin Tong
Free Space Optical Communication
Free-Space Optically Connected Crossbar Assembly / John A. Neff
Smart Pixel Array Module for Free Space Optical Interconnects / Yue Liu ; E. M. Strzelecka ; R. A. Skogman ; R. A. Morgan ; R. Walterson ; K. Johnson ; J. Nohava ; E. Kalwit ; J. Gieske ; T. Marta ; Mary Hibbs-Brenner
CMOS IC Design for Free-Space Optical-Interconnect Packaging / Jeremy T. Ekman ; Fouad E. Kiamilev ; Premanand V. Chandramani ; James L. Rieve ; Richard G. Rozier ; Ray Farbarik
FAST-Net Optical Interconnection Prototype Characterization / M. W. Haney ; M. P. Christensen ; P. Milojkovic ; J. Rieve ; J. Ekman ; P. Chandramani ; M. Hibbs-Brenner ; E. Strzelecka ; G. Fokken ; M. Vickberg ; B. Gilbert
Chip Scale Package: Design Materials, Process and Performance / Volume 2:
Strategies for Creating Compliant IC Packages at Near Chip Size / Joseph Fjelstad
Three Dimensional Elastoplastic and Creep Analyses of a Low Cost Solder-Bumped Flip-Chip Chip Scale Package (CSP) Assembly / John H. Lau
The SuperCSP Package Solution: A Wafer Level Package / Michelle M. Hou
Characterization of Molding Compounds and Die Attach Materials for Package Warpage and Solder Joint Reliability in Chip Scale Packages (CSP) / Masazumi Amagai
D2CSP (Double Density CSP): An Innovation of BLP Technology / Kwang-Seong Choi ; Byong-Su Seol ; Jong-Hyun Lee ; Chang-Kook Choi ; Ki-Bon Cha
The Effect of Underfill on the Pressure Cooker Test Peformance of Flip Chip on Board Assembly / Yu-Wen Huang ; Keng Hwa Teo ; Khoon Lam Chua ; Michael W. R. Yang ; William Ferng
Mechanics of Interfaces and Multilayer Materials
Measurement of Interface Toughness as a Function of Temperature, Moisture Concentration and Mode Mixity / Andrew A. O. Tay ; Yi Yi Ma ; Soon Huat Ong ; Toshio Nakamura
Some Effects of Specimen and Loading Variables on the Fracture Toughness of Epoxy-to-Substrate Interfaces / Tommy R. Guess ; E. David Reedy ; Mark E. Stavig
Propagation of Interface Edge Cracks by Mechanical and Thermal Strains / Wei Hin Wong ; Li Cheng ; Yong-Wei Zhang
Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging / Ying Zhao
Analysis of Interlaminar Thermal Stresses in Unsymmetric Multi-Layered Electronic Assemblies and Packages / Weidong Xie
The Shear Strength of the Solder Bumps Formed by Stencil Printing and Reflow: Effects of Underlayer Adhesion / S. J. Heo ; S. H. Yoo ; Y.-H. Kim ; I. B. Park ; J. H. Yoon ; B. J. Han
Accelerated Product Qualification: State of the Art
Practical Lessons Learned From Overstress Testing: A Historical Perspective / Eugene R. Hnatek ; Edmond L. Kyser
A 12-Step Continuous Supplier Involvement Checklist to Accelerate Component, Sub-Assembly and Full System Qualification / Thimmiah Gurunatha
Efficient Validation Testing of Pressure Sensors Using DOE for Production Line Validation Tests / Dale R. Sogge
Monte Carlo Simulation of BGA Failure Distributions for Virtual Qualification / John W. Evans ; Jillian Y. Evans ; Reza Ghaffarian ; Andrew Mawer ; Kyoung-taeg Lee ; Chang-ho Shin
Application of the Accelerated Degradation Principles and Monte Carlo Simulation to Product Performance Evaluation: A Case Study / Vladimir Crk
A Decision Process for Accelerated Stress Tests / Mark Roettgering
Microscale Heat Transfer
Microscale Thermal Engineering of Integrated Circuits / Kenneth E. Goodson
Multimode Heat Transfer in Two-Dimensional Microchannel / Chih Ping Tso ; Shripad Prabhakar Mahulikar
An Experimental Study on an Enhanced Microchannel Heat Sink for Microelectronics Applications / Jerry K. Keska ; A. Chuck Miller
