| Keynote Papers / Volume 1： |
| Reliability of Area-Array Packages--I |
| Compact Thermal Models of Air-Cooled and Conduction-Cooled Components |
| Mems Packaging--I |
| Material Considerations in Reliability of Electronic Packages |
| Reactive Wetting in the Sn-Cu, Sn-Au and Sn-Au-Cu Systems / Stephan J. Meschter ; Timothy Singler ; Seamus Gorman ; Liang Yin |
| Thermal Model of Buried Resistors and Design Guidelines for Buried Components / Sanjeev Sathe ; Bahgat Sammakia |
| Spherical Filler-Induced Damage in IC Plastic Packages / Hideo Miura |
| Effect of Additional Element (Bi and Cu) on the Thermal Fatigue Strength of QFP/Sn-3.5Ag Solder Joint / Yoshiharu Kariya ; Yasunori Hirata ; Kenji Warashina ; Masahisa Otsuka |
| Materials Mechanics and Thermo-Mechanical Reliability of Flip Chip Area Array Packages / Andreas Schubert ; Rainer Dudek ; Bernd Michel |
| Flip-Chip on Laminate Reliability: Statistics and Failure Distributions / Rod Martens ; Michael Roesch |
| Silicon Stress Measurements and Interconnect |
| Sensitivity of Van Der Pauw Sensors to Uniaxial Stress / A. K. M. Mian ; J. C. Suhling ; R. C. Jaeger |
| Design and Experimental Evaluation of a 3rd Generation Addressable CMOS Piezoresistive Stress Sensing Test Chip / James N. Sweet ; David W. Peterson ; Alex H. Hsia |
| Measurement of the Temperature Dependency of the Piezoresistance Coefficients in P-Type Silicon / Eivind Lund ; Terje Finstad |
| Silicon Piezoresistive Stress Sensors Using MOS and Bipolar Transistors / A. T. Bradley ; J. Xu |
| Verification of a Governing Parameter for Electromigration Damage in Bamboo Lines / Kazuhiko Sasagawa ; Kazushi Naito ; Masataka Hasegawa ; Masumi Saka ; Hiroyuki Abe |
| Prediction of Electromigration Failure in Bamboo Lines |
| Reliability of Area-Array Packages--II |
| Thermal Fatigue Reliability Assessment for Solder Joints of BGA Assembly / Qiang Yu ; Masaki Shiratori |
| Parameters and Materials Properties / Kris Frutschy ; Zezhong Fu ; Deepak Goyal ; Ryan Vogt |
| Thermal Fatigue Life Evaluation for the Solder Joint Ceramic BGA / Hidehisa Sakai ; Nobutaka Ito ; Keiko Kawase ; Kazuyuki Imamura ; Masaki Onho ; Masanori Motegi |
| A Parametric Study of Flip-Chip Reliability via Computer Simulation / Hua Lu ; Christopher Bailey ; Mark Cross |
| Thermal Fatigue Assessment for Solder Joints of Underfill Assembly / Yasuhisa Kaga |
| Thermal Analysis of Components and Printed Wiring Boards (PWBs) |
| Design-Based Thermal Performance Evaluation of a GaAs MMIC Device in a Plastic Ball Grid Array Package / V. H. Adams ; K. Ramakrishna ; T.-Y. Tom Lee ; J. V. Hause ; M. Mahalingam |
| Thermal Strategy for Modeling the Wirebonded PBGA Packages / Victor A. Chiriac ; Tien-Yu Tom Lee |
| A Multi-Scale Conjugate Thermal Modeling Approach for Air Cooled Electronic Enclosures / Lan Tang ; Yogendra K. Joshi |
| Conjugate Heat Transfer From a Surface-Mounted Heat Source Through the Plate Substrate / Sang Hee Park ; Kyung Ho Kim ; Taek Hong ; Wataru Nakayama |
| Analytical and Experimental Assessment of the Thermal Performance of Surface Mount Packages / Atris A. Ray III ; W. Z. Black ; J. G. Hartley ; Ari Glezer |
| Pentium II Processor Cartridge Design for Desktop / Chia-Pin Chiu ; Ram Viswanath ; Gary L. Solbrekken |
| Mems Packaging--II |
| Stress Characterization of Bonds Created by an Adhesive Layer Between Miniaturized Optical Components and a Micromachined Substrate / Donald E. Jones ; David L. Naylor |
| Flip-Chip Assembly for RF and Optical MEMS / Wenge Zhang ; Kevin F. Harsh ; M. Adrian Michalicek ; Victor M. Bright ; Y. C. Lee |
| Fast 3D Inductance Computation for RF/MEMS Packages / Mattan Kamon ; Mark G. da Silva ; Stephen F. Bart |
| Enabling MEMS Package-Device Co-Design Through Extraction of Compact Models / Susan Zhang ; Vladimir Rabinovich ; Joost van Kuijk ; Mark da Silva |
| Flip-Chip Assembly |
| Flip Chip Assembly on Organic Boards Using Anisotropic Conductive Adhesives/Films and Nickel/Gold Bump / Myung-Jin Yim ; Young-Doo Jeon ; Kyung Wook Paik |
| Study of Epoxy Material Properties for Solving Thermal Mismatch Problem on Electronic Packaging / Shyh-Rong Tzan ; Li-Sen Chen |
| Optimized Structure for Organic Flip Chip Package / Yoshiaki Sugizaki ; Eiichi Hosomi ; Eiji Takano ; Daijo Chida ; Yumiko Ohshima ; Chiaki Takubo ; Takahito Nakazawa |
| Development of Interposer Material (TFI) for Face Down Type CSP / Toyosei Takahashi |
| Development of Underfill Material With High Valued Performance / Satoru Katsurayama ; Masahiro Wada |
| Modeling of Solder Solidification and Fatigue |
| Modelling the Melting and Solidification of Solder Material / Daniel Wheeler |
| Modelling the Fillet Lifting Defect / C. Bailey ; W. J. Boettinger |
| A Comparison of Thermal Stress/Strain Behavior of Ellipse/Round Solder Pads / Kuo-Ning Chiang ; Hsien-Chie Cheng ; Chang-Ming Liu |
