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1.

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1. Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003) : 10-12 December, 2003, Pan Pacific Hotel, Singapore
edited by Mahadevan K. Iyer, Toh Kok Chuan, Mui Yew Cheong ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE CPMT Society, IMAPS
出版情報: Piscataway, N.J. : IEEE, c2003  xviii, 827 p. ; 30 cm
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2.

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2. Proceedings ICT2001, XX International Conference on Thermoelectrics : 8-11th June 2001, Beijing, the People's Republic of China
hosted by China Industrial Association of Power Sources ; Sponsored by Tianjin Lantian High-Tech Power Sources, Joint-Stock Co., Ltd ; supported by the International Thermoelectric Society, Tianjin Institute of Power Sources
出版情報: Piscataway, NJ : IEEE Service Center, c2001  xix, 541 p. ; 28 cm
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3.

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3. Electrical performance of electronic packaging, October 21-23, 2002, Hyatt Regency Monterey, Monterey, Califolnia
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
出版情報: Piscataway, N.J. : IEEE Service Center, [2002]  xi, 373 p. ; 28 cm
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4.

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4. Proceedings of 2nd Electronics Packaging Technology Conferenc : [8-10 December, 1998, Raffles City Convention Center, Singapore] (: soft. ; : case.)
edited by Andrew A.O. Tay, Lim Thian Beng ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ... [et al.]
出版情報: Piscataway, New Jersey : IEEE, c1998  361 p. ; 30 cm
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5.

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5. Seventh Biennial IEEE International Nonvolatile Memory Technology Conference : proceedings, 1998 conference, June 22-24, 1998, Albuquerque NM, USA (Softbound ed. ; Microfiche ed.)
sponsors, IEEE Components, Packaging, & Manufacturing Technology Society, IEEE Computer Society
出版情報: [New York] : Institute of Electrical and Electronics Engineers, c1998  vii, 114 p. ; 28 cm
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6.

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6. 1999 Proceedings, 49th Electronic Components & Technology Conference, June 1-4, 1999, San Diego, California USA (: soft ; : case)
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Industries Association
出版情報: Piscataway, NJ : IEEE Service Center, c1999  xxvii, 1269 p. ; 28 cm
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7.

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7. Electrical contacts-1999 : proceedings of the Forty-fifth IEEE Holm Conference on Electrical Contacts (:case.)
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
出版情報: Piscataway, NJ : IEEE Service Center, c1999  xvi, 251 p. ; 28 cm
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8.

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8. 1998 Proceedings, 48th Electronic Components & Technology Conference, May 25-28, 1998, Seattle, Washington USA (: soft. ; : case.)
[jointly sponsored by the Components, Packaging, and Manufacturing Technology Society of the IEEE and the Electronic Industries Association]
出版情報: Piscataway, NJ : IEEE Service Center, c1998  xxv, 1476 p. ; 28 cm
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9.

図書
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9. ITherm '98, presented at Sheraton Seattle Hotel and Towers, Seattle, Washington, USA, May 27-30, 1998 (: soft. ; : case.)
sponsored by the Components, Packaging, and Manufacturing Technology of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Sushil H. Bhavnani, Gray B. Kromann, Douglas J. Nelson
出版情報: Piscataway : IEEE Service Center, c1998  xv, 541 p. ; 28 cm
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10.

図書
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10. Electrical contacts-1998 : proceedings of the Forty-fourth IEEE Holm Conference on Electrical Contacts
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
出版情報: Piscataway, NJ : IEEE Service Center, c1998  xvii, 325 p. ; 28 cm
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11.

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11. 1997 proceedings, Second Annual IEEE International Conference on Innovative Systems in Silicon, Austin, Texas, USA (: case)
sponsored by IEEE Computer Society, IEEE Components, Packaging & Manufacturing Technology Society ; edited by Laurence LaForge...[et al.]
出版情報: Piscataway, NJ : IEEE Service Center, c1997  ix, 372 p. ; 22 cm
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12.

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12. 1st IEMT/IMC Symposium, April 16-18, 1997, Sonic City-Omiya, Tokyo, Japan (: soft. ; : case.)
sponsored by IEEE CPMT (Components, Packaging and Manufacturing Technology) Society, SHM, the Microelectronics Society-Japan
出版情報: Piscataway NJ : IEEE Service Center, c1997  xvi, 415 p. ; 28 cm
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13.