Thermal Analysis of Anisotropic Thin-Film Superconductors
Effect of Surface Waviness on Measurement of Thermal Contact Conductance / Toshio Tomimura
Optical and Mechanical Reliability of Optoelectronic Materials and Packages
Fiber Optics Structural Mechanics: Structural Analysis and Design for Reliability
Optical Coupling Efficiency of Bidirectional Transceiver Chip and Fiber by Using Refractive Index Controlling Medium / Jae-Shik Choi ; Gwan-Chong Joo ; Sang-Hwan Lee ; Nam Hwang ; Seung-Goo Kang ; Hee-Tae Lee ; Min-Kyu Song
Strain Characterization of Fiber Optic Connector Assemblies During Epoxy Cure / Keita Broadwater ; Patricia F. Mead
Reliability Distribution Function for Optical Fibers Strength Prediction / Dov Ingman ; Michael I. Zeifman
Low-Cost Flip-Chip Technology
Alternate Alloy Bump Interconnect Technologies and Flip Chip Applications / Melissa E. Grupen-Shemansky ; Patrick Thompson ; Jong-Kai Lin
microDAC Deformation Analysis on Solder Interconnects for Flip Chip / Dietmar Vogel ; Falk Luczak
Reliability of Low Cost Bumped Flip Chip Assemblies / E. Jung ; J. Kloeser ; K. F. Becker ; R. Aschenbrenner ; H. Reichl
High Throughput Flip Chip Processing and Reliability Analysis Using No-Flow Underfills / Ryan Thorpe
Low Cost Flip Chip Processing and Reliability of Fast-Flow, Snap-Cure Underfills / Paul N. Houston ; Marnico Deladisma ; Lawrence N. Crane ; Mark Konarski
Packaging Assembly and Manufacturing Issues--I
Characterization of Component Failure Modes and Associated Causes / Virginia M. Miller
Large Scale Parallel Simulations for the Assembly of a Flip-Chip Component to a Printed Circuit Board / K. McManus ; D. Wheeler ; H. Lu ; M. Cross ; P. Chow ; C. Addison
Selection of a No-Clean Flux for Flip Chip Applications / Joseph D. Poole ; Kris A. Slesinger ; Mark A. Elkins ; Charles J. Merz Ill
Dynamic Assessment of a Miniaturized Spaceborne Command and Data Handling in Your Palm (CandDHIYP) / Sharon X. Ling ; Binh Q. Le ; Richard F. Conde
Realization of Buried Passive Components in Low-Temperature Co-Fired Ceramic Materials by Thick-Film Techniques / Markku S. Lahti ; Vilho E. Lantto ; Seppo I. Leppavuori
The Application of Massively Parallel Computing to Characterize Furnace Brazing Processes / Steven E. Gianoulakis ; Louis A. Malizia
Metrics for the Underfill Flow Process / P. Li ; T. Driscoll ; N. Guydosh ; J. Cascio ; Y. Huang ; E. J. Cotts ; Y. Gao ; G. Lehmann
Extreme Temperature Electronics
Electronics Packaging for the Temperature Extremes of Mars: The New Millennium Program DS2 Penetrator Mission / Saverio A. D'Agostino ; Genji Arakaki
Failure Engineering Study and Accelerated Stress Test Results for the Mars Global Surveyor Spacecraft's Power Shunt Assemblies / Mark Gibbel ; Timothy Larson
Die Attachment for -120[degree]C to +20[degree]C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview / Randall K. Kirschman ; Witold M. Sokolowski ; Elizabeth A. Kolawa
Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies
Thermal Design of Portable Computers
Transient Thermal Management of Portable Electronics Using Phase Change Materials and Time Varying Power Dissipation / Mark J. Vesligaj ; Cristina H. Amon
Thermal Behavior of 133MHz Notebook Computers / Y. H. Hung ; K. F. Chiang
A Global Assessment of Coolability for Electronics Thermal Design Based on Thermodynamic Aspects / Ken Ogiso
Temperature Responses of Human Skin at the Contact of Hot Surfaces / Lawrence S. Mok ; Paul F. Greier