| Thermomechanical Analysis of Solder Joints Under Thermal and Vibration Loading / Cemal Basaran ; Rumpa Chandaroy |
| Ceramic Ball Grid Array Solder Joint Thermal Fatigue Life Prediction Model / T. E. Wong ; H. M. Cohen ; T. Y. Jue ; K. T. Teshiba |
| Calibration of the Disturbed State Model for Thermo-Mechanical Behavior of Various Solders / Terrance J. Dishongh ; Chandra S. Desai |
| Reliability of Area-Array Packages--III |
| Analyses of Fatigue Crack Extension in Electronic Solder Joints / Makio lino ; Ken Kaminishi ; Hiroki Bessho ; Motoharu Taneda |
| Mechanical Fatigue Tests of Solder Bumps / Minoru Mukai ; Hiroyuki Takahashi ; Takashi Kawakami ; Kuniaki Takahashi ; Ken Iwasaki ; Kikuo Kishimoto |
| Development of Fine Pitch Ball Grid Array With Reliability Enhancement / Takashi Aihara ; Shingo Ito ; Hideaki Sasajima ; Ken Oota |
| Evaluation for Fatigue Life of CSP Solder Joints Using Piezoelectric Translator for the Actuator and the Measurement Without Dislocation / Yutaka Okumoto ; Hayato Kobayashi |
| Failure Prediction in Plastic Ball Grid Array Electonic Packaging / Meng-Kao Yeh ; Kuo-Chin Chang |
| Characterization and Optimization / Heat Sink I： |
| Design of Heat Sinks and Planer Spreaders With Airflow Bypass / Emerson dos Reis ; Carlos A. Altemani |
| Compressible Gas-Cooled Micro-Channel Heat Sink Board / Maurice J. Marongiu ; B. Kusha ; G. S. Fallon |
| Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks / Keiji Sasao ; Mitsuru Honma ; Atsuo Nishihara ; Takayuki Atarashi |
| Natural Convection Air Cooling Between Vertical Parallel Plates With Heated Protrusions Simulating Plate-Mounted Electronic Components Within an Enclosure / Sung K. Park |
| Conjugate Heat Transfer From Small Heat Sources Mounted on a Conductive Wall / Xing Zhang ; Tomohisa Imamura ; Motoo Fujii |
| Flat Plate Fin Heat Sinks in Natural Convection Telecommunication Modules / Melik Sahraoui ; Gamal Refai-Ahmed |
| Optoelectronics and Photonics Packaging |
| Introduction / Ephraim Suhir ; Fouad Kiamilev |
| Optical and Mechanical Behavior of Optoelectronics Materials and Packages--I |
| Integrated Micro-Optical Systems / M. Feldman ; H. Han ; A. Kathman ; E. Johnson ; Jared Stack |
| New Technological Approach for Submicronic Optoelectronic Chip Assemblies / Claude Massit ; Gerard Nicolas ; Guy Parat ; Patrick Mottier ; Gilles Grand ; Laurence Pujol |
| Analysis on Acoustic Emission of Optical Glass Fiber Produced by a Breaking Test: A Dependency of AE Energy on Constitution of Fiber / Mitsuyuki Nakayama ; Keisuke Matsuda ; Hideto Suzuki |
| A Thermo-Electro-Mechanical Study of a VCSEL Array Package / E. Yu ; A. Przekwas |
| Solders |
| Temperature and Strain Rate Effect on Mechanical Properties of 63Sn/37Pb Solder Alloy / X. Q. Shi ; H. L. J. Pang ; W. Zhou ; Z. P. Wang |
| Soldering of Thin Film-Metallized, Soda-Lime Glass Substrates / F. Michael Hosking ; Cynthia L. Hernandez ; S. Jill Glass |
| Pb-Free Solder Alloy of Sn-Ag-Bi System With a Small Amount of Ge / Kazutaka Habu ; Naoko Takeda ; Haruo Watanabe ; Hiroshi Ooki ; Jiro Abe ; Takashi Saito ; Yoshikuni Taniguchi ; Kinjiro Takayama |
| Laser Microsoldering Characteristics of Lead-Free Solders / Tadashi Takemoto ; Atsushi Nakamae ; Akira Matsunawa |
| Tensile Deformation Properties and Microstructure of Sn-Zn System Lead-Free Solders / Masahiro Takahashi |
| Analysis of Phase Growth Process in Sn/Pb Eutectic Solder Joint / Toshihiko Sayama ; Takeshi Takayanagi ; Takao Mori |
| Modeling and Characterization of Packaging Material |
| An Analytical Cure Model for Underfill Epoxies / Chetan P. Malhotra ; Roop L. Mahajan |
| Particle Size Distribution of Nanoparticulate Materials Using SAXS / Kal R. Sharma |
| Calculating Stresses During Thermoset Cure: Nonlinear Viscoelasticity and Evolving Material Properties / Douglas B. Adolf ; Robert S. Chambers ; James M. Caruthers |
| Nonlinear Viscoelastic Analysis of Engineering Polymers |
| Sensor for the Measurement of Liquid Permittivity Using Quartz Crystals / V. Matko ; J. Koprivnikar |
| Permitivity of Thin Molecular Films / J. P. Setrajcic ; I. D. Vragovic ; S. Vucenovic |
| Manufacturing-Process Monitoring and Control |
| Neural Network Based Diagnosis of CVD Barrel Reactor / Sanjay R. Bhatikar |
| Supervisory Control of the Via Formation Process in HDI Layers for MCM-D Applications Using Neural Networks / Tae Seon Kim ; Gary S. May |
| Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes / German Rodriguez ; Daniel F. Baldwin |
| Application of the Taguchi Method to Chip Scale Package (CSP) / Atila Mertol |
| Optimisation of the Chip on Glass (COG) Bonding Parameters for Mass Production With Taguchi Method / Petteri Palm ; Jarmo Maattanen ; Pekka Ahokas |
| Reliability of Area-Array Packages--IV |
