1.
図書 |
edited by Mahadevan K. Iyer, Toh Kok Chuan, Mui Yew Cheong ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ; technically co-sponsored by IEEE CPMT Society, IMAPS
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2.
図書 |
hosted by China Industrial Association of Power Sources ; Sponsored by Tianjin Lantian High-Tech Power Sources, Joint-Stock Co., Ltd ; supported by the International Thermoelectric Society, Tianjin Institute of Power Sources
|
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3.
図書 |
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
|
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4.
図書 |
edited by Andrew A.O. Tay, Lim Thian Beng ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ... [et al.]
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5.
図書 |
sponsors, IEEE Components, Packaging, & Manufacturing Technology Society, IEEE Computer Society
|
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6.
図書 |
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Industries Association
|
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7.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
|
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8.
図書 |
[jointly sponsored by the Components, Packaging, and Manufacturing Technology Society of the IEEE and the Electronic Industries Association]
|
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9.
図書 |
sponsored by the Components, Packaging, and Manufacturing Technology of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Sushil H. Bhavnani, Gray B. Kromann, Douglas J. Nelson
|
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10.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
|
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11.
図書 |
sponsored by IEEE Computer Society, IEEE Components, Packaging & Manufacturing Technology Society ; edited by Laurence LaForge...[et al.]
|
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12.
図書 |
sponsored by IEEE CPMT (Components, Packaging and Manufacturing Technology) Society, SHM, the Microelectronics Society-Japan
|
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13.
図書 |
general chair, Don Millard
|
|||||
14.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
|
|||||
15.
図書 |
sponsored jointly by the Components, Packaging, and Manufacturing Technology Society of the IEEE and the Electronic Industries Association
|
|||||
16.
図書 |
sponsored by IEEE Microwave Theory and Techniques Society and IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
17.
図書 |
sponsored by IEEE Microwave Theory and Techniques Society and IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
18.
図書 |
sponsored by the Electronic Industries Association(EIA) and the Components, Packaging, & Manufacturing Technology(CPMT) Society
|
|||||
19.
図書 |
sponsored jointly by the Components, Packaging, and Manufacturing Technology Society of the IEEE and the Electronic Industries Association
|
|||||
20.
図書 |
sponsored jointly by the Components, Packaging and Manufacturing Technology Society of the IEEE and the Electronic Industries Association
|
|||||
21.
図書 |
[sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.]
|
|||||
22.
図書 |
IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
23.
図書 |
sponsored by the Electronic Industries Association (EIA) and the Components, Packaging, & Manufacturing Technology (CPMT) Society
|
|||||
24.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
|
|||||
25.
図書 |
sponsored by IEEE Computer Society, IEEE Components, Packaging & Manufacturing Technology Society ; edited by Stuart Tewksbury and Glenn Chapman
|
|||||
26.
図書 |
sponsored by the IEEE Microwave Theory and Techniques Society and the IEEE Components, Packaging, and Manufacturing Technology Society
|
|||||
27.
図書 |
IEEE/CPMT International Electronics Manufacturing Technology Symposium ; Semiconductor Equipment and Materials International ; Components, Packaging & Manufacturing Technology Society
|
|||||
28.
図書 |
sponsors, IEEE Components, Packaging, & Manufacturing Technology Society, IEEE Computer Society
|
|||||
29.
図書 |
[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society
|
|||||
30.
図書 |
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Components, Assemblies & Materials Association (ECA) ; Electronic components sector of the Electronic Industries Alliance
|
|||||
31.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
|
|||||
32.
図書 |
sponsored by IEEE Electron Device Society, IEEE Components, Packaging & Manufacturing Technology Society, Association for Computing Machinery, ACM Special Interest Group on Design Automation
|
|||||
33.
図書 |
[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society, NIST
|
|||||
34.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
|
|||||
35.
図書 |
[sponsored by IEEE Electron Devices Society, IEEE Components Packaging and Manufacturing Technology Society, Semiconductor Equipment & Materials International (SEMI), and Society of Applied Physics of Japan]
|
|||||
36.
図書 |
[co-sponsored by Semiconductor Equipment and Materials International, Components, Packaging, & Manufacturing Technology Society, IEEE Networking the World]
|
|||||
37.