Thermal Design Method for a Hyper Heat Dense Notebook PC / Kazuaki Yazawa ; Bunsho Lin ; Minoru Okuda
Thermal Management of High End Electronics
Thermal Management of Multichip Modules With Evaporative Spray Cooling / Greg Pautsch
Optical Study of Enhanced Heat Transfer From a Heat Sink for Microelectronics Applications / Gilbert Fournelle ; Sushi H. Bhavnani ; Richard C. Jaeger
Transient Heat Transfer on a Horizontal Cylinder in FC-72 / Takashi Kasakawa ; Koichi Hata ; Masahiro Shiotsu
An Experimental Study on Liquid Cooling of High-Power IC Chips / Satoru Gima
Thermal Management of Computer Systems Using Active Cooling of Pulse Tube Refrigerators / S. W. K. Yuan ; H. H. Jung
Choosing Working Fluid for Two Phase Thermosyphon Systems for Cooling of Electronics / Bjorn Palm ; Rahmatollah Khodabandeh
Comparison of Thermal Characteristics of a Test MCM Using Water, PF-5060 and Paraffin Slurry / Keumnam Cho ; M. G. Choi
Flip-Chip and Area Packaging
Area Array Packages: Materials Requirements for Diminishing Devices / Petri J. Savolainen ; Jorma K. Kivilahti
Development of Reworkable Underfills, Materials, Reliability and Processing / Lawrence Crane ; Afranio Torres-Filho ; Erin Yaeger ; Christopher K. Ober ; Shu Yang ; Jir-shyr Chen ; R. Wayne Johnson
What is Needed to Establish Flip Chip as a Standard SMT Process / Ronald C. Lasky ; Yann Y. Morvan
Advances in Materials and Processes for Flip Chip Packaging / Raj N. Master ; Mohammed Khan ; Maria Guardado ; Orion Starr
Thermomechanical Fatigue Life of Chip Scale Packages / Qizhou Yao ; Jianmin Qu ; Sean X. Wu
Process Characterization and the Effect of Process Defects on Flip Chip Reliability / Brian J. Lewis ; Patrick Trippel ; Jeffery L. Timms ; Leo M. Higgins
An Optimisation Study of Underfill Dispensing Process / Y. C. Chia ; S. H. Lim ; K. S. Chian ; S. Yi ; W. T. Chen
Packaging Assembly and Manufacturing Issues--II
Development of High-Productivity Underfill Process and Equipment / Teikou Odashima ; Mikio Matsui ; Shoji Yamamoto ; Takaki Kuno ; Hirotaka Okamoto
A Revision About Accelerated Testing and Application in a Software for the Data Graphics Analysis / Alberto N. Colmenero ; Franco G. Dedini
Some Challenges for Molecular Dynamics Technique With Consideration of the Movement of Free Electrons in Order to Simulate Thermodynamics by Electronic Current / Tomoaki Tsuji ; Naoyuki Yanagi ; Masaki Makino ; Naotake Noda
Investigation of Variable Frequency Microwaves for Cure of Flip Chip Underfills / Aravind Ramamoorthy
Effect of Au-Intermetallic Compounds on Mechanical Reliability oF Sn-Pb/Au-Ni-Cu Joints / A. Zribi ; R. R. Chromik ; R. Presthus ; J. Clum ; L. Zavalij
Accelerated Qualification of Plastic Encapsulated Microcircuits
An Application Specific Qualification Method for Semiconductor Devices / Donald C. Foster ; Mathew E. Doty
Do We Need a PEM Reliability Model? / Edward B. Hakim
Alternative Accelerated Testing Method for Localization of Solder Fatigue Failures on Electronic Circuit Cards / Scott Sealing ; Abhijit Dasgupta
Localized Thermal Cycling: A Faster and Controlled Accelerated Testing Approach for Surface Mount Electronics / Rajashekar S. Pappu
Rapid Qualification of Foundries or Semiconductor Process Changes Using Rapid Reliability Process Control Tests / Timothy E. Turner
Heat Sinks Enhanced With Phase-Change Materials
An Analysis of Heat Flux Limits for Electronic Components on a Finned Substrate Containing a PCM / Randy Clarksean ; Yitung Chen ; M. Marongiu