| A Study of Fatigue Life Predictions for PBGA Joints and Comparisons With Test Data / Hasan U. Akay ; Gunasekaran Kaliappan ; Nasser H. Paydar ; Mostafa Rassaian |
| Creep Behavior of BGA Solder Joints During Thermal Cycling by Moire Interferometry / Y. Zhao ; T. Dishongh ; A. Cartwright ; C. Basaran |
| Peel Strength Evaluation of CSP Joints Mounted on a Buildup PWB / Osamu Ido ; Nobutaka Itoh ; Mami Nagatake ; Kinuko Mishiro ; Yutaka Higashiguchi ; Ken-ichiro Tsubone |
| Fatigue Life Assessment of Bump Type Solder Joint Under Vibration Environment / S. B. Lee ; S. J. Ham |
| Vibration Reliability Analysis of a PBGA Assembly Under Foundation Excitations / Q. J. Yang ; G. H. Lim ; F. F. Yap ; R. M. Lin |
| Experimental Study on the Performance of Compact Heat Sink for LSI Packages / Masaru Ishizuka ; Yasuyuki Yokono ; Katsumi Hisano ; Debasish Biswas ; Hideo IwasakiHeat Sink II： |
| Compact Modeling of Fluid Flow and Heat Transfer in Heat Sinks / Sung Jin Kim ; Duckjong Kim |
| Performance of a Thermosyphon Pin Fin Heat Sink / Jianchun Sun ; Kok-Chuan Toh ; Chang-Yu Liu |
| Optimum Performance of Cellular Metal Heat Sinks for Thermal Management of High Power Electronics / Ashraf F. Bastawros ; Anthony G. Evans |
| Heat Sink Optimization for Maximum Performance and Minimum Mass / Mohamed Fadi Ben Achour ; Avram Bar-Cohen |
| Optical and Mechanical Behavior of Optoelectronics Materials and Packages--II |
| Single-Mode Bi-Directional Links for FITL and Optical Networks / Robert A. Boudreau ; Terry P. Bowen ; Jeffrey S. Schramm ; Richard H. Sargent ; Michael Feldman ; R. Brian Hooker ; Craig A. Armiento ; Arvind Baliga ; Jerry Radcliffe |
| Guided-Wave Si CMOS Process-Compatible Optical Interconnects / R. T. Chen ; L. Wu ; L. Lin ; C. Choi ; Y. Liu ; B. Bihari ; S. Tang ; R. Wickman ; B. Picor ; Y. S. Liu |
| Polymers for Optoelectronic Devices / J. D. Swalen |
| Dielectrics |
| Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate / Shoji Kamiya ; Hironori Takahashi |
| Evaluation of Ternary Polymer Blend as Semi-Permeable Membrane in the Production of Hydrogen Compared With the Inorganic High Surface Area Materials |
| Plasma Nitridation on Commercial Copper Leadframe for Cu/EMC Adhesion Enhancement / R. Gopal Krishnan ; Khine Nyunt ; T. C. Chai ; Andrew Wong ; G. Sarkar |
| New Small CTE Materials for Packages Using COPNA Resin / Kazunari Nawa ; Yoshihisa Kishimoto ; Masakazu Ohkita |
| Manufacturing-Process Modeling and Simulation |
| Study of Thermal Deformation in Underfilled Flip-Chip Packages Using High-Resolution Moire Interferometry / Mikel R. Miller ; Ilyas Mohammed ; Paul S. Ho ; Xiang Dai |
| Role of Underfill Materials and Thermal Cycling on Die Stresses / Carlton E. Hanna ; Suresh K. Sitaraman |
| FEA Modeling of FCOB Assembly Warpage and Stresses Due to Underfill Encapsulation and Thermal Cycling Loading / John H. L. Pang ; Y. R. Chong |
| Optimising Matrix Molds and Wiresweep for Transfer Molding of IC Plastic Packages / K. Sivakumar ; Silvia Radente ; Christophe Prior |
| Finite Element Analysis of the Degating Process in IC Packaging / Srikanth Narasimalu ; Kuah Teng Hock ; Ho Shu Chuen |
| Wafer Scale Packaging Based on Underfill Applied at the Wafer Level for Low-Cost Flip Chip Processing / C. Dustin Johnson ; Stephen C. Busch |
| Instrumentation and Measurement Techniques |
| Development of Scanning Type Infrared Laser Photoelasticity and Evaluation of Residual Stress in {100} GaAs Wafers / Yasushi Niitsu ; Kenji Gomi |
| Application of Highly Focused, High Frequency Transducers for Evaluation of Near-Surface Flaws and Thin Packages: Smart Cards, Flip Chip, Flex Circuits and Thick Films / Janet E. Semmens ; Sridhar Canumalla |
| Microwave Imaging for the Integrity Assessment of IC Package / Yang Ju |
| Tomographic Acoustic Micro-Imaging (TAMI) Improves Acoustical Analysis of Flip Chip Packages / Joel Sigmund ; John Goings ; Michael A. Kearney |
| Stress Evaluation of {100} Si Wafer by Raman Spectroscopy / Tomo Ikebe ; Yusei Okubo ; Teruki Ikeda |
| A Method of Film Fatigue Testing and the Effects of Rolling Direction on Fatigue Properties in Copper Film / Tashiyuki Torii ; Kenichi Shimizu |
| Characterization of PCB Expansion Using Moire Interferometry and the Impact of Expansion Variability on the Life of Solder Joints / B. Hunter ; G. Subbarayan ; D. Rose |
| Characterization of Thermal Heat Spreaders |
| Optimal Sizing of Rectangular Isotropic Thermal Spreaders / John W. Welch ; Tung T. Lam ; Wing K. Yeung |
| Thermal Resistance in Rectangular Orthotropic Heat Spreaders / William D. Fischer |
| Thermal Management Enhancement Using CVD Diamond Heat Spreaders in a Plastic Package Environment / Philip M. Fabis ; Henry Windischmann |
