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1.

図書

図書
editors, Mark J. Lododa, R. Singh, Simon S. Ang, Hazara S. Rathore ; [sponsord by] Dielectric Science and Technology, Electronics, and High Temperature Materials Divisions [of the Electrochemical Society]
出版情報: Pennington, N.J. : Electrochemical Society, c2000  viii, 244 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; Pv. 2000-5
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2.

図書

図書
editors, Mark D. Allendorf, Michael L. Hitchman
出版情報: Pennington, N.J. : Electrochemical Society, c2000  xi, 810 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-13
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目次情報: 続きを見る
Fundamental Chemistry and Mechanisms
Atomistic Modeling of Chemical Vapor Deposition: NO on the Si (001) (2x1) Reconstructed Surface / N. Tanpipat ; J. Andzelm ; B. Delley ; A. Korkin ; A. Demkov
Simulation of Surface Diffusion of Silicon and Hydrogen on Single Crystal Silicon Surfaces / S. Somasi ; B. Khomami ; R. Lovett
Activation Energy Study for the Nucleation and Growth Stages of Cu(TMVS)(HFAC) Sourced Copper CVD / D. Yang ; J. Hong ; D. Richards ; T. Cale
Development of Gas Phase and Surface Kinetic Schemes for the MOCVD of CdTe, ZnS and ZnSe / C. Cavallotti ; V. Bertani ; M. Masi ; S. Carra
Determination of Energy Transfer Effects for Molecular Decomposition / W. Tsang ; V. Mokrushin
Gas-Phase Chemistry in the CVD of Silicon Carbide: Theoretical Study of the Reactions SiH[subscript 2]+CH[subscript 4], SiH[subscript 2]+C[subscript 2]H[subscript 4], and SiH[subscript 2]+C[subscript 2]H[subscript 2] / C. Raffy ; M.D. Allendorf ; E. Blanquet ; C.F. Melius
SiH[subscript 4] Reaction Mechanism Research Using a Fast Wafer-Rotating Reactor / Y. Sato ; N. T. Tamaoki ; T. Ohmine
Modeling Particle Nucleation during Thermal CVD of Silicon from Silane using Kinetic Monte Carlo Simulation / X. Li ; M. Swihart
Measurement of the Kinetics of the High Temperature Oxidation of TiCl[subscript 4] / R. Raghavan ; D. Lee ; D. Conrad ; P. Morrison, Jr.
Influence of Carbon Precursor on the Gas-Phase Chemistry of the Ti-C-Cl-H System / S. de Persis ; F. Teyssandier ; A. McDaniel
Molecular Beam Mass Spectrometry Studies of the Thermal Decomposition of Tetrakis(Dimethylamino)Titanium / C.C. Amato-Wierda ; E.T. Norton, Jr.
Kinetic and Mechanistic Studies of the Chemical Vapor Deposition of Ti-Si-N Thin Films with Ti(NMe[subscript 2])[subscript 4](TDMAT), NH[subscript 3], and Si H[subscript 4] / E.T. Norton ; C. Amato-Wierda
Evaluation of Gas Phase Reaction Rate Constant by Deposition Profile Analysis for In Situ Counter Diffusion CVD / Y. Egashira ; H. Tanaka ; T. Mina ; N. Mori ; K. Ueyama
Integration of a Quadrupole Mass Spectrometer and a Quartz Crystal Microbalance for In Situ Characterization of Atomic Layer Deposition Processes in Flow Type Reactors / A. Rahtu ; M. Ritala
Nanostructures and Quantum Dots
Nanostructures by CVD Assisted Methods Using Inorganic Precursors / P. Doppelt ; R. Even ; F. Marchi ; V. Bouchiat ; H. Dallaporta ; S. Safarov ; D. Tonneau ; P. Hoffmann ; F. Cicoira ; I. Utke ; B. Dwir ; K. Leifer ; E. Kapon
Effect of Carbon Predeposition Nucleation of Quantum Dots / Q. Zhao ; D. Greve
Plasma-Enhanced MOCVD of Smooth Nanometersized Metal/Silicon Single- and Multilayerfilms / F. Hamelmann ; G. Haindl ; A. Aschentrup ; A. Klipp ; U. Kleineberg ; P. Jutzi ; U. Heinzmann
Modeling, Reactor Design, and Process Control
Multicomponent Transport and Mixed Convection Flows in CVD Reactors / A. Ern
A Benchmark Solution for Multi-Dimensional Thermal CVD Modeling with Detailed Chemistry / C.R. Kleijn
On the Occurrence of Non-Symmetric Flows in Axisymmetric CVD Reactors / H. van Santen ; H.E.A. van den Akker
The Dynamics of Thin Film Growth: A Modeling Study / M. Gallivan ; R. Murray ; D. Goodwin
Improvement of Temperature Uniformity in Rapid Thermal CVD Systems Using Multivariable Control / F. van Bilsen ; R. De Keyser
Systematic Approach to Controlling Abnormal Structures Growth in CVD - Simulation of Nodule Structure Evolution
A Two-Dimensional Simulation Model for Oxy-Acetylene Flame CVD of Diamond Films / M. Okkerse ; C. Kleijn ; H. van den Akker ; M.H.J.M. de Croon ; G.B. Marin
Silicon Films Morphology Design Through Multiscale CVD Modeling
Numerical Simulation of Silicon Carbide Deposition in a Cold Wall CVD Reactor / G. Chaix ; A. Dolle t ; M. Matecki ; Y. Wang
Effect of Gas Phase Nucleation on Silicon Carbide Chemical Vapor Deposition / A.N. Vorob'ev ; A.E. Komissarov ; M.V. Bogdanov ; S. Yu. Karpov ; A.A. Lovtsus ; Yu.N. Makarov ; S.A. Lowry
CVD of SiC from CH[subscript 3]SiCl[subscript 3] in a Hot-Wall-Reactor System: Transport Pheonomena and Kinetic Aspects / V.K. Wunder ; N. Popovska ; H. Gerhard ; G. Emig ; P. Kaufmann ; L. Kadinski ; F. Durst
Modeling and System Design for Atmospheric Pressure CVD of YSZ / T. Besmann ; V. Varanasi ; T. Starr ; T. Anderson
A Stagnation-Flow MOCVD Reactor for Intelligent Deposition of YBCO Thin Films / A. Tripathi ; D. Boyd ; H. Atwater ; L. R. Raja ; R. J. Kee ; J. Musolf