Transient Numerical Model for Phase Change Thermal Storage System Analysis and Design / Kamal A. R. Ismail ; Mabruk M. Abugderah
Thermal Control of Horizontally Mounted Heat Sources Using Phase Change Materials / Debabrata Pal
The Use of Phase Change Materials for Electronic Cooling Applications: Thermal Design Issues and Example
Development and Testing of an Ambient Thermal Storage Unit for Pulsed Load Applications / David C. Bugby ; Stephen J. Krein ; Jeong H. Kim
Multichip Modules: Packaging Developments
Multichip Packages: New Developments and Applications / E. Jan Vardaman
Removable Chip Module (RCM): A System in a Module Approach / James Rathburn
Effect of Thick Film Firing Conditions on the Solderability and Structure of Au-Pt-Pd Conductor for Low-Temperature, Co-Fired Ceramic Substrates / Paul T. Vianco
Design of Simulations Study of Multi-Layered Structures in Electronic Packaging / Manjula N. Variyam
Experimental Assessment of an Air Cooling Scheme for the Multichip Modules of a Physics Particle Detector / John D. Bernardin ; Richard A. Martin
Flip-Chip Technology Using Conductive Adhesives
Overview of Bumping Technology for Adhesive Flip-Chip Interconnect / Helge Kristiansen ; Johan Liu
Reliability of Flip-Chip Anisotropically Conductive Adhesive Joints on an FR-4 Substrate / Zonghe Lai
Novel Anisotropically Conductive Film for Area Array Packaging / Matthew J. Holloway ; Mary B. Ward ; Luana V. Scully
A Maskless Low-Cost, Multi-Chip-Module Assembly Process / David A. Hutt ; Samjid H. Mannan ; David C. Whalley ; Paul P. Conway
Application of Fracture, Damage and Disturbance Models--I
Review and Evaluation of Approaches for Thermomechanical Analysis for Stress, Failure and Reliability
Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch / Toru Ikeda ; Isao Arase ; Yuya Ueno ; Noriyuki Miyazaki ; Mitsuru Sato
Fracture Behavior of Underfill Resins and Their Application to Flip-Chip on Organic Substrate Assemblies / Raymond A. Pearson ; Thomas B. Lloyd ; Herman F. Nied
Numerical Study of Copper-Encapsulant Interfacial Delamination Propagation in a Peripheral Array Package / Richard J. Harries
Reliability Analysis of BGA Packages: A Tool for Design Engineers / James W. Jones ; Jason Li ; Yuichi Yamazaki ; Jidong Yang
Accelerated Qualification at the System Level
A Time Dependent Field Return Model for Telecommunication Hardware / Orjan Hallberg ; Joakim Lofberg
Accelerated Product Testing of Generation II Photonics Hardware With Standardized Packaging and Interfaces / Andrew S. Glista, Jr. ; Gerard Walles ; Charles D. Caposell
The Use and Abuse of HAST / Nihal Sinnadurai
Different Approaches for Ensuring Performance/Reliability of Plastic Encapsulated Microcircuits (PEMs) in Space Applications / R. David Gerke ; Mike Sandor ; Shri Agarwal ; Andrew F. Moor ; Kim A. Cooper
Complex Temperature-Vibration Interactions on Solder Durability / James Cho ; Kumar Upadhyayula
Reducing Accelerated Test Time: Use of Vibration Loading to Accelerate Aging Damage / Pradeep Sharma ; Rajesh Natarajan
Multichip Modules: Substrate Developments
Z-MAJIC: A Novel Z-Interconnect Approach for Multi-Chip Modules / Mark T. McCormack ; Hunt Jiang ; Solomon I. Beilin ; Bill Chou ; Mike Peters
Multilayer High Density Flex Technology / Solomon Beilin ; David Kudzuma ; Mike Lee ; Mark McCormack ; Tom Massingill ; Jim Roman ; Yasuhito Takahashi ; Vincent Wang
Design for Manufacturing of RF MCM-L / Hassan Hashemi ; Craig Davidson
Manufacturing of RF MCM-L
