1.
図書 |
InterSociety Conference on Thermal Phenomena in Electronic Systems ; IEEE Components, Hybrids, and Manufacturing Technology Society
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2.
図書 |
sponsored by the Heat Transfer Division, ASME, the Electrical and Electronic Packaging Division, ASME ; edited by Cristina H. Amon ... [et al.]
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3.
図書 |
sponsored by the Components, Packaging, and Manufacturing Technology of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Sushil H. Bhavnani, Gray B. Kromann, Douglas J. Nelson
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4.
図書 |
co-sponsored by the following organizations: the K-16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division, American Society of Mechanical Engineers (ASME) ... [et al.]
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5.
図書 |
co-sponsored by the following organizations: the K-16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division, American Society of Mechanical Engineers (ASME)
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6.
図書 |
InterSociety Conference on Thermal Phenomena in Electronic Systems
|
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7.
図書 |
sponsored by the Heat Transfer Division, ASME ; edited by J. Bartoszek ... [et al.]
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8.
図書 |
co-sponsored by the following organizations: the K-16 Committee on Heat Transfer in Electronic Equipment, Heat Transfer Division, American Society of Mechanical Engineers (ASME)
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9.
図書 |
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by C. H. Amon ... [et al.]
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10.
図書 |
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gray B. Kromann, J. Richard Culham, Koneru Ramakrishna
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11.
図書 |
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Koneru Ramakrishna ... [et al.]
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