Metalorganic Chemical Vapor Deposition
New Liquid Precursors for CVD of Metal-Containing Materials / R. Gordon
Novel MOCVD Process for the Low Temperature Deposition of the Chromium Nitride Phases / F. Maury ; D. Duminica ; F. Senocq
MOCVD of WN[subscript x] Thin Films Using Novel Imido Precursors / S. Johnston ; C. Ortiz ; O. Bchir ; Y. Zhang
Vapor Phase Epitaxy of Magnesium Oxide on Silicon Using Methylmagnesium Alkoxides / S.S. Lee ; S.Y. Lee ; C. Kim ; Y. Kim
Use of Ti(dpm)[subscript 2](Opr[superscript i])[subscript 2] Precursor to Obtain TiO[subscript 2] Film / V. Krisyuk ; A.E. Turgambaeva ; I.K. Igumenov ; V.G. Bessergenev ; I.V. Khmelinskii ; R.J.F. Pereira
Monitoring of MOCVD Fabrication of LaF[subscript 3] Films Using the Novel La(hfac)[subscript 3] - Diglyme Adducts and In Situ Synthesized La(hfac)[subscript 3] Anhydrous Precursor / G.G. Condorelli ; I.L. Fragala
Ceramics, Composites, and Hard Materials
Chemical Vapor Deposition of Aluminum on Silicon Carbide for the Investigation of the Interfacial Microstructure in Discontinuously Reinforced Aluminum / P. Oritz ; D. Oquab ; C. Vahlas ; I. Hall
Development of CVD Mullite Coatings / S.N. Basu ; V.K. Sarin
Evaluation of Various Hypotheses on the Influence of Nitrogen on Diamond Growth in an Oxy-Acetylene Torch Reactor
MOCVD of Aluminosilicate Corrosion Protection Coatings / S.M. Zemskova ; J.A. Haynes ; T.M. Besmann
Chemical Vapor Deposition of MoS[subscript 2] on and in TiN Coatings / H. Keune ; G. Wahl ; W. Lacom
Measurement of the Retarding Effect of HCl on the Rate of CVD of Titaniumdiboride / Ch.-Ho Yu ; E. Zimmermann ; D. Neuschutz
Factors Affecting the Amount of Carbon in Titanium Carbide Films Made by CVD / C. C. Amato-Wierda ; K. E. Versprille ; P. Ramsey
Characterization of Ti-W-C Thin Films Deposited by CVD / C.C Amato-Wierda ; H. X. Ji
MOCVD of Chromium Carbide from Bis-Ethyl-Benzene-Chromium / M. Satschko
Effect of H[subscript 2]S on the Microstructure and Deposition Characteristics of Chemically Vapor Deposited Al[subscript 2]O[subscript 3] / S. Ruppi ; A. Larsson
Cosmo-Mimetic Carbon Micro-Coils / D. Motojima ; X. Chen ; W. In-Hwang ; T. Kuzuya ; M. Kohda ; Y. Hishikawa
Morphology of Carbon Micro-coils Grown by Catalytic Decomposition of Hydrocarbons / W.-In Hwang ; S. Motojima
Silicon and Silicon Germanium Materials
Chemical Vapor Deposition of Low Trap Density SiGe Quantum Well Layers on Silicon / S. Kar ; P. Zaumseil
Loading Effects during Non-Selective Epitaxial Growth of Si and SiGe / J. Pejnefors ; S.-L. Zhang ; J.V. Grahn ; M. Ostling
Thermodynamic Analysis of Selective Epitaxial Growth of Silicon / W.-S. Cheong ; J.H. Joung ; J.W. Park ; D.J. Ahn
Nanocrystals Formation and Microstructure Evolution of Amorphous Si and Si[subscript 0].7Ge[subscript 0.3] by Using Low Pressure Chemical Vapor Deposition / T.-S. Yoon ; D.-H. Lee ; J.-Y Koon ; K.B. Kim
The Profile Control of n-type Doping in Low and High Temperature Si Epitaxy for High Frequency Bipolar Transistors / H.H. Radamson ; B. Mohadjeri ; B.G. Malm ; G. Landgren
CVD-Epitaxial Growth on Porous Si for ELTRAN SOI-Epi Wafers / N. Sato ; S. Ishii ; T. Yonehara
Dislocation Generation in Selective and Non Selective SiGe Epitaxy / C. Fellous ; F. Romagna ; D. Dutartre
MOSFET Evaluation of Ultraclean-CVD Si and SiGe Grown at 550[degree]C on SIMOX / K. Fujinaga
Global Model of Silicon Chemical Vapor Deposition in Centura Reactors / A.S. Segal ; A.V. Kondratyev ; A.O. Galyukov ; S.Yu. Karpov ; W. Siebert ; P. Storck ; S. Lowry
A Comparison of Commonalities and Differences of Silicon-Based Thin Films CVD Processes for ULSI Device Technologies / V. Vassiliev
Metals, Metallization, and Diffusion Barriers
Selective Nucleation and Area Selective OMCVD of Gold on Patterned Self-Assembled Organic Monolayers: A Comparison of OMCVD and PVD / R.A. Fischer ; C. Winter ; U. Weckenmann ; J. Klashammer ; V. Scheumann ; S. Mittler
Surface Analysis of Al Film Prepared from Dimethyl-Aluminum-Hydride / M. Sugiyama ; H. Ogawa ; H. Itoh ; J. Aoyama ; Y. Horiike ; H. Komiyama ; Y. Shimogaki
Chemical Vapor Deposition of Titanium Nitride and Titanium Silicon Nitride Thin Films from Tetrakis-(dimethylamido) Titanium and Hydrazine as a Co-Reactant / D.A. Wierda
Chemical Vapor Deposition of Copper Using hfacCu[superscript (1)]DMB(3,3-dimethyl-1-butene) Liquid Precursor / K.- K. Choi ; S.-W. Rhee
Reaction of Bis-(2,4-Pentanedionato) M(II) (M= Ni, Cu) Under Low Pressure CVD Conditions / C.R. Vestal ; H.M. Sturgill ; T.C. DeVore
Metalorganic Chemical Vapor Deposition of Nickel Films: Investigation of a New Precursor, [Ni(tmen)([mu]-tfa) subscript 2]([mu]H[subscript 2]O) / J.-K. Kuang ; A. Gleizes
Platinum Thin Films Obtained via MOCVD on Quartz and CaF[subscript 2] Windows as Electrode Surfaces for In Situ Spectroelectrochemistry / S. Santi ; G. Carta ; S. Garon ; L. Rizzo ; G. Rossetto ; P. Zanella ; D. Barreca ; E. Tondello
Surface Adsorption of WF[subscript 6] on Si and SiO[subscript 2] in Selective W-CVD / Y. Yamamoto ; T. Matsuura ; J. Murota