Design and Integration Considerations for 3D Flex Based Electronic Packaging / W. B. Morrison ; T. A. Railkar ; A. P. Malshe ; T. G. Lenihan ; W. D. Brown
A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging / Anh X. H. Dang ; I. Charles Ume ; Swapan K. Bhattacharya
Application of Fracture, Damage and Disturbance Models--II
A Pit-Flaw Model for Static Fatigue of Pristine Silica Optical Fibers / Mikio Muraoka
Defects by Manufacture, Installation, Contacting, Hermetization and Operation of Powerful Integrated Circuits / Anatoli S. Yastrebov ; Mikhail Y. Volokobinski
Structural Reliability of PBGA Solder Joints With the Disturbed State Concept / Jacob W. Zwick
Thermomechanical Diagnostics of Flip-Chip/BGA Structures Using Phase-Shifting Electronic Speckle Pattern Interferometry / P. Zhou ; K. E. Goodson
Experimental Characterization of Copper-Encapsulant Interfacial Fracture Toughness for a Peripheral Array Package / Viswanathan Sundararaman
Residual Stress Near by the Interface of Thin CVD Diamond Film and Silicon Substrate / Masaki Sato
Accelerated Qualification of Surface Mount Interconnects--I
A Comparison of Interconnect Fatigue Damage Indicators / James H. Constable
Accelerated Qualification Testing of Connectors / Brian Beaman
Analysis of Correlation Between Accelerated Thermal Cycle Test and Power Cycle Test for a FC-PBGA Device / Alex Tam ; Leon Lopez
Effect of Curing-Induced Hydrostatic Stresses on Life of Underfilled Area-Array Solder Interconnects / K. Darbha ; J. H. Okura ; S. Shetty ; A. Dasgupta ; T. Reinikainen ; J. Zhu ; Jo. F. J. M. Caers
Effect of High Temperature Aging on Solder Joint Degradation in FCOB Assemblies
Thermal Cycling and Thermal Shock for FCOB Testing / Rakesh K. Agarwal ; Larry Tuchscherer ; Helen Cui ; Ritesh Jain ; Thomas Torri ; Scott Baxter
Effects of Temperature and Moisture on Flip-Chip Interface Adhesion / Fay Hua ; Zequn Mei ; Cheng-Han Chen
Application of Heat Pipes to Thermal Management of Electronics
Natural Convection Cooling for Pump Lasers in Telecommunication Applications / Boping Xie ; Z. Zack Yu
A Heat-Pipe System for Cooling a Desktop Computer / Masaru Oomi ; Toshirou Fukumoto ; Junji Sotani ; Jon S. Cox
Design and Testing of Metal and Silicon Heat Spreaders With Embedded Micromachined Heat Pipes / David A. Benson ; Charles V. Robino
Optical Investigation of Mini-Heat Pipe Arrays With Sharp Angled Triangular Grooves / M. Schneider ; M. Yoshida ; M. Groll
Module and System Level Benefits of High Flux Heat Pipe Heat Sinks / Dan Cromwell ; Scott D. Garner
Reliability Characterization of Copper/Water Heat Pipe Below 0[degree]C / Mirjana Vukovic ; John Watkins
Air Cooling II: Fundamentals and Applications
Packaging and Thermal Design of Dense Card-on-Board Electronics / Roger Schmidt ; Drew Horvath ; Dennis Barringer ; Steve Harris ; Randy Kemink ; Bill Maclachlan
Use of Flow Network Modeling (FNM) for the Design of Air-Cooled Servers / Robin Steinbrecher ; Amir Radmehr ; Kanchan M. Kelkar ; Suhas V. Patankar
Performance Characteristics of Confined Impinging Air Jets With Surface Enhancement / Luis A. Brignoni ; Suresh V. Garimella
Heatsink Design for High Power Aircraft Electronic Systems / Farhad Sarvar
Application of Fracture, Damage and Disturbance Models--III
On the Popcorning Mechanics of Plastic Packages / Sheng Liu ; Jiabin Dai
A Unified Constitutive Model Based on Disturbed State Concept and Multi-Domain Method for Design and Reliability in Electronic Packaging / R. Whitenack ; Jung-Chuan Lee