| Analysis of Heat Conduction Properties of Packaged Laser Diodes From Highly Resolved Temperature Transient Measurments / Paolo Emilio Bagnoli ; Claudio Casarosa ; Mario Madella ; Agnese Piccirillo |
| Modeling Electro-Thermal Behavior of Integrated Circuit Devices / Massimo (Max) Capobianchi ; John Voight ; Satish Surapaneni |
| Optical Interconnections |
| Optoelectronic-VLSI Technologies Based on Direct Attachment of Photonic Devices to Silicon CMOS Circuits / Ashok V. Krishnamoorthy |
| Optical Interconnects for Silicon Chip Stacks / S. Esener ; P. Marchand ; F. Kiamilev ; V. Ozguz |
| Mode-Transforming Waveguides for Optical Interconnections / Regis S. Fan |
| Parallel 10-Channel Optical Interconnect Receiver Module Operating Over 4 gbit/sec Based on Silicon Optical Bench Technology / Franco Delpiano ; Bruno Bostica ; Marco Burzio ; Paolo Pellegrino ; Luca Pesando ; Saverio Ricchiuto |
| Materials and Processes |
| Effect of Processing on the Molecular Orientation of Very Different Polymers / Robert J. Samuels |
| Thermodynamic Stability of Nanocomposites |
| Thermoplastic Nanocomposite With High Thermal Conductivity |
| Alternative Materials and Processes for HF-Modules / Tarja Juhola ; Boris Kerzar ; Mehran Mokhtari ; Lester Eastman |
| High Reliability Desiccant Package Designs With Controlled Moisture Ingress Rates for Use in Low Particulate Environments / Henry H. Law |
| In-Situ Ultrasonic Stress Measurements During Ball Bonding Using Integrated Piezoresistive Microsensors / Michael Mayer ; Jurg Schwizer ; Oliver Paul ; Daniel Bolliger ; Henry Baltes |
| Thermal Modeling and Characterization--II |
| Integrated Thermal Analysis of an Automotive Electronic System / S. S. Murthy ; Y. K. Joshi |
| Orientation Specific Thermal Properties of Polyimide Film / Nancy E. Mathis |
| Advanced Thermal Resistance Characterization Technique for IC Packages / Hendrik Decruyenaere ; Daniel Vanderstraeten ; Anelia Pergoot |
| Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Airflows by Experimental Analysis / Peter Rodgers ; John Lohan ; Valerie Eveloy ; Carl-Magnus Fager ; Jukka Rantala |
| Moody's Diagram Heat Transfer Friction Flow Losses in Porous Materials / James T. Dickey ; George P. Peterson |
| Study of Liquid Cooled Power Cells / Randall Mathieu ; Mulugeta Berhe ; Rajesh Nair |
| Mechanical Modeling and Analysis |
| Object-Oriented CAE System for Structural Design of LSI Packages / Kiyomi Kojima ; Takeshi Terasaki ; Asao Nishimura |
| Analysis and Reduction of Structures in Reliability / Miguel A. R. Mojena ; Katia L. Cavalca |
| Viscoelastic Warpage Analysis of Surface Mount Package / Kiyoshi Miyake ; Tsukasa Yoshida ; Hyung Gil Baik ; Sang Wook Park |
| The Effect of Residual Stress on the Stress Distribution of an IC Solder Joint / J. H. Kuang ; M. T. Sheen ; Y. C. Hsu |
| Effect of Solder Reflow Temperature Profile on Popcorning / Iok-Tong Chong ; David C. C. Lam ; Pin Tong |
| Free Space Optical Communication |
| Free-Space Optically Connected Crossbar Assembly / John A. Neff |
| Smart Pixel Array Module for Free Space Optical Interconnects / Yue Liu ; E. M. Strzelecka ; R. A. Skogman ; R. A. Morgan ; R. Walterson ; K. Johnson ; J. Nohava ; E. Kalwit ; J. Gieske ; T. Marta ; Mary Hibbs-Brenner |
| CMOS IC Design for Free-Space Optical-Interconnect Packaging / Jeremy T. Ekman ; Fouad E. Kiamilev ; Premanand V. Chandramani ; James L. Rieve ; Richard G. Rozier ; Ray Farbarik |
| FAST-Net Optical Interconnection Prototype Characterization / M. W. Haney ; M. P. Christensen ; P. Milojkovic ; J. Rieve ; J. Ekman ; P. Chandramani ; M. Hibbs-Brenner ; E. Strzelecka ; G. Fokken ; M. Vickberg ; B. Gilbert |
| Chip Scale Package: Design Materials, Process and Performance / Volume 2： |
| Strategies for Creating Compliant IC Packages at Near Chip Size / Joseph Fjelstad |
| Three Dimensional Elastoplastic and Creep Analyses of a Low Cost Solder-Bumped Flip-Chip Chip Scale Package (CSP) Assembly / John H. Lau |
| The SuperCSP Package Solution: A Wafer Level Package / Michelle M. Hou |
| Characterization of Molding Compounds and Die Attach Materials for Package Warpage and Solder Joint Reliability in Chip Scale Packages (CSP) / Masazumi Amagai |
| D2CSP (Double Density CSP): An Innovation of BLP Technology / Kwang-Seong Choi ; Byong-Su Seol ; Jong-Hyun Lee ; Chang-Kook Choi ; Ki-Bon Cha |
| The Effect of Underfill on the Pressure Cooker Test Peformance of Flip Chip on Board Assembly / Yu-Wen Huang ; Keng Hwa Teo ; Khoon Lam Chua ; Michael W. R. Yang ; William Ferng |
| Mechanics of Interfaces and Multilayer Materials |
| Measurement of Interface Toughness as a Function of Temperature, Moisture Concentration and Mode Mixity / Andrew A. O. Tay ; Yi Yi Ma ; Soon Huat Ong ; Toshio Nakamura |
| Some Effects of Specimen and Loading Variables on the Fracture Toughness of Epoxy-to-Substrate Interfaces / Tommy R. Guess ; E. David Reedy ; Mark E. Stavig |