CVD Tungsten Via Void Minimization for Sub 0.25 [mu]m Technology / A.M. Haider ; D.J. Rose ; J.R.D. Debord ; S.P. Zuhoski
Three-Dimensional Computer Simulation of WSi[subscript x] CVD VLSI Processing-Effect of Outlet Position / K. Sugawara ; M. Kunishige ; T. Muranushi ; Y.K. Chae
Processing of Tungsten Single Crystals by Chemical Vapor Deposition / R. Zee ; Z. Xiao ; H.S. Gale ; B.A. Chin ; L.L. Begg
Simplified CMP Planarization Process Module for Shallow Trench Isolation Applications / K. Kapkin ; M. Mogaard ; T. Curtis ; J. deRuiter
Dielectric Materials
Reactor Scale Simulation of Metal Oxide Deposition from an Inorganic Precursor / J.V. Cole ; A. Nangia ; T. Mihopoulas ; R. Hegde
Atomic Layer Deposition of High-k Oxides / K. Kukli ; M. Vehkamaki ; T. Hanninen ; T. Hatanpaa ; P.I. Raisanen ; M. Leskela
Quality Improvement of SiO[subscript 2]-Films by Adding Foreign Gases in Photo-Chemical Vapor Deposition / Y. Motoyama ; J.-i. Miyano ; T. Yokoyama ; K. Toshikawa ; T. Mori ; H. Mutou ; K. Kurosawa ; A. Yokotani ; W. Sasaki
SiO[subscript 2] Deposition Mechanism in Photo-Chemical Vapor Deposition Using Vacuum Ultraviolet Excimer Lamp / J. Miyano
Kinetic Growth of Al[subscript 2]O[subscript 3] Thin Films Using Aluminium Dimethylisopropoxide as Precursor / G. A. Battison ; R. Gerbasi
Atomic Layer Deposition of Metal Oxide Films by using Metal Alkoxides as an Oxygen Source
Optimization of LPCVD Nitride Deposition Conditions for Non-Volatile Memory Inter Poly Dielectric Applications / M.J. Teepen ; M.A.A.M. van Wijck ; H. Sprey
Ultra Thin TiO[subscript 2] Films Deposited by Atomic Layer Chemical Vapor Deposition / M. Schuisky ; A. Aidla ; J. Aarik ; M. Ludvigsson ; A. Harsta
Characterization of Ta[subscript 2]O[subscript 5] Films Prepared by ALCVD / K. Forsgren ; J. Sundqvist
In-Situ Preparation of Ti-Containing Ta[subscript 2]O[subscript 5] Films by Halide CVD
CVD of Zr-Sn-Ti-O for Capacitor Applications / Y. Senzaki ; G. Alers ; A. Hochberg ; D. Roberts ; J. Norman ; R. Fleming ; H. Krautter
Gallium Nitride and Other III-V Materials
Investigations of Chemical Vapor Deposition of GaN Using Synchrotron Radiation / C. Thompson ; G.B. Stephenson ; J.A. Eastman ; A. Munkholm ; O. Auciello ; M.V. Ramana Murty ; P. Fini ; S.P. DenBaars ; J.S. Speck
Reaction-Transport Models of the Metalorganic Vapor Phase Epitaxy of Gallium Nitride / R.P. Pawlowski ; C. Theodoropoulos ; A.G. Salinger ; H.K. Moffat ; T.J. Mountziaris ; J.N. Shadid ; E.J. Thrush
Growth of Hexagonal GaN Films by MOCVD Using Novel Single Precursors / C.G. Kim ; S.H. Yoo ; J.H. Lee ; Y.K. Lee ; M.M. Sung
In Situ Measurement of the Decomposition on GaN OMVPE Precursors by Raman Spectroscopy / C. Park ; S. Lee ; J. Seo ; M. Huang ; T.J. Anderson
Growth Kinetics and Mechanistic Studies of GaN Thin Films Grown by OMVPE Using (N[subscript 3])[subscript 2]Ga[(CH[subscript 2])[subscript 3]NMe subscript 2] as Single Source Precursor / A. Wohlfart ; A. Devi ; W. Rogge ; J. Schafer ; J. Wolfrum
Experimental and Numerical Study of InGaAsP Materials Growth Kinetics and Composition / O. Feron ; Y. Nakano
Ruthenium Doped Indium Phosphide Growth by Low Pressure Hydride Vapor Phase Epitaxy / D. Soderstrom ; S. Lourdudoss ; M. Wallnas ; A. Dadgar ; O. Stenzel ; D. Bimberg ; H. Schumann
Quasi-Thermodynamic Models of Surface Chemistry: Application to MOVPE of III-V Ternary Compounds / E.V. Yakovlev ; R.A. Talalaev ; Yu.A. Shopolyanskiy ; Y.N. Makarov
Electronic, Optical, and Magnetic Materials
Chemical Vapor Deposition and Magnetoresistance of Granular Cu-Co Films / I.S. Chuprakov ; K.-H. Dahmen
Diagnostics of Metalorganic Chemical Vapor Deposition of (Ba, Sr)TiO[subscript 3] Films by Microdischarge Optical Emission Spectroscopy / S. Momose ; T. Nakamura ; K. Tachibana
Bismuth Titanate Thin Films Deposited by Halide Chemical Vapor Deposition / S. Khartsev ; A. Grishin
LPCVD of Optical Interference Coatings for Micro-Optical Applications / M. George ; D.Z. Rogers
Evaluation of Precursors for the Chemical Vapour Deposition of Tin Oxide / A.M.B. van Mol ; G.R. Alcott ; C.I.M.A. Spee ; J.C. Schouten
Characteristics of Silicon Oxy-Nitride Thin Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition / C. Simionescu ; F. Bounasri ; S.G. Wallace ; H.K. Haugen ; J.A. Davies ; P. Mascher
CVD of Molecule-based Conductors and Magnets / L. Valade ; D. deCaro ; H. Casellas ; M. Basso-Bert ; C. Faulmann ; J.-P. Legros ; P. Cassoux ; L. Aries
Stability of RuO[subscript 2] Bottom Electrode and Its Effect on the Ba-Sr-Ti Oxide Film Quality / Y.-J. Oh ; S.H. Moon ; C.-H. Chung
Multilayers for the Growth of HTc Superconducting Tape: A Full MOCVD Approach / R. Lo Nigro ; G. Malandrino
Fundamental Chemistry and Mechanisms
Atomistic Modeling of Chemical Vapor Deposition: NO on the Si (001) (2x1) Reconstructed Surface / N. Tanpipat ; J. Andzelm ; B. Delley ; A. Korkin ; A. Demkov
Simulation of Surface Diffusion of Silicon and Hydrogen on Single Crystal Silicon Surfaces / S. Somasi ; B. Khomami ; R. Lovett
3.