Gallium Arsenide/Gold Flip-Chip Connection Stress Fields / Bingzhi Su ; Paul E. W. Labossiere ; Martin L. Dunn
Time Domain Reflectometry as a Component Packaging Level Damage Detection Tool / Damion Thomas Searls ; Cliff Schuring ; Willie Hayashida ; Chew Hong Tan ; Rich Hardin
New Concept From the Standardization of Complex Eigensolutions for Wedges and Junctions / Shin-Way Lin ; Wei-Chung Wang
Thermal Cycling Reliability: Modeling and Measurement for PBGA Components / Jeff Riebling ; James M. Pitarresi ; Anthony Primavera
Accurate Prediction of Elastic Stress Concentrations Using a Coarse Tetra Mesh Finite Element Solution / Wilfred E. Desaulnier, Jr. ; Marc S. McCloud ; Judy Schwartz
Accelerated Qualification of Surface Mount Interconnects--II
Reliability Test Methodology Using Thermo-Mechanical Deflection / K. H. Ang
Analysis and Mitigation of Field Failures Caused by Copper Corrosion Migration Across Plastic Package Surfaces / Steven C. Anderson ; Joel A. Self ; Steve Mitchell
Comparison of Vibration Fatigue Damage in Surface Mount Interconnects for Repetitive Shock and Electro-Dynamic Excitation / P. Dujari ; J. Cho
Implementation of Unified Viscoplasticity With Damage Evolution and Its Application to Electronic Packaging / Zhengfang Qian
Heat Pipe Applications to Laptop Thermal Managements
An Oscillatory Mode With Extremely High Heat Transfer Rate in a Flexible Heat Pipe / Shaoning Lu ; Hsi-Shang Li
Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader / Koichiro Take ; Ralph L. Webb
High Performance Heat-Pipe Heat Sinks for Notebook PCs / Kenichi Namba ; Kenya Kawabata ; Jun Niekawa ; Yuichi Kimura
Optimization of Heat Pipe Wick Structures for Low Wattage Electronics Cooling Applications / Anurag Gupta ; Girish Upadhya
Education
Engineering of Complex Systems for Global Competitiveness / M. E. Franke
Using an Electromagnetic Simulation Tool for Demonstrations in a Course on Electronics Packaging / Harry Kroger ; Jiayuan Fang ; Yuzhe Chen
Internet Delivery of a Multidisciplinary Graduate Course in Electronics Packaging / James E. Morris ; Walter G. Piotrowski ; Peter Shea
Next Generation of Microelectronic Packaging Education in U.S.: A Perspective on Needs, Challenges and Status / Rao Tummala ; Leyla Conrad ; Gary May
Towards Undergraduate Education in Systems Hardware Technologies / Stuart Tewksbury ; Kiran Debabattini
Electronics Packaging Education: Schumpeterian Challenges and Responses
Development and Application of Thermal Cad
Thermal CAD Package for Multilayer Printed Circuit Boards Integrated With Two-Stack Cold Plate / Y. Y. Chen ; C. Y. Liu
A Genetically Optimized Electrothermal Parallel Algorithm / Boguslaw Butrylo ; Andrzej Jordan ; Adam Skorek
Driving PCA Thermal Analysis Using IDF 4.0 Data Exchange / Arnold Free ; Dave Kehmeier ; Dereje Agonafer
Thermal Transient Evaluation of Packages With the TTMK Toolkit / Vladimir Szekely ; Marta Rencz ; Bernard Courtois
Advanced Package Design Using TCAD Modeling Tools / H.-P. Lien
Author Index
Keynote Papers / Volume 1:
Reliability of Area-Array Packages--I
Compact Thermal Models of Air-Cooled and Conduction-Cooled Components
10.

図書

図書
sponsored by the Electrical and Electronic Packaging Division, ASME, the Applied Mechanics Division, ASME ; edited by J.C. Suhling, K.M. Liechti, S. Liu
出版情報: New York : American Society of Mechanical Engineers, c1997  vi, 136 p. ; 28 cm
シリーズ名: EEP ; vol. 22
AMD ; vol. 226
所蔵情報: loading…
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