| Propagation of Interface Edge Cracks by Mechanical and Thermal Strains / Wei Hin Wong ; Li Cheng ; Yong-Wei Zhang |
| Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging / Ying Zhao |
| Analysis of Interlaminar Thermal Stresses in Unsymmetric Multi-Layered Electronic Assemblies and Packages / Weidong Xie |
| The Shear Strength of the Solder Bumps Formed by Stencil Printing and Reflow: Effects of Underlayer Adhesion / S. J. Heo ; S. H. Yoo ; Y.-H. Kim ; I. B. Park ; J. H. Yoon ; B. J. Han |
| Accelerated Product Qualification: State of the Art |
| Practical Lessons Learned From Overstress Testing: A Historical Perspective / Eugene R. Hnatek ; Edmond L. Kyser |
| A 12-Step Continuous Supplier Involvement Checklist to Accelerate Component, Sub-Assembly and Full System Qualification / Thimmiah Gurunatha |
| Efficient Validation Testing of Pressure Sensors Using DOE for Production Line Validation Tests / Dale R. Sogge |
| Monte Carlo Simulation of BGA Failure Distributions for Virtual Qualification / John W. Evans ; Jillian Y. Evans ; Reza Ghaffarian ; Andrew Mawer ; Kyoung-taeg Lee ; Chang-ho Shin |
| Application of the Accelerated Degradation Principles and Monte Carlo Simulation to Product Performance Evaluation: A Case Study / Vladimir Crk |
| A Decision Process for Accelerated Stress Tests / Mark Roettgering |
| Microscale Heat Transfer |
| Microscale Thermal Engineering of Integrated Circuits / Kenneth E. Goodson |
| Multimode Heat Transfer in Two-Dimensional Microchannel / Chih Ping Tso ; Shripad Prabhakar Mahulikar |
| An Experimental Study on an Enhanced Microchannel Heat Sink for Microelectronics Applications / Jerry K. Keska ; A. Chuck Miller |
| Thermal Analysis of Anisotropic Thin-Film Superconductors |
| Effect of Surface Waviness on Measurement of Thermal Contact Conductance / Toshio Tomimura |
| Optical and Mechanical Reliability of Optoelectronic Materials and Packages |
| Fiber Optics Structural Mechanics: Structural Analysis and Design for Reliability |
| Optical Coupling Efficiency of Bidirectional Transceiver Chip and Fiber by Using Refractive Index Controlling Medium / Jae-Shik Choi ; Gwan-Chong Joo ; Sang-Hwan Lee ; Nam Hwang ; Seung-Goo Kang ; Hee-Tae Lee ; Min-Kyu Song |
| Strain Characterization of Fiber Optic Connector Assemblies During Epoxy Cure / Keita Broadwater ; Patricia F. Mead |
| Reliability Distribution Function for Optical Fibers Strength Prediction / Dov Ingman ; Michael I. Zeifman |
| Low-Cost Flip-Chip Technology |
| Alternate Alloy Bump Interconnect Technologies and Flip Chip Applications / Melissa E. Grupen-Shemansky ; Patrick Thompson ; Jong-Kai Lin |
| microDAC Deformation Analysis on Solder Interconnects for Flip Chip / Dietmar Vogel ; Falk Luczak |
| Reliability of Low Cost Bumped Flip Chip Assemblies / E. Jung ; J. Kloeser ; K. F. Becker ; R. Aschenbrenner ; H. Reichl |
| High Throughput Flip Chip Processing and Reliability Analysis Using No-Flow Underfills / Ryan Thorpe |
| Low Cost Flip Chip Processing and Reliability of Fast-Flow, Snap-Cure Underfills / Paul N. Houston ; Marnico Deladisma ; Lawrence N. Crane ; Mark Konarski |
| Packaging Assembly and Manufacturing Issues--I |
| Characterization of Component Failure Modes and Associated Causes / Virginia M. Miller |
| Large Scale Parallel Simulations for the Assembly of a Flip-Chip Component to a Printed Circuit Board / K. McManus ; D. Wheeler ; H. Lu ; M. Cross ; P. Chow ; C. Addison |
| Selection of a No-Clean Flux for Flip Chip Applications / Joseph D. Poole ; Kris A. Slesinger ; Mark A. Elkins ; Charles J. Merz Ill |
| Dynamic Assessment of a Miniaturized Spaceborne Command and Data Handling in Your Palm (CandDHIYP) / Sharon X. Ling ; Binh Q. Le ; Richard F. Conde |
| Realization of Buried Passive Components in Low-Temperature Co-Fired Ceramic Materials by Thick-Film Techniques / Markku S. Lahti ; Vilho E. Lantto ; Seppo I. Leppavuori |
| The Application of Massively Parallel Computing to Characterize Furnace Brazing Processes / Steven E. Gianoulakis ; Louis A. Malizia |
| Metrics for the Underfill Flow Process / P. Li ; T. Driscoll ; N. Guydosh ; J. Cascio ; Y. Huang ; E. J. Cotts ; Y. Gao ; G. Lehmann |
| Extreme Temperature Electronics |
| Electronics Packaging for the Temperature Extremes of Mars: The New Millennium Program DS2 Penetrator Mission / Saverio A. D'Agostino ; Genji Arakaki |
| Failure Engineering Study and Accelerated Stress Test Results for the Mars Global Surveyor Spacecraft's Power Shunt Assemblies / Mark Gibbel ; Timothy Larson |
| Die Attachment for -120[degree]C to +20[degree]C Thermal Cycling of Microelectronics for Future Mars Rovers: An Overview / Randall K. Kirschman ; Witold M. Sokolowski ; Elizabeth A. Kolawa |
| Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies |
| Thermal Design of Portable Computers |