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13. Twenty first IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 13-15, 1997, Austin, TX, USA (: softbound ; : casebound)
general chair, Don Millard
出版情報: [New York] : Institute of Electrical and Electronics Engineers , Piscataway, NJ : May be purchased from IEEE Service Center, c1997  xiv, 482 p. ; 28 cm
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14.

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14. Electrical contacts-1997 : proceedings of the Forty-third IEEE Holm Conference on Electrical Contacts (: casebound)
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
出版情報: Piscataway, NJ : IEEE Service Center, c1997  xiv, 359 p. ; 28 cm
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15.

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15. 1997 Proceedings, 47th Electronic Components & Technology Conference, May 18-21, 1997, San Jose, California (: softbound ; : casebound)
sponsored jointly by the Components, Packaging, and Manufacturing Technology Society of the IEEE and the Electronic Industries Association
出版情報: Piscataway, NJ : IEEE Service Center, c1997  1294 p. ; 28 cm
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16.

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16. Electrical performance of electronic packaging, October 28-30, 1996, the Inn at Napa Valley, Napa, California
sponsored by IEEE Microwave Theory and Techniques Society and IEEE Components, Packaging and Manufacturing Technology Society
出版情報: [New York] : Institute of Electrical and Electronics Engineers, [1996]  ix, 241 p. ; 28 cm
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17.

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17. Electrical performance of electronic packaging : November 2-4, 1994, Monterey Plaza Hotel, Monterey, California
sponsored by IEEE Microwave Theory and Techniques Society and IEEE Components, Packaging and Manufacturing Technology Society
出版情報: [New York] : Institute of Electrical and Electronics Engineers, [1994]  vii, 266 p. ; 28 cm
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18.

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18. Sixteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, "Low-cost manufacturing technology for tomorrow's Economy", September 12-14, 1994, La Jolla, CA USA (v. 1 : soft. - v. 2 : case.)
sponsored by the Electronic Industries Association(EIA) and the Components, Packaging, & Manufacturing Technology(CPMT) Society
出版情報: Piscataway, NJ : IEEE Service Center, c1994  2 v. ; 28 cm
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19.

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19. 1996 proceedings : 46th Electronic Components & Technology Conference, May 28-31, 1996, Orlando, Florida (: softbound ; : casebound ; : microfiche)
sponsored jointly by the Components, Packaging, and Manufacturing Technology Society of the IEEE and the Electronic Industries Association
出版情報: Piscataway, NJ : IEEE Order Dept., c1996  1311 p. ; 28 cm
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20.

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図書
20. 1995 proceedings : 45th Electronic Components & Technology Conference, May 21-May 24, 1995, Las Vegas, Nevada (: softbound ; : casebound ; : microfiche)
sponsored jointly by the Components, Packaging and Manufacturing Technology Society of the IEEE and the Electronic Industries Association
出版情報: Piscataway, N.J. : IEEE Order Dept., c1995  1293 p. ; 28 cm
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21.

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21. Electrical contacts-1995 : proceedings of the Forty-first IEEE Holm Conference on Electrical Contacts, October 2-4, 1995, Radisson Gouverneurs, Montreal, Canada (: casebound ; : microfiche)
[sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.]
出版情報: New York : Institute of Electrical and Electronics Engineers, c1995  xiii, 407 p. ; 28 cm
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22.

図書
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22. 1995 Japan IEMT Symposium : proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium, December 4-6, 1995, Omiya, Japan (: soft. ; : case. ; : micro.)
IEEE Components, Packaging and Manufacturing Technology Society
出版情報: Piscataway : IEEE Service Center, c1996  xvi, 480 p. ; 28 cm
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23.

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23. Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, "Manufacturing technologies, present and future", October 2-4, 1995, Austin, TX USA (: soft. ; : case.)
sponsored by the Electronic Industries Association (EIA) and the Components, Packaging, & Manufacturing Technology (CPMT) Society
出版情報: Piscataway, NJ : IEEE Service Center, c1995  xiv, 516 p. ; 28 cm
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24.

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24. Electrical contacts-1996 : proceedings of the Forty-second IEEE Holm Conference on Electrical Contacts, joint with the 18th International Conference on Electrical Contacts (: casebound)
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
出版情報: Piscataway, NJ : IEEE Service Center, c1996  xvi, 518 p. ; 28 cm
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25.