図書

図書
editors, Hisham Z. Massoud ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2000  xiv, 539 p. ; 27 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-2
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4.

図書

図書
editor, L. Mendicino ; [jointly sponsored by the Dielectric Science and Technology Division]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  vii, 212 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-6
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5.

図書

図書
editor, Y. Kuo ; [sponsored by] Electronics and Dielectric Science and Technology Divisions [of the Electrochemical Society]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  xi, 340 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; 2000-31
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目次情報: 続きを見る
Preface
Reviews of TFT Research Activities
Advances in Printed Liquid Crystal Displays with Plastic Substrates / E. Lueder
A Brief Review of Thin-Film Transistor Research Done in Tokyo Institute of Technology / M. Matsumura
Amorphous and Microcrystalline Silicon TFTs
ECR-PECVD of Silicon Nitride and Hydrogenated Amorphous Silicon at 80[degree]C For TFTs / A. J. Flewitt ; A. P. Dyson ; J. Robertson ; W. I. Milne
Amorphous Silicon Thin Film Transistor Fabricated with a New Copper Dry Etching Method / S. Lee ; Y. Kuo ; J. P. Donnely ; J.-Y. Tewg ; H. Lee
Microcrystalline Silicon TFTs For AMLCDs / I. D. French ; P. Roca i Cabarrocas ; S. C. Deane ; R. B. Wehrspohn ; M. J. Powell
Use of 120[degree]C n[superscript +] [mu]c-Si:H in Low Temperature TFT Fabrication / T. Charania ; A. Sazonov ; A. Nathan
Process Considerations for Small Area a-Si:H Vertical Thin Film Transistors / I. Chan ; B. Park
Polycrystalline Silicon TFTs
Future Trends in Low Temperature Poly-Si TFT-LCD by Excimer Laser Anneal / S. Uchikoga
Low Temperature Process Technologies and "Process Integration" for High Performance Polycrystalline Silicon Thin-Film Transistors / S. Higashi
Top-Gate Amorphous Si Air-Gap Transistors with Poly-Si Contacts / P. Mei ; J. Ho ; R. Lau ; J. P. Lu ; B. Street ; J. Boyce
Full Optimized Process of Polysilicon TFT's Using Very Large Excimer Laser / Y. Helen ; G. Gautier ; K. Mourgues ; T. Mohammed-Brahim ; F. Raoult ; O. Bonnaud ; C. Prat ; D. Zahorski ; D. Lemoine
Polycrystalline Silicon Thin Film Transistors Free from Large Angle Grain Boundaries / M. Maekawa ; Y. Nakamura ; Y. Umenaka ; J. Takagi ; M. Hijikigawa
Low Temperature Poly-Si TFT-LCDs Using P-type Technology / K.-J. Kim ; Y.-M. Ha ; J.-C. Yeo ; B.-K. Kim ; H.-S. Choi ; D.-G. Kim
High Performance Low Temperature Polysilicon TFT'S with Ultra-thin Liquidphase Deposited Gate Oxide and N[subscript 2]O Plasma Treatment / C.-F. Yeh ; S.-C. Wang ; J.-N. Jeng ; C.-Y. Lu
Crystallization, Etching, Deposition, Hydrogenation, and Metallization
Silicide Mediated Crystallization of Patterned Amorphous Silicon in the Electric Field / S. J. Park ; K. H. Kim ; B. R. Cho ; A. Y. Kim ; S. Y. Yoon ; J. Jang
Two-Dimensionally Position-Controlled Ultra-Large Grain Growth Based on Phase-Modulated Excimer-Laser Annealing Method / M. Nakata
The Lateral Grain Growth of ELA Poly-Si by Employing Selective Melting and Lateral Heat Sink / J.-H. Jeon ; M.-C. Lee ; J.-W. Park ; M.-K. Han
Novel Wet Taper Etching of Interconnects on Large Area Substrates Using Galvanic Reaction / T. Kaneko ; Y. Hashimoto ; K. Ono ; K. Fujii ; K. Onisawa
High Quality Silicon Oxide Deposited with A Multipolar Electron Cyclotron Resonance Plasma Source / G. Isai ; A. Kovalgin ; J. Holleman ; P. Woerlee ; H. Wallinga
Effects of NH[subscript 3]/N[subscript 2] Plasma Treatment on Very-Low-Temperature (100[degree]C) Oxides / C.-H. Kim ; S.-H. Jung ; W.-J. Nam
Electroless Deposition of Ni-P Alloy in Electronics / T.N. Khoperia
Devices and Modeling
Mechanisms Underlying the Off Characteristics of a-Si:H Thin Film Transistors / P. Servati
Analysis of the Leakage Current of Poly-Si TFT Using Counter-Doping Process / J. Y. Yang ; S. H. Yu ; J. H. Kim
Low Temperature Poly-Si TFT with Lateral Body Terminal for Stability Improvement / J. S. Yoo ; M. C. Lee ; I. H. Song ; M. K. Han
Low Frequency Noise in CdSe Thin-Film Transistors / M. J. Deen ; S. L. Rumyantsev ; I. Glick ; A. Smozh ; M. Westcott ; D. Waechter
Materials
Defect Reduction Technologies Used to Improve Characteristics of Polycrystalline Silicon Thin Film Transistors / Y. Tsunoda ; T. Sameshima
Polysilicon Thin Film Transistors on Glass-Ceramic Substrates / S. M. Krasulya ; N. I. Nemchuk ; D. G. Ast ; J. G. Couillard
Structural Differences between Deuterated and Hydrogenated Hydrogenated Silicon Nitride/Oxynitride / A. Shih ; S.-C. Lee ; T. R. Yang ; C. C. Lu
Highly Packed and Ultra-Large Si Grains Grown by a Single-Shot Irradiation of Excimer-Laser Light Pulse / Y. Sano ; W-C. Yeh
Low-Pressure CVD of Germanium-Silicon Films Using Silane and Germane Sources / C. Salm
Unhydrogenated Polycrystalline Silicon-Germanium Thin Film Transistors by LPCVD / D. Guillet ; R. Rogel ; M. Sarret
New and Novel Applications
Flat Panel X-Ray Image Detectors for Medical Imaging Applications / Y. Izumi ; Y. Yamane ; F. Funada ; S. Adachi ; S. Yamada
Analog Addressed Microdisplays / A. Van Calster
Polysilicon Thin Film Transistor Development for Smart Power Applications / Y. Wu ; F. Robb ; J. Shen ; S. Robb ; K. Kamekona
Polysilicon Thin Film Transistor and EEPROM Characteristics for Three Dimensional Memory / J. R. Lindsey ; T. S. Kalkur
Active Pixel TFT Array for Digital Imaging Applications / K.S. Karim
Author Index
Subject Index
Preface
Reviews of TFT Research Activities
Advances in Printed Liquid Crystal Displays with Plastic Substrates / E. Lueder
6.

