| 1.
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sponsored by the Japan Society of Applied Physics ; in cooperation with the Institute of Electronics, Information and Communication Engineers of Japan ... [et al.]
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| 2.
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sponsor, IEEE Electron Devices Society ; co-sponsor, the Institute of Electrical Engineers of Japan
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| 3.
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sponsored by the Institute of Electrical Engineers of Japan ; co-sponsored by the IEEE Electron Devices Society
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| 4.
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general chairman, Dr. L. Lorenz ; sponsors, VDE, IEEE Electron Devices Society, IEE Japan, EUREL
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| 5.
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sponsor, IEEE Electron Devices Society ; co-sponsor, the Institute of Electrical Engineers of Japan
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| 6.
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sponsored by the Japan Society of Applied Physics ; in cooperation with the Institute of Electronics, Information and Communication Engineers of Japan ... [et al.]
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| 7.
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sponsored by the Technical Committee on Electron Devices: the Institute of Electrical Engineers of Japan ; co-sponsored by the IEEE Electron Devices Society ; in cooperation with the Technical Group on Silicon Devices and Materials of the Institute of Electrics, Information and Communication Engineers of Japan
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| 8.
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sponsored by the Japan Society of Applied Physics ; in cooperation with the Institute of Electronics, Information and Communication Engineers of Japan ... [et al.]
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| 9.
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Sponsored by the Japan Society of Applied Physics ; in cooperation with the Institute of Electronics, Information and Communication Engineers of Japan ... [et al.]
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| 10.
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sponsored by the Japan Society of Applied Physics ; in cooperation with the Institute of Electronics, Information and Communication Engineers of Japan ... [et al.]
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| 11.
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edited by: Richard K. Williams, B. Jayant Baliga ; sponsored by the IEEE Electron Devices Society ; co-sponsored by the Institute of Electrical Engineers of Japan
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| 12.
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sponsored by the Japan Society of Applied Physics ; in cooperation with the Institute of Electronics, Information and Communication Engineers of Japan ... [et al.]
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| 13.
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sponsored by IEEE Electron Devices Society and Institute of Electrical Engineers of Japan
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