| Transient Thermal Management of Portable Electronics Using Phase Change Materials and Time Varying Power Dissipation / Mark J. Vesligaj ; Cristina H. Amon |
| Thermal Behavior of 133MHz Notebook Computers / Y. H. Hung ; K. F. Chiang |
| A Global Assessment of Coolability for Electronics Thermal Design Based on Thermodynamic Aspects / Ken Ogiso |
| Temperature Responses of Human Skin at the Contact of Hot Surfaces / Lawrence S. Mok ; Paul F. Greier |
| Thermal Design Method for a Hyper Heat Dense Notebook PC / Kazuaki Yazawa ; Bunsho Lin ; Minoru Okuda |
| Thermal Management of High End Electronics |
| Thermal Management of Multichip Modules With Evaporative Spray Cooling / Greg Pautsch |
| Optical Study of Enhanced Heat Transfer From a Heat Sink for Microelectronics Applications / Gilbert Fournelle ; Sushi H. Bhavnani ; Richard C. Jaeger |
| Transient Heat Transfer on a Horizontal Cylinder in FC-72 / Takashi Kasakawa ; Koichi Hata ; Masahiro Shiotsu |
| An Experimental Study on Liquid Cooling of High-Power IC Chips / Satoru Gima |
| Thermal Management of Computer Systems Using Active Cooling of Pulse Tube Refrigerators / S. W. K. Yuan ; H. H. Jung |
| Choosing Working Fluid for Two Phase Thermosyphon Systems for Cooling of Electronics / Bjorn Palm ; Rahmatollah Khodabandeh |
| Comparison of Thermal Characteristics of a Test MCM Using Water, PF-5060 and Paraffin Slurry / Keumnam Cho ; M. G. Choi |
| Flip-Chip and Area Packaging |
| Area Array Packages: Materials Requirements for Diminishing Devices / Petri J. Savolainen ; Jorma K. Kivilahti |
| Development of Reworkable Underfills, Materials, Reliability and Processing / Lawrence Crane ; Afranio Torres-Filho ; Erin Yaeger ; Christopher K. Ober ; Shu Yang ; Jir-shyr Chen ; R. Wayne Johnson |
| What is Needed to Establish Flip Chip as a Standard SMT Process / Ronald C. Lasky ; Yann Y. Morvan |
| Advances in Materials and Processes for Flip Chip Packaging / Raj N. Master ; Mohammed Khan ; Maria Guardado ; Orion Starr |
| Thermomechanical Fatigue Life of Chip Scale Packages / Qizhou Yao ; Jianmin Qu ; Sean X. Wu |
| Process Characterization and the Effect of Process Defects on Flip Chip Reliability / Brian J. Lewis ; Patrick Trippel ; Jeffery L. Timms ; Leo M. Higgins |
| An Optimisation Study of Underfill Dispensing Process / Y. C. Chia ; S. H. Lim ; K. S. Chian ; S. Yi ; W. T. Chen |
| Packaging Assembly and Manufacturing Issues--II |
| Development of High-Productivity Underfill Process and Equipment / Teikou Odashima ; Mikio Matsui ; Shoji Yamamoto ; Takaki Kuno ; Hirotaka Okamoto |
| A Revision About Accelerated Testing and Application in a Software for the Data Graphics Analysis / Alberto N. Colmenero ; Franco G. Dedini |
| Some Challenges for Molecular Dynamics Technique With Consideration of the Movement of Free Electrons in Order to Simulate Thermodynamics by Electronic Current / Tomoaki Tsuji ; Naoyuki Yanagi ; Masaki Makino ; Naotake Noda |
| Investigation of Variable Frequency Microwaves for Cure of Flip Chip Underfills / Aravind Ramamoorthy |
| Effect of Au-Intermetallic Compounds on Mechanical Reliability oF Sn-Pb/Au-Ni-Cu Joints / A. Zribi ; R. R. Chromik ; R. Presthus ; J. Clum ; L. Zavalij |
| Accelerated Qualification of Plastic Encapsulated Microcircuits |
| An Application Specific Qualification Method for Semiconductor Devices / Donald C. Foster ; Mathew E. Doty |
| Do We Need a PEM Reliability Model? / Edward B. Hakim |
| Alternative Accelerated Testing Method for Localization of Solder Fatigue Failures on Electronic Circuit Cards / Scott Sealing ; Abhijit Dasgupta |
| Localized Thermal Cycling: A Faster and Controlled Accelerated Testing Approach for Surface Mount Electronics / Rajashekar S. Pappu |
| Rapid Qualification of Foundries or Semiconductor Process Changes Using Rapid Reliability Process Control Tests / Timothy E. Turner |
| Heat Sinks Enhanced With Phase-Change Materials |
| An Analysis of Heat Flux Limits for Electronic Components on a Finned Substrate Containing a PCM / Randy Clarksean ; Yitung Chen ; M. Marongiu |
| Transient Numerical Model for Phase Change Thermal Storage System Analysis and Design / Kamal A. R. Ismail ; Mabruk M. Abugderah |
| Thermal Control of Horizontally Mounted Heat Sources Using Phase Change Materials / Debabrata Pal |
| The Use of Phase Change Materials for Electronic Cooling Applications: Thermal Design Issues and Example |
| Development and Testing of an Ambient Thermal Storage Unit for Pulsed Load Applications / David C. Bugby ; Stephen J. Krein ; Jeong H. Kim |
| Multichip Modules: Packaging Developments |
| Multichip Packages: New Developments and Applications / E. Jan Vardaman |
| Removable Chip Module (RCM): A System in a Module Approach / James Rathburn |