図書

図書
editors, M. Cahay ... [et. al] ; [sponsored by] Dielectric Science and Technology, Electronics, and Luminescence and Display Materials Divisions [of the Electrochemical Society]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  viii, 280 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-28
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目次情報: 続きを見る
Preface
Field Emitter Arrays
Tip Self-Heating to Enhance Microfabricated Cold Cathode Operation Lifetime / P.R. Schwoebel ; C.A. Spindt ; C.E. Holland ; J.A. Panitz
Laser Assisted Fabrication of Single Crystalline Tungsten Rods for use as Field Emitting Cathodes / K. Larsson Bjorklund ; C. Ribbing ; H. Norde ; M. Boman
Theory of H Induced Enhancement of Field Emission from and O Covered Mo(110) Surface / P. von Allmen ; R. Ramprasad ; L.R.C. Fonseca ; P. Ordejon
Process Simulation of a Silicon Field Electron Emitter with Integrated Double-gated Beam Focusing Lens / G. Oleszek ; M. Rodriquez
Carbon Nanotubes
Carbon Nanotube Cold Cathodes Fabrication and Properties / C. Bower ; W. Zhu
Calculating the Field Emission Current from a Carbon Nanotube
Scanning Anode Field Emission Microscopy on Carbon Nanotube Thin Film Emitters / L.O. Nilsson ; O. Groenig ; P. Groenig ; L. Schlapbach
Template Based Carbon Nanotubes as A Field Emitter / S.-H. Jeong ; H.-Y. Hwang ; K.-H. Lee ; W.-K. Cho ; K.-Y. Kim ; H.-S. Jeong
Field Emission Cathode from Aligned Arrays of Carbon Nanotubes / A. Govyadinov ; P. Mardilovich ; D. Routkevich
Electron Emission Cooling
Cooling by Field Emission into the Vacuum with Resonant Tunneling: Design Parameters / R. Tsu
New Results on Microelectronic Cooling Using the Inverse Nottingham Effect: Low Temperature Operation and Efficiency / P.H Cutler ; N.M. Miskovsky ; N. Kumar ; M.S. Chung
Theory and Simulation
The Semiconductor Statistical Hyperbolic-Ellipsoidal Model For Evaluation of Current From Microstructures / K.L. Jensen
Non Equilibrium Field Emission from Wide Bandgap Semiconductors / G.L. Bilbro
Onset of Current Self-Quenching in an InP/CdS/LaS Cold Cathode / Y. Modukuru ; M. Cahay ; P.D. Mumford
Negative Electron Affinity/ Low Electron Affinity
Novel Electron Sources / V.T. Binh ; V. Semet ; J.P. Dupin
Effect of Surface Properties on Electron Energy Distribution from C(111) and C(100) Surfaces / J. Yater ; A. Shih
Synthesis and Work Function Measurement of LaS and NdS Bulk Samples / J. Thachery ; H. Tang ; P. Boolchand
Carbons, Diamond, and a-Silicon
Electron Emission from Carbon Films / R.J. Nemanich ; F.A.M. Kock ; J.M. Garguilo
Fabrication and Characterization of Cathodoluminescent Devices made Using Porous Silicon as a Cold-Cathode Field Emitter / D. Heyde Elqaq ; M.-A. Hasan
Monolithic Thin Film Edge Emission Diodes / H.R. Kim ; L. Karpov ; V. Bhatia ; M. Weichold
Electron Emission Characteristics of Diamond / B. Pate
Conditioning of Amorphous Cathodes via Current Stressing / S.R.P. Silva ; J.D. Carey ; C.H. Poa ; J.M. Shannon
Field Emission Display Development at Motorola / A.A Talin ; B.F.Coll. Yi Wei ; K.A. Dean ; J.E. Jaskie
Rehybridization of Atomic Orbitals and Field Emission Properties of Nanostructured Graphite-like Materials / A.N. Obraztsov ; A.P. Volkov ; A.I. Boronin ; S.V. Kosheev
Author Index
Subject Index
Preface
Field Emitter Arrays
Tip Self-Heating to Enhance Microfabricated Cold Cathode Operation Lifetime / P.R. Schwoebel ; C.A. Spindt ; C.E. Holland ; J.A. Panitz
7.