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25. 1996 proceedings, Eighth Annual IEEE International Conference on Innovative Systems in Silicon, Austin, Texas, USA (: soft. ; : case.)
sponsored by IEEE Computer Society, IEEE Components, Packaging & Manufacturing Technology Society ; edited by Stuart Tewksbury and Glenn Chapman
出版情報: Piscataway, NJ : IEEE Service Center, c1996  vii, 391 p. ; 23 cm
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26.

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26. Electrical performance of electronic packaging : October 2-4, 1995, the Benson Hotel, Portland, Oregon
sponsored by the IEEE Microwave Theory and Techniques Society and the IEEE Components, Packaging, and Manufacturing Technology Society
出版情報: [New York] : Institute of Electrical and Electronics Engineers, [1995]  viii, 240 p. ; 28 cm
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27.

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27. Ninteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium, October 14-16, 1996, Austin, TX USA (: soft. ; : case.)
IEEE/CPMT International Electronics Manufacturing Technology Symposium ; Semiconductor Equipment and Materials International ; Components, Packaging & Manufacturing Technology Society
出版情報: Piscataway, NJ : IEEE Service Center, c1996  xiv, 498 p. ; 28 cm
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28.

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28. Sixth Biennial IEEE International Nonvolatile Memory Technology Conference : proceedings, 1996 conference, June 24-26, 1996, Albuquerque NM, USA
sponsors, IEEE Components, Packaging, & Manufacturing Technology Society, IEEE Computer Society
出版情報: [New York] : Institute of Electrical and Electronics Engineers, c1996  vi, 142 p. ; 28 cm
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29.

雑誌
雑誌
29. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
Institute of Electrical and Electronics Engineers ; Components, Packaging & Manufacturing Technology Society ; Lasers and Electro-optics Society (Institute of Electrical and Electronics Engineers)
出版情報: New York, N.Y. : Institute of Electrical and Electronics Engineers, c1994-c1998  v. ; 28 cm
巻次年月次: Vol. 17, no. 1 (Feb. 1994)-v. 21, no. 4 (Nov. 1998)
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30.

雑誌
雑誌
30. IEEE transactions on components, packaging, and manufacturing technology. Part A
Institute of Electrical and Electronics Engineers ; Components, Packaging & Manufacturing Technology Society
出版情報: New York, N.Y. : Institute of Electrical and Electronics Engineers, c1994-1998  v. ; 28 cm
巻次年月次: Vol. 17, no. 1 (Mar. 1994)-v. 21, no. 4 (Dec. 1998)
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31.

雑誌
雑誌
31. IEEE transactions on components, packaging and manufacturing technology. Part C, Manufacturing
Institute of Electrical and Electronics Engineers ; Components, Packaging & Manufacturing Technology Society ; IEEE Tab Steering Committee on Design and Manufacturing Engineering
出版情報: New York, N.Y. : Institute of Electrical and Electronics Engineers, c1996-1998  v. ; 28 cm
巻次年月次: Vol. 19, no. 1 (Jan. 1996)-v. 21, no. 4 (Oct. 1998)
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32.

雑誌
雑誌
32. IEEE transactions on components and packaging technologies
Institute of Electrical and Electronics Engineers ; Components, Packaging & Manufacturing Technology Society
出版情報: Piscataway, N.J. : Institute of Electrical and Electronics Engineers, 1999-  v. ; 28 cm
巻次年月次: Vol. 22, no. 1 (Mar. 1999)-
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33.

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33. Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA USA, March 12-14, 2002 : proceedings 2002 (: soft.)
[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society
出版情報: Piscataway, N.J. : IEEE Service Center, c2002  xii, 196 p. ; 28 cm
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34.

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34. 2003 proceedings, 53rd Electronic Components & Technology Conference, New Orleans, Louisiana, USA/ sponsored jointly by the Components, Packaging, and Manufacturing Technology (CPMT), Society of the IEEE and the Electronic Components, Assemblies & Materials Association (ECA), the electronic components sector of the Electronic Industries Alliance
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Components, Assemblies & Materials Association (ECA) ; Electronic components sector of the Electronic Industries Alliance
出版情報: Piscataway, N. J. : IEEE Service Center, c2003  xxiv, 1880 p. ; 28 cm
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35.

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35. Electrical contacts-2002 : proceedings of the forty-eighth IEEE Holm Conference on Electrical Contacts (:case)
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
出版情報: Piscataway, NJ : IEEE Operations Center, c2002  xviii, 283 p. ; 28 cm
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36.