| Effect of Thick Film Firing Conditions on the Solderability and Structure of Au-Pt-Pd Conductor for Low-Temperature, Co-Fired Ceramic Substrates / Paul T. Vianco |
| Design of Simulations Study of Multi-Layered Structures in Electronic Packaging / Manjula N. Variyam |
| Experimental Assessment of an Air Cooling Scheme for the Multichip Modules of a Physics Particle Detector / John D. Bernardin ; Richard A. Martin |
| Flip-Chip Technology Using Conductive Adhesives |
| Overview of Bumping Technology for Adhesive Flip-Chip Interconnect / Helge Kristiansen ; Johan Liu |
| Reliability of Flip-Chip Anisotropically Conductive Adhesive Joints on an FR-4 Substrate / Zonghe Lai |
| Novel Anisotropically Conductive Film for Area Array Packaging / Matthew J. Holloway ; Mary B. Ward ; Luana V. Scully |
| A Maskless Low-Cost, Multi-Chip-Module Assembly Process / David A. Hutt ; Samjid H. Mannan ; David C. Whalley ; Paul P. Conway |
| Application of Fracture, Damage and Disturbance Models--I |
| Review and Evaluation of Approaches for Thermomechanical Analysis for Stress, Failure and Reliability |
| Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch / Toru Ikeda ; Isao Arase ; Yuya Ueno ; Noriyuki Miyazaki ; Mitsuru Sato |
| Fracture Behavior of Underfill Resins and Their Application to Flip-Chip on Organic Substrate Assemblies / Raymond A. Pearson ; Thomas B. Lloyd ; Herman F. Nied |
| Numerical Study of Copper-Encapsulant Interfacial Delamination Propagation in a Peripheral Array Package / Richard J. Harries |
| Reliability Analysis of BGA Packages: A Tool for Design Engineers / James W. Jones ; Jason Li ; Yuichi Yamazaki ; Jidong Yang |
| Accelerated Qualification at the System Level |
| A Time Dependent Field Return Model for Telecommunication Hardware / Orjan Hallberg ; Joakim Lofberg |
| Accelerated Product Testing of Generation II Photonics Hardware With Standardized Packaging and Interfaces / Andrew S. Glista, Jr. ; Gerard Walles ; Charles D. Caposell |
| The Use and Abuse of HAST / Nihal Sinnadurai |
| Different Approaches for Ensuring Performance/Reliability of Plastic Encapsulated Microcircuits (PEMs) in Space Applications / R. David Gerke ; Mike Sandor ; Shri Agarwal ; Andrew F. Moor ; Kim A. Cooper |
| Complex Temperature-Vibration Interactions on Solder Durability / James Cho ; Kumar Upadhyayula |
| Reducing Accelerated Test Time: Use of Vibration Loading to Accelerate Aging Damage / Pradeep Sharma ; Rajesh Natarajan |
| Multichip Modules: Substrate Developments |
| Z-MAJIC: A Novel Z-Interconnect Approach for Multi-Chip Modules / Mark T. McCormack ; Hunt Jiang ; Solomon I. Beilin ; Bill Chou ; Mike Peters |
| Multilayer High Density Flex Technology / Solomon Beilin ; David Kudzuma ; Mike Lee ; Mark McCormack ; Tom Massingill ; Jim Roman ; Yasuhito Takahashi ; Vincent Wang |
| Design for Manufacturing of RF MCM-L / Hassan Hashemi ; Craig Davidson |
| Manufacturing of RF MCM-L |
| Design and Integration Considerations for 3D Flex Based Electronic Packaging / W. B. Morrison ; T. A. Railkar ; A. P. Malshe ; T. G. Lenihan ; W. D. Brown |
| A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging / Anh X. H. Dang ; I. Charles Ume ; Swapan K. Bhattacharya |
| Application of Fracture, Damage and Disturbance Models--II |
| A Pit-Flaw Model for Static Fatigue of Pristine Silica Optical Fibers / Mikio Muraoka |
| Defects by Manufacture, Installation, Contacting, Hermetization and Operation of Powerful Integrated Circuits / Anatoli S. Yastrebov ; Mikhail Y. Volokobinski |
| Structural Reliability of PBGA Solder Joints With the Disturbed State Concept / Jacob W. Zwick |
| Thermomechanical Diagnostics of Flip-Chip/BGA Structures Using Phase-Shifting Electronic Speckle Pattern Interferometry / P. Zhou ; K. E. Goodson |
| Experimental Characterization of Copper-Encapsulant Interfacial Fracture Toughness for a Peripheral Array Package / Viswanathan Sundararaman |
| Residual Stress Near by the Interface of Thin CVD Diamond Film and Silicon Substrate / Masaki Sato |
| Accelerated Qualification of Surface Mount Interconnects--I |
| A Comparison of Interconnect Fatigue Damage Indicators / James H. Constable |
| Accelerated Qualification Testing of Connectors / Brian Beaman |
| Analysis of Correlation Between Accelerated Thermal Cycle Test and Power Cycle Test for a FC-PBGA Device / Alex Tam ; Leon Lopez |
| Effect of Curing-Induced Hydrostatic Stresses on Life of Underfilled Area-Array Solder Interconnects / K. Darbha ; J. H. Okura ; S. Shetty ; A. Dasgupta ; T. Reinikainen ; J. Zhu ; Jo. F. J. M. Caers |
| Effect of High Temperature Aging on Solder Joint Degradation in FCOB Assemblies |
| Thermal Cycling and Thermal Shock for FCOB Testing / Rakesh K. Agarwal ; Larry Tuchscherer ; Helen Cui ; Ritesh Jain ; Thomas Torri ; Scott Baxter |
| Effects of Temperature and Moisture on Flip-Chip Interface Adhesion / Fay Hua ; Zequn Mei ; Cheng-Han Chen |