図書

図書
editors, P.J. Hesketh ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2000  viii, 258 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2000-19
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Preface
Micromachining
The Microfactory System using Electrochemical Machining / Masayuki Suda ; Kazuyoshi Furuta ; Toshihiko Sakuhara ; Tatsuaki Ataka
Electroplated Nanocrystalline Nickel-Iron Alloys as a New Powerful Material for Microstructured Molding Tools / A. Fath ; W. Leskopf ; K. Bade ; W. Bacher
Lateral Etch Study of Thin Films Using Hydrofluroric Acid Chemistries for MEMS Devices / G. Matamis ; Chuan-Che Wang ; B. Gogoi
Low Surface Tension Etching Solutions for Silicon Dioxide Removal in Microelectromechanical Systems / M. J. Parent ; L. Zazzera ; P. Rajtar ; F. E. Behr
Hybrid Micromachining and Surface Microstructuring of Alumina Ceramic / P. Mardilovich ; D. Routkevitch ; A. Govyadinov
Microfluidics
Micro Scale Purification Systems for Biological Sample Preparation / A. B. Frazier
Challenges and Solutions for Packaging MEMS and Microsystems / J. Neysmith ; D. F. Baldwin
Fabrication and Characterization of Plastic Microfluidic Devices Modified with Polyelectrolyte Multilayers / L. E. Loscascio ; S. L. R. Barker ; D. Ross ; Jay Xu ; S. Roberson ; M. Tarlov ; M. Gaitan
Bulk-Etched Integrated Mesoscopic Fluidic Interconnects for Fluidic Microdevices / J. A. Scalf ; D. Liepmann ; A. P. Pisano
Electro-Magnetically Actuated Diverting Valve Using LTCC Tapes / J. R. Gillman ; P. Espinoza-Vallejos ; L. Sola-Laguna ; J. J. Santiago-Aviles
Design of a MEMS Magnetic Bi-Stable Valve / D. Creyts IV ; P. J. Hesketh ; G. C. Frye-Mason
Room Temperature, Adhesive Bonding for Wafer Scale Packaging of Fluidic Microsystems / X. Ma ; B. Gierhart ; S. D. Collins ; R. L. Smith
Physical Sensors
Inertial Sensors: The Drive for Aspect Ratio / P. L. Bergstrom
Residual Stress Effect and Improvement Method on the Performance of Diaphragm-Based Piezoelectric Microphones / Mengnian Niu ; Sok Kim
A Post-Processing Method for Suppressing the Residual Mechanical Stress in CMOS Layers, for MEMS Applications / B. Ghodsian ; V. Milanovic
Chemical Sensors
Chemical Microsensors for Aerospace Applications / G. W. Hunter ; P. G. Neudeck ; G. Fralick ; C. C. Liu ; Q. H. Wu ; M. S. Sawayda ; Z. Jin ; J. Hammond ; D. Makel ; W. A. Rauch ; M. Liu ; G. Hall
A MEMS Based Hybrid Preconcentrator/Chemiresistor Chemical Sensor / R. C. Hughes ; S. V. Patel ; R. P. Manginell
Micro-Hotplate, an Useful Concept for Gas Sensing, Fluidics and Space Applications / D. Briand ; O. Guenat ; B. van der Schoot ; T. Hirata ; N. F. de Rooij
Detection of Trace Silver and Copper at an Array of Boron-Doped Diamond Microdisk Electrodes / C. Madore ; A. Duret ; W. Haenni ; A. Perret
FET Based pH and Nitrate Checkers for Acid-Rain Monitoring / S. Wakida ; M. Yamane ; S. Takeda ; Z. Siroma ; Y. Tsujimura ; J. Liu
Biosensors
Microfabricated PMMA Structure for DNA Preconcentration and Electrophoresis / Yu-Cheng Lin ; Chien-Kai Tseng ; Shao-Qin Hou
Soluble Sensors of Telephonic Signals / M. Garnett ; J. L. Remo
Selective Deposition of Octasubstituted Phthalocyanine Materials Based on Hydrophobic / Hydrophilic Surface Interactions / R. A. P. Zangmeister ; N. R. Armstrong
Nanomechanical Detection of Biomolecular Interactions / K. M. Hansen ; Guanghua Wu ; Hai-Feng Ji ; T. Thundat ; R. Datar ; R. Cote ; A. Majumdar
Ultra-Sensative Resonant Frequency Based Mass Detector / B. Ilic ; D. Czaplewski ; H. G. Craighead ; P. Neuzi ; C. Campagnolo ; C. Batt
Microfabrication Processes
Developing a [mu]-Fabrication Course: A Study in Multidisciplinary MEMS Curriculum Development / R. S. Evans
Microstructures for Monitoring Wafer Uniformity of Reactive Ion Etching / R. Leung ; D. W. Howard
Water Dispersible Silanes for Wettability Modification of Polysilicon / A. M. Almanza-Workman ; S. Raghavan ; P. Deymier ; D. J. Monk ; R. Roop
Correlation of Metal Film Grain Size to Optical Measurement Results / T. Robinson ; C. Narayan ; J. Sledziewski ; G. Ready ; S. Alie
Preface
Micromachining
The Microfactory System using Electrochemical Machining / Masayuki Suda ; Kazuyoshi Furuta ; Toshihiko Sakuhara ; Tatsuaki Ataka
8.

図書

図書
editors, R. Singh ... [et al.] ; [sponsord by] Dielectric Science and Technology and Electronics Divisions
出版情報: Pennington, N.J. : Electrochemical Society, c2000  viii, 226 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 99-7
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9.