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36. Proceedings, fourth International Symposium on Quality Electronic Design, 24-26 March 2003, San Jose, California
sponsored by IEEE Electron Device Society, IEEE Components, Packaging & Manufacturing Technology Society, Association for Computing Machinery, ACM Special Interest Group on Design Automation
出版情報: Los Alamitos, Calif. : IEEE Computer Society, c2003  xxi, 457 p. ; 28 cm
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37.

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37. Ninteenth annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA USA, March 11-13, 2003 : SEMI-THRM Proceedings 2003
[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society, NIST
出版情報: Piscataway, N.J. : IEEE Service Center, c2003  xiii, 404 p. ; 28 cm
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38.

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38. Electrical contacts-2003 : proceedings of the forty-ninth IEEE Holm Conference on Electrical Contacts
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
出版情報: Piscataway, N.J. : IEEE Operations Center, c2003  xvi, 242 p. ; 28 cm
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39.

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39. 2003 IEEE International Symposium on Semiconductor Manufacturing conference proceedings, September 30-October 2,2003, San Jose, California (: softbound)
[sponsored by IEEE Electron Devices Society, IEEE Components Packaging and Manufacturing Technology Society, Semiconductor Equipment & Materials International (SEMI), and Society of Applied Physics of Japan]
出版情報: Piscataway, N.J. : IEEE Service Center, c2003  x, 521 p. ; 28 cm
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40.

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40. IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, July 16-18, 2003, the Marriott Hotel, San Jose, CA USA
[co-sponsored by Semiconductor Equipment and Materials International, Components, Packaging, & Manufacturing Technology Society, IEEE Networking the World]
出版情報: Piscataway, N.J. : IEEE Service Center, c2003  iv, 449 p. ; 28 cm
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41.

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41. 2002 proceedings, 8th International Advanced Packaging Materials Symposium, March 3-6, 2002, Stone Mountain, GA, USA
sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) , Packaging Research Center at Georgia Tech(USA) ; technical sponsors, Fraunhofer IZM(Germany), Material Research Society ; general chair, Rajen Chanchan ; general chair elect, Andras Schubert ; technical chair, Jianmin Qu ; technical chair elect, Petri Savolainen
出版情報: Piscataway, N.J. : IEEE Service Center, c2002  xvi, 379 p. ; 28 cm
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42.

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42. Electrical performance of electronic packaging, October 22-31, 2001, Radisson Royal Sonesta Hotel, Cambridge, Massachusetts
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
出版情報: [New York] : Institute of Electrical and Electronics Engineers, [c2001]  xi, 344 p. ; 28 cm
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43.

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図書
43. Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA USA, March 20-22, 2001 : proceedings 2001 (: soft.)
sponsored by IEEE, Components, Packaging, and Manufacturing Technology Society
出版情報: Piscataway, N.J. : IEEE Service Center, c2001  xi, 260 p. ; 28 cm
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44.

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図書
44. 2001 proceedings : 51st Electronic Components & Technology Conference, Orlando, Florida USA/ sponsored jointly by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE and the Electronic Components, Assemblies & Materials Association (ECA) the electronic components sector of the Electronic Industries Alliance (: bound ed.)
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Components, Assemblies & Materials Association (ECA) ; Electronic components sector of the Electronic Industries Alliance
出版情報: [United States] : IEEE, c2001  xxxii, 1518 p. ; 28 cm
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45.

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45. Electrical performance of electronic packaging, October 27-29, 1997, The Wyndham Hotel, San Jose, California (:softbound)
sponsored by the IEEE Microwave Theory and Techniques Society and the IEEE Components, Packaging and Manufacturing Technology Society
出版情報: Piscataway, NJ : IEEE Service Center, [1997]  x, 264 p. ; 28 cm
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46.

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46. Electrical performance of electronic packaging, October 26-28, 1998, The Hotel Thayer, West Point, New York (:softbound)
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
出版情報: Piscataway, NJ : IEEE Service Center, [1998]  xii, 300 p. ; 28 cm
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47.

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47. Proceedings : 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 15-18, 1998 (:softbound)
co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology (CPMT) ; participating societies: American Society of Metals ...[et al.] ; general chair, C.P. Wong ; technical chairs, George White, Rao Tummala
出版情報: Reston, Virginia : IMAPS , Piscataway, New Jersey : IEEE, [1998]  300 p. ; 28 cm
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48.