図書 |
sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) , Packaging Research Center at Georgia Tech(USA) ; technical sponsors, Fraunhofer IZM(Germany), Material Research Society ; general chair, Rajen Chanchan ; general chair elect, Andras Schubert ; technical chair, Jianmin Qu ; technical chair elect, Petri Savolainen
|
|||||
38.
図書 |
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
39.
図書 |
sponsored by IEEE, Components, Packaging, and Manufacturing Technology Society
|
|||||
40.
図書 |
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Components, Assemblies & Materials Association (ECA) ; Electronic components sector of the Electronic Industries Alliance
|
|||||
41.
図書 |
sponsored by the IEEE Microwave Theory and Techniques Society and the IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
42.
図書 |
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
43.
図書 |
co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology (CPMT) ; participating societies: American Society of Metals ...[et al.] ; general chair, C.P. Wong ; technical chairs, George White, Rao Tummala
|
|||||
44.
図書 |
the International Thermoelectric Society ... [et al.]
|
|||||
45.
図書 |
sponsored by IEEE Microwave Theory and Techniques Society, IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
46.
図書 |
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Components, Assemblies & Materials Association (ECA) ; Electronic components sector of the Electronic Industries Alliance
|
|||||
47.
図書 |
[sponsored by IEEE Electron Devices Society, IEEE Components Packaging and Manufacturing Technology Society, Semiconductor Equipment & Materials International (SEMI), and Society of Applied Physics of Japan]
|
|||||
48.
図書 |
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by C. H. Amon ... [et al.]
|
|||||
49.
図書 |
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Gray B. Kromann, J. Richard Culham, Koneru Ramakrishna
|
|||||
50.
図書 |
Electronic Components & Technology Conference ; Components, Packaging & Manufacturing Technology Society ; Electronic Industries Association ; Electronic Industries Alliance
|
|||||
51.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
|
|||||
52.
図書 |
sponsored by IEEE Microwave Theory and Techniques Society, IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
53.
図書 |
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers, Inc.
|
|||||
54.
図書 |
[sponsored by] IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
55.
図書 |
editors: Keyun Bi, Peter G. Barnwell, Jiaji Wang ; sponsored by: Chinese Institute of Electronics (CIE-CEPS) ; technical co-sponsorship with: IEEE-CPMT (USA) ... [et al.]
|
|||||
56.
図書 |
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
57.
図書 |
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
58.
図書 |
sponsored jointly by the Components, Packaging, and Manufacturing Technology (CPMT) Society of the IEEE and the Electronic Components, Assemblies & Materials Association (ECA), the Electronic Components Sector of the Electronic Industries Alliance
|
|||||
59.
図書 |
[co-sponsored by IEEE, CPMT, SEMI]
|
|||||
60.
図書 |
sponsored by the IEEE Microwave Theory and Techniques Society, the IEEE Components, Packaging and Manufacturing Technology Society
|
|||||
61.
図書 |
sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) Society, Packaging Research Center at Georgia Tech(GT-PRC) ; technical sponsor, Fraunhofer IZM ; general chair, Petri Savolainen ; general chair elect, Jianmin Qu ; technical chair, Petri Savolainen ; technical chair elect, Suresh Sitaraman
|
|||||
62.
図書 |
[sponsored by] IEEE, Components, Packaging, and Manufacturing Technology Society, NIST
|
|||||
63.
図書 |
sponsored by the Components, Packaging, and Manufacturing Technology Society of the Institute of Electrical and Electronics Engineers (CPMT/IEEE) ; edited by Koneru Ramakrishna ... [et al.]
|
|||||
64.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers, Inc.
|
|||||
65.
図書 |
sponsored by the Components, Packaging and Manufacturing Technology Society of the Institute of Elctrical and Electronics Engineers
|
|||||
66.
図書 |
[sponsored by] IEEE, IEEE Components, Packaging and Manufacturing Technology Society, Wrocław Technical University
|
|||||
67.
図書 |
co-sponsored by : International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packing, and Manufacturing Technology (CPMT), Georgia Institute of Technology, Packaging Research Center (PRC) ; general chair, James E. Morris ; technical chairs, Andreas Schubert
|
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