図書

図書
editors, K.B. Sundaram ... [et al.]
出版情報: Pennington, N.J. : Electrochemical Society, c2001  x, 286 p. ; 23 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2001-7
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Preface
Organizers
Oxide Wear-Out, Reliability, Stress and Interfaces / I:
A Review of Oxide Wearout, Breakdown, and Reliability / D. Dumin
Surface And Interface Study Of Ion Beam Deposited Silicon oxide Thin films / Heinz D. Wazenboeck ; Emmerich Bertagnolli ; Bernhard Basnar ; Juergen Smoliner ; Martin Gritsch ; Herbert Hutter ; Josef Brenner ; C. Tomastik ; Herbert Storri
Study of Inversion Layer Hole Mobility In p-Mosfet During High-field Stressing / R. Jarawal ; D. Misra
Two Limiting Thinnesses Of The Ultrathin Gate Oxide / Samares Kar
SiO[subscript 2] Stress and Interfaces / II:
The Connection Between oxide leakage currents and Si/SiO[subscript 2] Interface Trap Generation / P. M. Lenahan
Charging Damage During Plasma Enhanced Dielectric Deposition / K. Cheung
Kinetics and Mechanisms of Organic Contaminant Interactions at Silicon Surfaces in High Temperature Processes / N. Rana ; P. Raghu ; F. Shadman
SiO[subscript 2] Films and Properties / III:
Remote Plasma Deposited Gate Dielectrics on Si and SiGe Mosfets / T. Ngai ; R. Sharma ; J. Fretwell ; X. Chen ; J. Chen ; W. Brookover ; S. Banerjee
Rapid Thermal Processes of High Permittivity Films on Silicon for ULSI Gate Dielectrics Applications / S. P. Tay ; R. Sharangpani ; Y. Z. Hu
Processing of Thick Thermal Gate Oxides in Trenchs / C. T. Wu ; R. Ridley ; G. Dolny ; T. Grebs ; J. Hao ; S. Suliman ; B. Venkataraman ; O. Awadelkarim ; R. Williams ; P. Roman ; J. Ruzyllo
Electrical Properties of SiO[subscript 2]-Films Prepared by VUV Chemical Vapor Deposition / Y. Motoyama ; J. Miyano ; K. Tosikawa ; Y. Yagi ; K. Kurosawa ; A. Yokotani ; W. Sasaki
SiO[subscript 2] Film Deposition on Different Substrate Materials by Photo- CVD Using Vacuum Ultraviolet Radiation / K. Toshikawa
Silicon Nitrides/ Oxynitrides / IV:
Low Energy Ion Irradiation of Silicon: Compound Formation and Segregation of Impurities / M. Petravic ; J. S. Williams ; P. N. K. Deenapanray
Characteristics of Silicon Oxynitrides Made By ECR Plasmas / J. A. Diniz ; P. J. Tatsch ; J. Swart
Radiation Hardening of Oxynitrides Formed By Low Nitrogen Implantation into Silicon Prior to Oxidation / J. Godoy Fo
Silicon Nitrides/ Oxynitrides II / V:
Material and Process Considerations of Ultra thin Silicon (Oxy) Nitride Films Grown on Silicon and SiO[subscript 2] Surfaces / C. P. D'Emic ; E. P. Gusev ; K. K. Chan ; T. Zabel ; M. Copel ; R. Murphy ; P. Kozolowski ; J. Newbury
Silicon OxyNitride: A Versatile Material for Integrated Optics Application / K. Worhoff ; A. Driessen ; P. V. Lambeck
Characterization of Silicon Oxynitride Thin Films Deposited By ECR-PECVD / C. Simionescu ; J. Wojcik ; H. K. Haugen ; J. A. Davies ; P. Mascher
Silicon Nitrides/ Oxynitrides III / VI:
Characterization of Low- Temperature Magnetoplasma- Grown Si Oxynitride and Si Oxide / H. Ikoma
Advances in Single Wafer Chemical Deposition of Oxide and Nitride films / W. Palmer ; Z. Gabric
High Integrity Direct Oxidation/Nitridation at Low Temperatures Using Radicals / T. Ohmi ; S. Sugawa ; M. Hirayama
Silicon Nitride
Thermally Induced Stress Changes in High Density Plasma Deposited Silicon Nitride Films / R. E. Shah ; H. Baumann ; D. Serries ; M. Mikulla ; R. Keiffer
Effect of Oxygen in Deposited Ultra Thin Silicon Nitride Film on Electrical Properties / K. Muraoka ; K. Kurihara
Influence of Low- energy argon Ion Bombardment and Vacuum Annealing on the Silicon Nitride Surface Properties / I. P. Petrenko ; V. A. Gritsenko ; L. M. Logvinsky ; H. Wong
Authors Index
Subject Index
Preface
Organizers
Oxide Wear-Out, Reliability, Stress and Interfaces / I:
10.