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48. Eighteenth International Conference on Thermoelectrics : Proceedings, ICT '99, August 29-September 2, 1999, Baltimore, MD, USA (:softbound)
the International Thermoelectric Society ... [et al.]
出版情報: Piscataway, NJ : IEEE Service Center, c1999  xix, 736 p. ; 28 cm
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49.

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49. Electrical performance of electronic packaging, October 25-27, 1999, the Catamaran Hotel, San Diego, California (: softbound)
sponsored by IEEE Microwave Theory and Techniques Society, IEEE Components, Packaging and Manufacturing Technology Society
出版情報: [New York] : Institute of Electrical and Electronics Engineers, [c1999]  xii, 266 p. ; 28 cm
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50.

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50. 2002 proceedings, 52nd Electronic Components & Technology Conference, San Diego, California USA/ [sponsored jointly by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE and the Electronic Components, Assemblies & Materials Association (ECA) the electronic components sector of the Electronic Industries Alliance] (: bound ed.)
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Components, Assemblies & Materials Association (ECA) ; Electronic components sector of the Electronic Industries Alliance
出版情報: Piscataway, N. J. : IEEE Service Center, c2002  xxxiv, 1789 p. ; 28 cm
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51.

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51. 2001 IEEE International Symposium on Semiconductor Manufacturing : conference proceedings, October 8-10, 2001, San Jose, California (: softbound)
[sponsored by IEEE Electron Devices Society, IEEE Components Packaging and Manufacturing Technology Society, Semiconductor Equipment & Materials International (SEMI), and Society of Applied Physics of Japan]
出版情報: Piscataway, N.J. : IEEE Service Center, c2001  xi, 525 p. ; 28 cm
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52.

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52. ITherm 2002 : ITherm 2002 is Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [San Diego, California, USA, May 30-June 1, 2002] (: softbound)
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by C. H. Amon ... [et al.]
出版情報: Piscataway, N.J. : IEEE Service Center, [2002]  xxviii,1115 p. ; 28 cm
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53.

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53. ITherm 2000 : ITherm 2000 is Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, Nevada, USA, May 23-26, 2000 (: set casebound - v. 2)
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gray B. Kromann, J. Richard Culham, Koneru Ramakrishna
出版情報: Piscataway : IEEE Service Center, c2000  2v. ; 28 cm
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54.

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54. 2000 proceedings : 50th Electronic Components & Technology Conference, May 21-24, 2000, Las Vegas, Nevada, USA/ sponsored jointly by the Components, Packaging and Manufacturing Technology Society of the IEEE, the Electronic Industries Alliance (: softbound ; : casebound)
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Industries Association ; Electronic Industries Alliance
出版情報: Piscataway, N.J. : IEEE Service Center, c2000  xxxv,1756 p. ; 28 cm
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55.

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55. Electrical contacts-2000 : proceedings of the Forty-sixth IEEE Holm Conference on Electrical Contacts (:case.)
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
出版情報: Piscataway, NJ : IEEE Service Center, c2000  xvi, 279 p. ; 28 cm
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56.

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56. Electrical performance of electronic packaging, October 23-25, 2000, Radisson Resort & Spa Acottsdale, Scottsdale, Arizona
sponsored by IEEE Microwave Theory and Techniques Society, IEEE Components, Packaging and Manufacturing Technology Society
出版情報: [New York] : Institute of Electrical and Electronics Engineers, [c2000]  xiii, 339 p. ; 28 cm
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57.

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57. Electrical contacts--2005 : proceedings of the fifty-first IEEE Holm Conference on Electrical Contacts
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers, Inc.
出版情報: Piscataway, N.J. : Institute of Electrical and Electronics Engineers, c2005  xvii, 368 p. ; 28 cm
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58.

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58. Twenty first annual IEEE Semiconductor Thermal Measurement and Management Symposium, March 15-17, 2005, Fairmont Hotel, San Jose, CA USA (: softbound)
[sponsored by] IEEE Components, Packaging and Manufacturing Technology Society
出版情報: Piscataway, N.J. : IEEE Service Center, c2005  xvii, 360 p. ; 28 cm
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59.