| Application of Heat Pipes to Thermal Management of Electronics |
| Natural Convection Cooling for Pump Lasers in Telecommunication Applications / Boping Xie ; Z. Zack Yu |
| A Heat-Pipe System for Cooling a Desktop Computer / Masaru Oomi ; Toshirou Fukumoto ; Junji Sotani ; Jon S. Cox |
| Design and Testing of Metal and Silicon Heat Spreaders With Embedded Micromachined Heat Pipes / David A. Benson ; Charles V. Robino |
| Optical Investigation of Mini-Heat Pipe Arrays With Sharp Angled Triangular Grooves / M. Schneider ; M. Yoshida ; M. Groll |
| Module and System Level Benefits of High Flux Heat Pipe Heat Sinks / Dan Cromwell ; Scott D. Garner |
| Reliability Characterization of Copper/Water Heat Pipe Below 0[degree]C / Mirjana Vukovic ; John Watkins |
| Air Cooling II: Fundamentals and Applications |
| Packaging and Thermal Design of Dense Card-on-Board Electronics / Roger Schmidt ; Drew Horvath ; Dennis Barringer ; Steve Harris ; Randy Kemink ; Bill Maclachlan |
| Use of Flow Network Modeling (FNM) for the Design of Air-Cooled Servers / Robin Steinbrecher ; Amir Radmehr ; Kanchan M. Kelkar ; Suhas V. Patankar |
| Performance Characteristics of Confined Impinging Air Jets With Surface Enhancement / Luis A. Brignoni ; Suresh V. Garimella |
| Heatsink Design for High Power Aircraft Electronic Systems / Farhad Sarvar |
| Application of Fracture, Damage and Disturbance Models--III |
| On the Popcorning Mechanics of Plastic Packages / Sheng Liu ; Jiabin Dai |
| A Unified Constitutive Model Based on Disturbed State Concept and Multi-Domain Method for Design and Reliability in Electronic Packaging / R. Whitenack ; Jung-Chuan Lee |
| Gallium Arsenide/Gold Flip-Chip Connection Stress Fields / Bingzhi Su ; Paul E. W. Labossiere ; Martin L. Dunn |
| Time Domain Reflectometry as a Component Packaging Level Damage Detection Tool / Damion Thomas Searls ; Cliff Schuring ; Willie Hayashida ; Chew Hong Tan ; Rich Hardin |
| New Concept From the Standardization of Complex Eigensolutions for Wedges and Junctions / Shin-Way Lin ; Wei-Chung Wang |
| Thermal Cycling Reliability: Modeling and Measurement for PBGA Components / Jeff Riebling ; James M. Pitarresi ; Anthony Primavera |
| Accurate Prediction of Elastic Stress Concentrations Using a Coarse Tetra Mesh Finite Element Solution / Wilfred E. Desaulnier, Jr. ; Marc S. McCloud ; Judy Schwartz |
| Accelerated Qualification of Surface Mount Interconnects--II |
| Reliability Test Methodology Using Thermo-Mechanical Deflection / K. H. Ang |
| Analysis and Mitigation of Field Failures Caused by Copper Corrosion Migration Across Plastic Package Surfaces / Steven C. Anderson ; Joel A. Self ; Steve Mitchell |
| Comparison of Vibration Fatigue Damage in Surface Mount Interconnects for Repetitive Shock and Electro-Dynamic Excitation / P. Dujari ; J. Cho |
| Implementation of Unified Viscoplasticity With Damage Evolution and Its Application to Electronic Packaging / Zhengfang Qian |
| Heat Pipe Applications to Laptop Thermal Managements |
| An Oscillatory Mode With Extremely High Heat Transfer Rate in a Flexible Heat Pipe / Shaoning Lu ; Hsi-Shang Li |
| Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader / Koichiro Take ; Ralph L. Webb |
| High Performance Heat-Pipe Heat Sinks for Notebook PCs / Kenichi Namba ; Kenya Kawabata ; Jun Niekawa ; Yuichi Kimura |
| Optimization of Heat Pipe Wick Structures for Low Wattage Electronics Cooling Applications / Anurag Gupta ; Girish Upadhya |
| Education |
| Engineering of Complex Systems for Global Competitiveness / M. E. Franke |
| Using an Electromagnetic Simulation Tool for Demonstrations in a Course on Electronics Packaging / Harry Kroger ; Jiayuan Fang ; Yuzhe Chen |
| Internet Delivery of a Multidisciplinary Graduate Course in Electronics Packaging / James E. Morris ; Walter G. Piotrowski ; Peter Shea |
| Next Generation of Microelectronic Packaging Education in U.S.: A Perspective on Needs, Challenges and Status / Rao Tummala ; Leyla Conrad ; Gary May |
| Towards Undergraduate Education in Systems Hardware Technologies / Stuart Tewksbury ; Kiran Debabattini |
| Electronics Packaging Education: Schumpeterian Challenges and Responses |
| Development and Application of Thermal Cad |
| Thermal CAD Package for Multilayer Printed Circuit Boards Integrated With Two-Stack Cold Plate / Y. Y. Chen ; C. Y. Liu |
| A Genetically Optimized Electrothermal Parallel Algorithm / Boguslaw Butrylo ; Andrzej Jordan ; Adam Skorek |
| Driving PCA Thermal Analysis Using IDF 4.0 Data Exchange / Arnold Free ; Dave Kehmeier ; Dereje Agonafer |
| Thermal Transient Evaluation of Packages With the TTMK Toolkit / Vladimir Szekely ; Marta Rencz ; Bernard Courtois |
| Advanced Package Design Using TCAD Modeling Tools / H.-P. Lien |
| Author Index |
図書
