| Preface |
| An Overview of Microelectronic Fabrication / 1： |
| A Historical Perspective |
| An Overview of Monolithic Fabrication Processes and Structures |
| Metal-Oxide-Semiconductor (MOS) Processes |
| Basic Bipolar Processing |
| Safety |
| Lithography / 2： |
| The Photolithographic Process |
| Etching Techniques |
| Photomask Fabrication |
| Exposure Systems |
| Exposure Sources |
| Optical and Electron Microscopy |
| Further Reading |
| Thermal Oxidation of Silicon / 3： |
| The Oxidation Process |
| Modeling Oxidation |
| Factors Influencing Oxidation Rate |
| Dopant Redistribution During Oxidation |
| Masking Properties of Silicon Dioxide |
| Technology of Oxidation |
| Oxide Quality |
| Selective Oxidation and Shallow Trench Formation |
| Oxide Thickness Characterization |
| Process Simulation |
| Diffusion / 4： |
| The Diffusion Process |
| Mathematical Model for Diffusion |
| The Diffusion Coefficient |
| Successive Diffusions |
| Solid-Solubility Limits |
| Junction Formation and Characterization |
| Sheet Resistance |
| Generation-Depth and Impurity Profile Measurement |
| Diffusion Simulation |
| Diffusion Systems |
| Gettering |
| Ion Implantation / 5： |
| Implantation Technology |
| Mathematical Model for Ion Implantation |
| Selective Implantation |
| Junction Depth and Sheet Resistance |
| Channeling, Lattice Damage, and Annealing |
| Shallow Implantation |
| Source Listing |
| Film Deposition / 6： |
| Evaporation |
| Sputtering |
| Chemical Vapor Deposition |
| Epitaxy |
| Interconnections and Contacts / 7： |
| Interconnections in Integrated Circuits |
| Metal Interconnections and Contact Technology |
| Diffused Interconnections |
| Polysilicon Interconnections and Buried Contacts |
| Silicides and Multilayer-Contact Technology |
| The Liftoff Process |
| Multilevel Metallization |
| Copper Interconnects and Damascene Processes |
| Packaging and Yield / 8： |
| Testing |
| Wafer Thinning and Die Separation |
| Die Attachment |
| Wire Bonding |
| Packages |
| Flip-Chip and Tape-Automated-Bonding Processes |
| Yield |
| MOS Process Integration / 9： |
| Basic MOS Device Considerations |
| MOS Transistor Layout and Design Rules |
| Complementary MOS (CMOS) Technology |
| Silicon on Insulator |
| Bipolar Process Integration / 10： |
| The Junction-Isolated Structure |
| Current Gain |
| Transit Time |
| Basewidth |
| Breakdown Voltages |
| Other Elements in SBC Technology |
| Layout Considerations |
| Advanced Bipolar Structures |
| Other Bipolar Isolation Techniques |
| BICMOS |
| Processes for Microelectromechanical Systems--MEMS / 11： |
| Mechanical Properties of Silicon |
| Bulk Micromachining |
| Silicon Etchants |
| Surface Micromachining |
| High-Aspect-Ratio Micromachining: The LIGA Molding Process |
| Silicon Wafer Bonding |
| IC Process Compatibility |
| Answers to Selected Problems |
| Index |
| Preface |
| An Overview of Microelectronic Fabrication / 1： |
| A Historical Perspective |
図書