図書

図書
editor, G.S. Mathad ; assistant editors, T. S. Cale ...[et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics
出版情報: Pennington, N.J. : Electrochemical Society, c2003  x, 424 p. ; 24 cm
シリーズ名: Proceedings / [Electrochemical Society] ; v. 2003-13
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Preface
Plasma Processing for the 100 nm Node / Part I:
Plasma Processes
Kinetic Modeling for Multi-Component Thin Film Growth in Plasma-Enhanced Atomic Layer Deposition / J-H. Kim ; J-Y. Kim ; P-K. Park ; S-W. Kang
Incidence of Deposition Parameters on the Structural Properties of Y[subscript 2]O[subscript 3] Grown by Pulsed Injection PE-MOCVD / C. Durand ; C. Vallee ; O. Salicio ; V. Loup ; M. Bonavalot ; O. Joubert ; C. Dubourdieu
Copper-Barrier and Hard-Mask Elaboration by Plasma-Enhanced Chemical Vapor Deposition Using Organosilane Precursors / B. Remiat ; F. Fusalba ; P. Maury ; V. Jousseaume ; C. Lecornec ; F. Gaillard ; J. Durand
Gas-Phase and Surface Reactions in Plasma Enhanced Chemical Etching of High-k Dielectrics / L. Sha ; J.P. Chang
A Comparative Study of the Etching Behavior of Thin AlN and Al[subscript 2]O[subscript 3] Films / M. Engelhardt
Etching of Low-k Interconnect Materials for Next Generation Devices / T. Chevolleau ; N. Posseme ; L. Vallier ; I. Thomas-Boutherin
Resist Transformation during Etching Steps Involved in Patterning Low-k Dielectric Materials: Impact on Process Control / E. Pargon
Adhesion of Copper and Sulfur-Modified SiLK / D.-L. Bae ; J.J. Senkevich ; C. Kezewski ; Y. Kwon ; T.S. Cale
Porous SiOCH Modification Studies Induced by Ashing Processes / Thomas-Boutherin
Modeling Investigation of Plasma Clean Processes / D. Zhang ; D. Denning
Copper Interconnects with Low-k Inter Level Dielectric Films / Part II:
Copper Deposition
Preparation of Cu Films on Polymer Substrate by ECR-MOCVD Coupled with DC Bias at Room Temperature / J-K. Lee ; B-W. Cho
Effect of Novel Plasma Treatment on Superfilling Behavior in Chemically Enhanced CVD (CECVD) Cu Process / S-G. Pyo ; W-S, Min ; D-W. Lee ; S. Kim ; J-G. Lee
A Model of Copper Deposition for the Damascene Process / C. Gabrielli ; J. Kittel ; P. Mocoteguy ; H. Perrot ; A. Zdunek ; P. Bouard ; M. Haddix ; L. Doyen ; M.C. Clech
AFM Observation of Microstructural Evolution at Room Temperature in Electrodeposited Copper Metallization / S. Ahmed ; D.N. Buckley ; A. Arshak ; A.M. O'Connell ; L.D. Burke
"Seedless" Electrochemical Deposition of Copper on Liner-Materials for ULSI Devices / D.J. Duquette ; S.J. Kim ; M.J. Shaw
Electroless Metallization of Hydrogen-Terminated Si[left angle bracket]100[right angle bracket] Surface Functionalized by Viologen / W.H. Yu ; E.T. Kang ; K.G. Neoh
Barrier and Low-k Films
TiZrN as a Copper Barrier for 0.13 [mu]m and 0.09 [mu]mTechnology Nodes / L. Swedberg ; C. Prindle
Nanostructured Ta-Si-N Thin Films as Diffusion Barriers between Cu and SiO[subscript 2] / L.W. Lai ; C.C. Chang ; J.S. Chen ; Y.K. Lin
Selectivity Studies on Tantalum Barrier Layer for Copper Chemical Mechanical Planarization / A. Vijayakumar ; T. Du ; K.B. Sundaram ; V. Desai
Investigation of Barrier Layers for Cu-Ultra Low-k Porous Polymer Integration / L.Y. Yang ; D.H. Zhang ; C.Y. Li ; P.D. Foo ; K. Prasad ; C.M. Tan
Atomic Layer Deposition of Ruthenium Glue Layer for Copper Damascene Interconnect / O-K. Kwon
Introducing Advanced ULK Dielectric Mateials in Interconnects: Performance and Integration Challenges / C. Le Cornec ; K. Haxaire ; T. Mourier ; P.H. Haumesser ; S. Maitrejean ; J. Simon ; A. Chabli ; G. Passemard
Surface Modification of Porous Low-k Dielectrics / Q.T. Le ; C.M. Whelan ; H. Struyf ; S.H. Brongersma ; T. Conard ; W. Boullart ; S. Vanhaelemeersch ; K. Maex
Structural and Electrical Characteristics of Low Dielectric Constant Porous Hydrogen Silsesquioxane for Cu Metallization / J.H. Wang ; P.T. Liu ; T.C. Chang ; W.J. Chen ; S.L. Cheng ; J.Y. Lin ; L.J. Chen
Nanoporous Low-k Polyimide Films Prepared from Poly(Amic Acid) with Grafted Poly(Acrylic Acid)/Poly (Ethylene Glycol) Side Chains / W.C. Wang ; C.K. Ong ; L.F. Chen
X-Ray Photoelectron Spectroscopic Study of Surface Modification of SiLK under UV-Irradiation / Y. Uchida ; T. Fukuda ; H. Yanazawa
Characteristics of Low-k Methyl-Silsesquiazane (MSZ) for CMP Process Using Oxygen Plasma Treatment / T.M. Tsai ; S.T. Yan ; Y.C. Chang ; H. Aoki ; T.Y. Tseng
Copper CMP and Reliability
Electrochemical Planarization of Copper
A Multiscale Mechanical CMP Model for Patterned Wafers / J. Seok ; C.P. Sukam ; A.T. Kim ; J.A. Tichy
The Roles of Complexing Agents on Copper CMP / G. Lim ; T.E. Kim ; J.-H. Lee ; J. Kim ; H.-W. Lee
The Effect of Inhibitor and Complexing Agents on Cu CMP / Y. Luo
Role of Oxidizer and Inhibitor on Chemical Mechanical Planarization of Copper / S.C. Kuiry ; S. Seal
Effect of Abrasive Particles on Chemical Mechanical Polishing Performance / D. Tamboli ; G. Banerjee ; S. Chang ; M. Waddell ; I. Butcher ; Q. Arefeen ; S. Hymes
Chemical Mechanical Planarization of Ruthenium for Capacitor Bottom Electrode in DRAM Technology / S-H. Lee ; Y-J. Kang ; J-G. Park ; S-I. Lee
Industry Challenges in Post-Etch Cleaning Chemistries for Advanced Copper/Low-k Applications / M.A. Fury
Cleaning of Copper Surface Using Vapor-Phase Organic Acids / T. Yagishita ; K. Ishikawa ; M. Nakamura
Time-Zero Failure Current Measurement for Early Monitoring of Defective Cu Lines at Wafer Level / J-H. Park ; B-T. Ahn
Annealing Characteristics of Copper Films for Power Device Applications / L. Castoldi ; S. Morin ; G. Visalli ; T. Fukada ; M. Ouaknine ; E.H. Roh ; W.S. Yoo
The Stability of Carbon-Doped Silicon Oxide Low Dielectric Constant Thin Films / Y.H. Wang ; R. Kumar
Nickel Silicide Formation Using a Stacked Hotplate-Based Low Temperature Annealing System / T. Murakami ; B. Froment ; V. Carron ; W-S. Yoo
3-D Interconnects
3-D Electromigration Modeling and Simulation in Aluminum-Silicon Dioxide and Copper-Low-k Multilevel Interconnects / V. Sukharev ; R. Choudhary ; C.W. Park
Transient Thermal and Mechanical Modeling of 3D-IC Structures / J. Zhang ; J.-Q. Lu ; R.J. Gutmann
3D System-on-a-Chip Using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects / A. Jindal ; J.J. McMahon ; K.-W. Lee ; R.P. Craft ; B. Altemus ; D. Cheng ; E. Eisenbraum
The Impact of Wafer-Level Layer Transfer on High Performance Devices and Circuits for 3D IC Fabrication / K.W. Guarini ; A.W. Topol ; M. Ieong ; K. Bernstein ; K. Xiu ; R.V. Joshi ; R. Yu ; L. Shi ; M.R. Newport ; D.V. Singh ; G.M. Cohen ; H.B. Pogge ; S. Purushothaman ; W.E. Haensch
Wafer Bonding and Thinning Integrity for 3D-IC Fabrication
Author Index
Subject Index
Preface
Plasma Processing for the 100 nm Node / Part I:
Plasma Processes
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