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59. ICEPT2003 : Fifth International Conference on Electronic Packaging Technology : proceedings : Oct. 28-30, 2003, Shanghai, China
editors: Keyun Bi, Peter G. Barnwell, Jiaji Wang ; sponsored by: Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with: IEEE-CPMT (USA) ... [et al.]
出版情報: Piscataway, New ersey. : IEEE , [Shanghai, China?] : China Electronic Packaging Association, c2003  vii, 517, iv p. ; 28 cm
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60.

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60. Electrical performance of electronic packaging : October 25-27, 2004, Portland Hilton and Executive Tower, Portland, Oregon
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
出版情報: Piscataway, N.J. : IEEE, c2004  xiv, 339 p. ; 27 cm
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61.

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61. Electrical performance of electronic packaging : October 24-26, 2005, Radisson Hotel & Suites Town Lake, Austin, Texas
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
出版情報: Piscataway, N.J. : IEEE, c2004  x, 373 p. ; 28 cm
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62.

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62. 2005 proceedings, 55th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA (: set ; v. 1 ; v. 2)
sponsored jointly by the Components, Packaging, and Manufacturing Technology (CPMT) Society of the IEEE and the Electronic Components, Assemblies & Materials Association (ECA), the Electronic Components Sector of the Electronic Industries Alliance
出版情報: [Piscataway, N.J.] : Institute of Electrical and Electronics Engineers, c2005  2 v. ; 28 cm
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63.

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63. IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium : July 14-16, 2004, the Marriott Hotel, San Jose, CA, U.S.A.
[co-sponsored by IEEE, CPMT, SEMI]
出版情報: Piscataway, N.J. : IEEE, c2004  xii, 354 p. ; 28 cm
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64.

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64. Electrical performance of electronic packaging, October 27-29, 2003, the Westiren Princeton, Princeton, New Jersey
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
出版情報: Piscataway, N.J. : IEEE Service Center, [2003]  xi, 377 p. ; 28 cm
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65.

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図書
65. 2004 proceedings, 9th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, March 24-26, 2004, Atlanta, Georgia, USA
sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) Society, Packaging Research Center at Georgia Tech(GT-PRC) ; technical sponsor, Fraunhofer IZM ; general chair, Petri Savolainen ; general chair elect, Jianmin Qu ; technical chair, Petri Savolainen ; technical chair elect, Suresh Sitaraman
出版情報: Piscataway, N.J. : IEEE Service Center, c2004  vi, 281 p. ; 28 cm
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66.

図書
図書
66. Twentieth annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA USA, March 9-11, 2004 : proceedings 2004
[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society, NIST
出版情報: Piscataway, N.J. : IEEE Service Center, c2004  xiii, 313 p. ; 28 cm
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67.

図書
図書
67. ITherm 2004, the nineth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : Mirage Hotel & Casino Las Vegas, NV, June 1-June 4, 2004 (v. 1 ; v. 2)
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Koneru Ramakrishna ... [et al.]
出版情報: Piscataway, N.J. : IEEE Service Center, [2004]  2 v. (xxiv, 759 p.) ; 28 cm
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68.

図書
図書
68. Electrical contacts-2004 : proceedings of the 50th IEEE Holm Conference on Electrical Contacts, the 22nd International Conference on Electrical Contacts
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
出版情報: Piscataway, N.J. : IEEE Operations Center, c2004  xxii, 536 p. ; 28 cm
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69.

図書
図書
69. Electrical contacts-2001 : proceedings of the forty-seventh IEEE Holm Conference on Electrical Contacts (:case)
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers
出版情報: Piscataway, NJ : IEEE Service Center, c2001  xv, 310 p. ; 28 cm
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70.

図書
図書
70. Polytronic 2005 : 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics : October 23-26, 2005, Hotel Mercure Panorama, Wroclaw, Poland : proceedings (pbk.)
[sponsored by] IEEE, IEEE Components, Packaging and Manufacturing Technology Society, Wrocław Technical University
出版情報: Piscataway, NJ : IEEE, c2005  x, 235 p., xi-xiii ; 30 cm
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71.

図書
図書
71. Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001 (: soft.)
co-sponsored by : International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packing, and Manufacturing Technology (CPMT), Georgia Institute of Technology, Packaging Research Center (PRC) ; general chair, James E. Morris ; technical chairs, Andreas Schubert
出版情報: Washington, DC : IMAPS , Piscataway, N.J. : IEEE, [2001]  ix, 414 p. ; 28 cm
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